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1. 发明专利

JP2017116272A 溶融塩浸透試験装置、および、溶融塩浸透試験方法审中-公开
公开(公告)号：JP2017116272A
公开(公告)日：2017-06-29
申请号：JP2015248507
申请日：2015-12-21
申请人：三菱重工業株式会社 , Mitsubishi Heavy Ind Ltd
发明人： KUDO DAISUKE , TORIGOE TAIJI , SHODA JUNICHIRO , TAKAHASHI KOJI , KAMIMURA YOSHIHISA , OKAJIMA YOSHIFUMI , OKAYA NAOTOSHI , ITO EISAKU , MEGA MASAHIKO , HORIE SHIGENARI , TANIGAWA HIDETSUGU , TSURU YASUHIKO , TSUKAGOSHI KEIZO , KUWABARA MASAMITSU , MITSUI HIROYUKI
IPC分类号： G01N17/00
CPC分类号： G01N17/00
摘要：【課題】装置の大型化を抑制しつつ、遮熱コーティングに対する溶融塩の浸透状態を正しく評価することが可能な溶融塩浸透試験装置、および、溶融塩浸透試験方法を提供する。【解決手段】溶融塩浸透試験装置20は、圧縮空気と燃料とを混合して燃焼させることで燃焼ガスを得る燃焼器21と、前記燃焼ガスに塩を供給する塩供給部30と、遮熱コーティングにより表面が被覆された試験片1を収容して支持する収容支持部23と、前記塩が供給された前記燃焼ガスを加速させて前記試験片に衝突させる加速器24と、を備える。【選択図】図2

2. 发明专利

JP2013168573A Process of manufacturing supersonic thickness sensor 审中-公开
标题翻译：制造超级厚度传感器的工艺
公开(公告)号：JP2013168573A
公开(公告)日：2013-08-29
申请号：JP2012031840
申请日：2012-02-16
申请人： Mitsubishi Heavy Ind Ltd , 三菱重工業株式会社
发明人： MORI KAZUTAKA , KUDO DAISUKE , KOBAYASHI TAKAAKI , YAMAMOTO YUKO , UEMOTO AKIHIRO , KAWANAMI SEIICHI
IPC分类号： H01L41/22 , G01B17/02 , G01N29/24 , H01L41/08 , H01L41/187 , H01L41/257 , H01L41/39 , H04R17/00 , H04R31/00
摘要： PROBLEM TO BE SOLVED: To significantly reduce cost of manufacturing a supersonic thickness sensor in a mass production scale by making it possible to collectively manufacture a number of supersonic thickness sensors which are capable of following, even when a surface to be measured is curved, and thin and exhibiting flexibility as a supersonic thickness sensor.SOLUTION: A number of segmented sinter raw material layers containing an oxide system piezoelectric material are segmented and formed at intervals on one plate surface of a metal thin plate that is to be a first electrode of a number of supersonic thickness sensors, the number of segmented sintered body layers are collectively formed at intervals on the metal thin plate by collectively heating and calcinating each of the segmented sinter raw material layers, a second electrode is formed on a surface of each of the segmented sintered body layers, a potential difference is provided between the other plate surface of the metal thin plate and surfaces of a number of the second electrodes, polarization treatment is performed for the segmented sintered body layer, the metal thin plate is cut in a thickness direction between adjacent segmented sintered body layers, and a number of supersonic sensors each having a single segmented sintered body layer are collectively and separately formed.
摘要翻译：要解决的问题：通过使得能够共同制造能够追随的多个超音速厚度传感器，即使当待测表面弯曲时，也可大量降低制造大规模生产规模的超音速厚度传感器的成本，并且薄且呈现柔性，作为超音速厚度传感器。解决方案：包含氧化物系压电材料的多个分段的烧结原料层在间隔地形成，并且在作为第一电极的金属薄板的一个板表面上形成超音速厚度传感器的数量，通过集中加热和煅烧每个分段的烧结原料层，在金属薄板上间隔地共同形成分段烧结体层的数量，在每个分段烧结原料层的表面上形成第二电极在金属薄片的另一个板表面之间设置电位差多个第二电极的板和表面，对分段烧结体层进行极化处理，在相邻的分段烧结体层之间沿厚度方向切割金属薄板，并且多个超音速传感器分别具有单个分段烧结体层共同且分开形成。

