专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2012194207A Connector and electric substrate with connector 审中-公开
标题翻译：带连接器的连接器和电气基板
公开(公告)号：JP2012194207A
公开(公告)日：2012-10-11
申请号：JP2011055983
申请日：2011-03-14
申请人： Sumitomo Bakelite Co Ltd , 住友ベークライト株式会社
发明人： ARAI SHINYA
IPC分类号： G02B6/122 , G02B6/42
摘要： PROBLEM TO BE SOLVED: To provide a connector which has high versatility and is easy to use.SOLUTION: A connector 1 comprises: a connector housing 2 having a first insertion part 31 into which a strip-like optical waveguide 20 is inserted, and a second insertion part 32 into which flexible and linear electric wiring 704 is inserted; a terminal 501 mounted on the connector housing 2, and electrically connected with the electric wiring 704; and an optical element 50 for emitting light toward the optical waveguide 20 or receiving light which has passed through the optical waveguide 20.
摘要翻译：要解决的问题：提供具有高通用性和易于使用的连接器。连接器1包括：连接器壳体2，其具有插入带状光波导20的第一插入部31和插入柔性线性电线704的第二插入部32; 安装在连接器壳体2上并与电线704电连接的端子501; 以及用于向光波导20发射光或接收已经通过光波导20的光的光学元件50.版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2015049256A 光モジュール用部材、光モジュールおよび電子機器审中-公开
标题翻译：光学模块成员，光学模块和电子设备
公开(公告)号：JP2015049256A
公开(公告)日：2015-03-16
申请号：JP2013178580
申请日：2013-08-29
申请人：住友ベークライト株式会社 , Sumitomo Bakelite Co Ltd
发明人： MORI DAISUKE , ARAI SHINYA , KANEDA MIKIYA
IPC分类号： G02B6/42 , G02B6/122 , H01L31/0232 , H01S5/022
摘要：【課題】光モジュールの高集積化と光通信の高品質化との両立が図られた光モジュール、かかる光モジュールを容易に製造可能な光モジュール用部材、および前記光モジュールを備えた信頼性の高い電子機器を提供すること。【解決手段】光モジュール用部材100は、コア部14を備える光導波路1と、光導波路1に積層された光電変換基板2であって、絶縁性基板21と、その上に設けられ、光導波路1と光学的に接続されるよう光素子を搭載可能な光素子搭載部22と、絶縁性基板21上に設けられ、電気素子を搭載可能な電気素子搭載部23と、光素子搭載部22と電気素子搭載部23とを電気的に接続する電気配線(第1の電気配線)24と、電気素子搭載部23から引き出された電気配線(第2の電気配線)25と、を備える光電変換基板2と、を有し、光導波路1を含む平面について平面視されたとき、コア部14と電気配線25とが重ならないよう構成されている。【選択図】図5
摘要翻译：要解决的问题：提供一种实现光学模块的高集成度和高通信性的光学模块，并且提供一种便于制造上述光学模块的光学模块构件，以及包括该光学模块的电子设备，具有高可靠性。解决方案：光学模块构件100包括：具有芯14的光波导1; 以及层叠在光波导1上的光电转换基板2，该光电转换基板2包括绝缘基板21，设置在绝缘基板上并可安装光学连接到光波导1的光学元件的光学元件安装部22，配置在绝缘基板21上并且可以安装电气元件的电气元件安装部23，将光学元件安装部22和电气元件安装部23电连接的电布线（第一电气布线）24和电气线路（第二电气布线）25。光学模块构件被构造成在包括光波导管1的平面的俯视图中避免芯体14与电线路25的重叠。

