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    • 4. 发明专利
    • refrigerator
    • JP5312399B2
    • 2013-10-09
    • JP2010118105
    • 2010-05-24
    • 三菱電機株式会社
    • 誠 岡部克正 坂本拓 関谷浩二 斉藤徳佳 原佑介 中西
    • F25D25/02
    • PROBLEM TO BE SOLVED: To provide a refrigerator having a rotating shelf device facilitated in the takeout of foods etc. in a back space by rotating operation, and improved in safety during operation. SOLUTION: The refrigerator includes: a storage compartment storing articles; door bodies opening and closing an opening of the storage compartment; pockets each formed at the door body and storing the articles; and the rotating shelf device. The rotating shelf device includes the following elements: (1) a pair of rails installed on right and left side walls in the storage compartment; (2) a support shelf provided slidably in the front/back direction on the pair of rails and having a shaft support hole approximately at the center; (3) a rotating tray where notches each having a circular arc shape around a rotating fulcrum are formed at four corners and a rotating tray shaft is formed approximately at the center; and (4) a fixation ring fixed to the rotating tray shaft and slidably fitted to the shaft support hole of the support shelf. At least part of the position in the height direction of the rotating tray is overlapped with a position in the height direction of the pocket. COPYRIGHT: (C)2012,JPO&INPIT
    • 6. 发明专利
    • refrigerator
    • JP5312398B2
    • 2013-10-09
    • JP2010118104
    • 2010-05-24
    • 三菱電機株式会社
    • 誠 岡部克正 坂本拓 関谷浩二 斉藤徳佳 原佑介 中西
    • F25D25/02F25D27/00
    • F25D25/027
    • PROBLEM TO BE SOLVED: To provide a refrigerator having a shelf mechanism facilitated in the takeout of foods etc. in a back space by rotating operation, minimized in an ineffective space, improved in appearance and removal and cleaning performance and improved in safety during operation. SOLUTION: The refrigerator includes a rotating shelf device having the following elements: (1) a pair of rails installed on right and left side walls in a storage compartment; (2) a support shelf provided slidably in the front/back direction on the pair of rails and having a shaft support hole approximately at the center; (3) a rotating tray where notches each having an arc shape around a rotating fulcrum are formed at four corners and a rotating tray shaft is formed approximately at the center; and (4) a fixation ring fixed to the rotating tray shaft and slidably fitted to the shaft support hole of the support shelf. The rotating tray shaft can be made to penetrate the shaft support hole of the support shelf only at a predetermined rotating angle and cannot be made to penetrate the shaft support hole of the support shelf at rotating angles other than a predetermined rotating angle. COPYRIGHT: (C)2012,JPO&INPIT
    • 8. 发明专利
    • Electronic circuit package and mounting board
    • 空值
    • JP3645136B2
    • 2005-05-11
    • JP28200099
    • 1999-10-01
    • 三菱電機株式会社
    • 勉 井上泰道 大北正人 小山浩二 斉藤剛 羽立高宏 長嶺
    • H05K3/34H01L21/60H01L23/12H05K1/18
    • H01L2224/14H01L2224/1403H01L2224/14051H01L2224/16106H01L2224/17517H01L2924/00012
    • PROBLEM TO BE SOLVED: To eliminate the need for reinforcing underifll by improving the mechanical strength of a package, a packaging board, and a packaging body where a packaging board connection terminal is connected to a ball grid array BGA structure. SOLUTION: A reinforcement bump having the same or larger sectional area than that of a signal bump is arranged at a corner part near a BGA square apex for improving packaging strength, a reinforcement pad with the same or large surface area than that of a packaging board signal pad is arranged at a corner part near the area array square apex for improving the strength of a packaging board, and the surface area or the arrangement position of the packaging board reinforcement bump are increased, as compared with the sectional area of the reinforcement bump, or is shifted and arranged to the corner side of the outer-periphery side as compared with the arrangement position, thus obtaining a BGA chip-size packaging body where stress tends not to be centered at an electrode junction part.
    • 要解决的问题:为了消除对包装板连接端子连接到球栅阵列BGA结构的封装,封装板和封装体的机械强度的提高来消除对加强底部加强的需要。 解决方案:具有与信号凸块相同或更大的截面面积的加强凸块布置在靠近BGA正方形顶点的拐角部分以提高包装强度,与包装板的表面积相同或更大的加强垫 信号垫布置在靠近区域阵列方形顶点的角部,以提高包装板的强度,并且与增强凸块的截面积相比,包装板加强凸块的表面积或布置位置增加 或者与布置位置相比被移位并布置到外周侧的角部侧,从而获得其中应力趋向于不在电极接合部位处于中心的BGA芯片尺寸的封装体。