3. 发明专利

JP2013142582A Manufacturing method of supersonic thickness sensor 审中-公开
标题翻译：超声厚度传感器的制造方法
公开(公告)号：JP2013142582A
公开(公告)日：2013-07-22
申请号：JP2012002292
申请日：2012-01-10
申请人： Mitsubishi Heavy Ind Ltd , 三菱重工業株式会社
发明人： MORI KAZUTAKA , KUDO DAISUKE , KOBAYASHI TAKAAKI , YAMAMOTO YUKO , UEMOTO AKIHIRO , KAWANAMI SEIICHI
IPC分类号： G01B17/02 , H01L41/08 , H01L41/09 , H01L41/18 , H01L41/187 , H01L41/22 , H01L41/39
摘要： PROBLEM TO BE SOLVED: To provide a method capable of manufacturing a supersonic thickness measuring sensor featuring thinness and flexibility as a supersonic thickness sensor, capable of following the surface of a measuring object even if it is curved and being always stuck on the position of the measuring object, remarkably eliminating labor and time for thickness measurement, and also enabling simultaneous thickness measurement of a large number of spots and continuous thickness measurement to be performed.SOLUTION: Fine particles of an oxide-based piezo-electric material which serves as a raw material of a ceramic piezoelectric are deposited on the surface of a thin metal plate which serves as one electrode by an aerosol deposition method, a thin piezo-electric material layer which is relatively porous and can exhibit flexibility is formed on the thin metal plate, and thereafter, the other electrode is attached and polarization processing is performed, thus enabling the entire sensor to exhibit flexibility.
摘要翻译：要解决的问题：提供一种能够制造具有薄型和柔性的超音速厚度测量传感器作为超音速厚度传感器的方法，其能够跟随测量对象的表面，即使它是弯曲的并且始终粘在测量对象的位置上测量对象，显着地消除了厚度测量的劳动和时间，并且还能够进行大量斑点和连续厚度测量的同时厚度测量。解决方案：用作原料的氧化物基压电材料的细颗粒陶瓷压电体的材料通过气溶胶沉积法沉积在用作一个电极的薄金属板的表面上，在薄金属板上形成相对多孔且能显示柔性的薄压电材料层，此后，安装另一个电极并执行偏振处理，从而使整个感觉 r表现出灵活性。

4. 发明专利

JP2014160033A Method for forming artificial defect of heat shielding layer 有权
标题翻译：形成热屏蔽层人为缺陷的方法
公开(公告)号：JP2014160033A
公开(公告)日：2014-09-04
申请号：JP2013031302
申请日：2013-02-20
申请人： Mitsubishi Heavy Ind Ltd , 三菱重工業株式会社
发明人： KUDO DAISUKE , TORIGOE TAIJI , KAMIMURA YOSHIHISA , OKAYA NAOTOSHI
IPC分类号： G01N1/28 , G01N1/00 , G01N19/00
摘要： PROBLEM TO BE SOLVED: To provide a method for forming artificial defects of a heat shielding layer, capable of easily forming a test piece having defects in a topcoat layer.SOLUTION: A method for forming artificial defects of a heat shielding layer comprises: sequentially forming an undercoat layer 12 and a topcoat layer 13 on the surface of a base metal 11; contacting a pressing member 2 to the surface of the topcoat layer 13; and forming cracks 3 in the topcoat layer 13 by applying force through the pressing member 2.
摘要翻译：要解决的问题：提供一种形成热屏蔽层的人造缺陷的方法，能够容易地形成在顶涂层中具有缺陷的测试片。解决方案：一种形成热屏蔽层的人造缺陷的方法包括：顺序形成贱金属11表面上的底涂层12和顶涂层13; 将按压构件2接触到顶涂层13的表面; 并通过施加力通过按压构件2在顶涂层13中形成裂纹3。