3. 发明专利

JP2007207997A Circuit board 有权
标题翻译：电路板
公开(公告)号：JP2007207997A
公开(公告)日：2007-08-16
申请号：JP2006024944
申请日：2006-02-01
申请人： Sumitomo Bakelite Co Ltd , 住友ベークライト株式会社
发明人： ARAI SHINYA , OIKAWA AKIRA
IPC分类号： H05K1/02
摘要： PROBLEM TO BE SOLVED: To provide a circuit board for controlling characteristic impedance of a signal wiring with through-holes in mesh on a ground layer capable of suppressing fluctuation of the characteristics impedance at a connection part of the ground layer.
SOLUTION: Ground layers 1A and 1B in which multiple through-holes 1a and 1b are formed in mesh are partially overlapped, and the ground layers including the overlapped parts are provided with signal wiring through an insulator layer. First conductors 1c formed in stripe are formed by connecting to the first ground layer 1A at the overlapped part. Second conductors 1d formed in stripe in the direction across the first conductors are formed by connecting to the second ground layer 1B at the overlapped part.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种电路板，用于控制具有能够抑制接地层的连接部分处的特性阻抗的波动的接地层上的具有通孔的信号布线的特性阻抗。解决方案：其中形成有多个通孔1a和1b的接地层1A和1B部分地重叠，并且包括重叠部分的接地层通过绝缘体层设置有信号布线。通过在重叠部分处连接到第一接地层1A来形成条纹形成的第一导体1c。通过在重叠部分处连接到第二接地层1B来形成沿着穿过第一导体的方向条带形成的第二导体1d。版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2014026269A Photoelectric hybrid board and electronic apparatus 有权
标题翻译：光电混合板和电子设备
公开(公告)号：JP2014026269A
公开(公告)日：2014-02-06
申请号：JP2013125973
申请日：2013-06-14
申请人： Sumitomo Bakelite Co Ltd , 住友ベークライト株式会社
发明人： ARAI SHINYA
IPC分类号： G02B6/122 , G02B6/42
摘要： PROBLEM TO BE SOLVED: To provide a photoelectric hybrid board allowing optical wiring to be freely laid without being restricted by arrangement of electric elements and the like, and enabling high-density mounting of electric wiring and optical wiring, and provide an electronic apparatus including the photoelectric hybrid board.SOLUTION: A photoelectric hybrid board 1000 comprises: an optical module 100 including an optical waveguide 1, an optical connector provided at an end thereof, and a photoelectric conversion part 4 provided under the optical waveguide 1; and a mother board (an electric wiring board) 5 provided under the photoelectric conversion part 4. The optical waveguide 1 includes a core layer 13 provided with a plurality of core parts 14 intersecting with each other on the same plane and side face clad parts, and mirrors (optical path converters) 17 each for converting an optical path of the core part 14. The optical waveguide 1 is connected to the mother board 5 through an electric connector, and it is preferable that the optical waveguide 1 and the mother board 5 are detachable.
摘要翻译：要解决的问题：提供一种允许光布线自由铺设的光电混合板，而不受电气元件等的布置的限制，并且能够实现电气布线和光布线的高密度安装，并且提供一种电子设备，包括光电混合电路板。光电混合电路板1000包括：光学模块100，其包括光波导1，设置在其一端的光连接器和设置在光波导1下的光电转换部4; 以及设置在光电转换部4的下方的母板（电气布线板）5。光波导路1包括芯层13，芯层13具有在同一平面上相互交叉的多个芯部14和侧面包层部，以及用于转换芯部分14的光路的反射镜（光路转换器）17。光波导1通过电连接器连接到母板5，并且优选的是，光波导1和母板5 是可拆卸的

5. 发明专利

JP2014026268A Optical waveguide, optical wiring component, optical module, photoelectric hybrid board, and electronic apparatus 审中-公开
标题翻译：光波导，光接线组件，光模块，光电混合板和电子设备
公开(公告)号：JP2014026268A
公开(公告)日：2014-02-06
申请号：JP2013125972
申请日：2013-06-14
申请人： Sumitomo Bakelite Co Ltd , 住友ベークライト株式会社
发明人： ARAI SHINYA
IPC分类号： G02B6/122 , G02B6/42
摘要： PROBLEM TO BE SOLVED: To provide an optical wiring component, an optical module, a photoelectric hybrid board, and an electronic apparatus, each of which includes an optical waveguide enabling optical wiring to be freely formed while securing heat dissipation of electric elements provided on an electric wiring board when mounted on the electric wiring board so as to be stacked thereon, and high-density optical wiring.SOLUTION: A photoelectric hybrid board 1000 comprises: an optical module 100 including an optical waveguide 1, an optical connector provided at an end thereof, and a photoelectric conversion part 4 provided under the optical waveguide 1; and a mother board (an electric wiring board) 5 provided under the photoelectric conversion part 4. The optical waveguide 1 includes a core layer 13 provided with core parts 14 and side face clad parts, mirrors (optical path converters) 17 each for converting an optical path of the core part 14, and through-holes 19 configured to allow LSIs 501(electric elements 50) mounted on the mother board 5 to be inserted thereinto when stacked on the mother board 5.
摘要翻译：要解决的问题：提供一种光配线部件，光模块，光电混合电路板和电子设备，其中每个包括光波导，使得能够自由形成光布线，同时确保设置在电气布线板安装在电气布线板上以堆叠在其上，并且高密度光布线。解决方案：光电混合基板1000包括：光学模块100，包括光波导1，光连接器，其设置在端部以及设置在光波导1下方的光电转换部4。以及设置在光电转换部4的下方的母板（电气布线板）5。光波导路1包括芯层13，芯层13具有芯部14和侧面覆盖部，反射镜（光路转换器）17，芯部14的光路以及被配置为允许安装在母板5上的LSI 501（电气元件50）在堆叠在母板5上时插入其中的通孔19。

6. 发明专利

JP2011054919A a circuit board 有权
标题翻译：电路板
公开(公告)号：JP2011054919A
公开(公告)日：2011-03-17
申请号：JP2009234575
申请日：2009-10-08
申请人： Sumitomo Bakelite Co Ltd , 住友ベークライト株式会社
发明人： ARAI SHINYA , KURIBAYASHI HIROYUKI
IPC分类号： H05K3/46 , H01P3/02 , H05K1/02 , H05K9/00
CPC分类号： H05K1/0237 , H05K1/0224 , H05K1/0245 , H05K1/0253 , H05K1/0393 , H05K1/162 , H05K2201/0715 , H05K2201/09236 , H05K2201/0969
摘要： PROBLEM TO BE SOLVED: To provide a circuit board capable of sufficiently controlling characteristic impedance of a line without using a mesh-like conductor while securing line width of a signal transmission path. SOLUTION: By interposing an insulator layer 2, signal transmission paths 3a, 3b are formed on one surface thereof, and a ground layer 4 is formed on the other surface thereof. A shield layer 9 is laminated on the ground layer 4 via an insulator layer 8, and openings 4B on which a metal foil is not placed are formed in the ground layer 4 at positions along the signal transmission paths 3a, 3b. With this structure, the characteristic impedance of the signal transmission paths depends on a coupling capacitance formed between the signal transmission paths and the shield layer. Thus, a problem of characteristic impedance control of the signal transmission paths occurring with reduction in thickness of this circuit board can be easily solved. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够在确保信号传输路径的线宽的同时，不使用网状导体，能够充分地控制线的特性阻抗的电路板。解决方案：通过插入绝缘体层2，在其一个表面上形成信号传输路径3a，3b，并在其另一个表面上形成接地层4。屏蔽层9经由绝缘体层8层压在接地层4上，并且在沿着信号传输路径3a，3b的位置处，在接地层4中形成没有放置金属箔的开口4B。利用这种结构，信号传输路径的特征阻抗取决于形成在信号传输路径和屏蔽层之间的耦合电容。因此，可以容易地解决通过该电路板的厚度减小而发生的信号传输路径的特性阻抗控制的问题。版权所有（C）2011，JPO＆INPIT

7. 发明专利

JP2010109152A Multilayer wiring board and foldable electronic equipment 审中-公开
标题翻译：多层接线板和可折叠电子设备
公开(公告)号：JP2010109152A
公开(公告)日：2010-05-13
申请号：JP2008279734
申请日：2008-10-30
申请人： Sumitomo Bakelite Co Ltd , 住友ベークライト株式会社
发明人： ARAI SHINYA
IPC分类号： H05K1/14 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a multilayer wiring board having a structure that can be easily wound in a stable state. SOLUTION: The multilayer wiring board 10 includes a flexible wiring unit 20 composed of a plurality of belt shaped flexible wiring materials which are slidably laminated on one another, and a band member 21 for packing these flexible wiring materials into a bundle. The plurality of the flexible wiring materials are firmly fixed to each other at one end and the other end in the longitudinal direction. The inside face of the band member 21 is bonded only to the surface of the outermost layer of the one of the outermost layer of these flexible wiring materials. COPYRIGHT: (C)2010,JPO&INPIT

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式