5. 发明专利

JP2013157479A Manufacturing method of supersonic thickness sensor 审中-公开
标题翻译：超声厚度传感器的制造方法
公开(公告)号：JP2013157479A
公开(公告)日：2013-08-15
申请号：JP2012017247
申请日：2012-01-30
申请人： Mitsubishi Heavy Ind Ltd , 三菱重工業株式会社
发明人： MORI KAZUTAKA , KUDO DAISUKE , YAMAMOTO YUKO , UEMOTO AKIHIRO , KAWANAMI SEIICHI
IPC分类号： H01L41/22 , G01B17/02 , H01L41/08 , H01L41/187 , H01L41/257 , H01L41/39
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a supersonic thickness measuring sensor which is thin and has flexibility as a supersonic thickness sensor, can follow a measurement object surface even if the measurement object surface is curved, enables being always be pasted to a measurement object place, eliminates various work after measuring thickness, greatly reduces time and laber for measuring thickness, and can simultaneously measure the thickness of a large number of places or continuously measure thickness.SOLUTION: Powders of an oxide-based piezoelectric material which is a raw material of a ceramic piezoelectric body are mixed with a low-melting point glass forming material including glass forming oxide to prepare a paste-like sintering raw material. The paste of the mixture is applied on a surface of a thin metallic plate which should be one electrode, heated, and sintered to form a thin sintering layer which is comparatively porous and can indicate flexibility, on the metallic thin plate surface. Then, the installation of the other electrode and polarization are carried out, and flexibility can be indicated as a whole of the sensor.
摘要翻译：要解决的问题：为了提供一种薄且具有作为超音速厚度传感器的柔性的超音速厚度测量传感器的方法，即使测量对象表面是弯曲的，也可以跟随测量对象表面，能够总是粘贴到测量对象位置，测量厚度后消除各种工作，大大减少测量厚度的时间和尺寸，可同时测量大量位置或连续测量厚度。解决方案：氧化物基压电材料的粉末为将陶瓷压电体的原料与包含玻璃形成氧化物的低熔点玻璃形成材料混合以制备糊状烧结原料。将混合物的糊料涂覆在薄金属板的表面上，该金属板应该是一个电极，被加热和烧结以形成在金属薄板表面上相当多孔并且可以指示柔性的薄的烧结层。然后，进行其他电极的安装和极化，并且可以将传感器的整体表示为柔性。

6. 发明专利

JP2013117480A Temperature estimation method for structural member and maintenance method for structural member 有权
标题翻译：结构构件的温度估计方法和结构构件的维护方法
公开(公告)号：JP2013117480A
公开(公告)日：2013-06-13
申请号：JP2011265863
申请日：2011-12-05
申请人： Mitsubishi Heavy Ind Ltd , 三菱重工業株式会社
发明人： TORIGOE TAIJI , OKADA IKUO , KANEKO HIDEAKI , TANEIKE MASAKI , MORIYA KEIICHI , KUDO DAISUKE , KARATO TAKANORI , TOMITA YASUOKI
IPC分类号： G01K11/00
摘要： PROBLEM TO BE SOLVED: To provide the temperature estimation method of a structural member capable of estimating the temperature of a structural member composed of Ni-based heat resistant alloy starting with the moving blade of a gas turbine across a wide temperature range and the maintenance method of the structural member using the temperature estimation method.SOLUTION: Disclosed is a temperature estimation method for estimating the temperature of a structural member composed of Ni-based heat resistant alloy including: determining an index indicating a relation between the thickness of a degenerated layer formed on the surface layer of the structural member whose γ' phase has been lost and temperature/time; measuring the thickness of the degenerated layer in the structural member; associating the measurement value with the index; and calculating the temperature of the structural member.
摘要翻译：要解决的问题：提供一种结构构件的温度估计方法，该结构构件能够在宽温度范围内从燃气轮机的动叶片开始，估计由Ni基耐热合金构成的结构件的温度，使用温度估计方法对结构件的维护方法。解决方案：公开了一种用于估计由Ni基耐热合金构成的结构件的温度的温度估计方法，包括：确定表示在表面层上形成的退化层的厚度与结构 γ'相失去的成员和温度/时间; 测量结构构件中的退化层的厚度; 将测量值与索引相关联; 并计算结构件的温度。版权所有（C）2013，JPO＆INPIT

7. 发明专利

JPH11218414A SHAPE RECOGNIZING EQUIPMENT 失效
公开(公告)号：JPH11218414A
公开(公告)日：1999-08-10
申请号：JP2248498
申请日：1998-02-04
申请人： UNIV WASEDA , MITSUBISHI HEAVY IND LTD
发明人： MIWA NORIYUKI , KUDO DAISUKE , NAKAGAWA MASAYA
IPC分类号： G01B11/24 , G01B11/245
摘要： PROBLEM TO BE SOLVED: To provide a shape recognizing equipment at a low cost which can recognize the shape or the like of a relatively moving object without influence of external disturbance. SOLUTION: A slide table 4 is installed slidably on a slide rail 3. A stepping motor 5 is connected with the slide table 4. A pair of retaining panels 6, 7 are installed upright on the slide table 4. A plurality of fixing holes 6a are formed in the retaining panels 6, 7, in such a manner that the holes do not overlap with each other in the slide movement direction but are shifted in order at specified intervals. Light emitting diodes are attached in the holes 6a of the retaining panel 6. Photo IC's are attached in the holes of the retaining panel 7. The stepping motor 5, the light emitting diodes, and the photo IC's are connected with a control equipment 12 with which a display 13 is connected. While an object is made to pass at a constant speed between the light emitting diodes and the photo IC's, shape recognition is performed on the basis of light emission and light detection of the light emitting diodes and the photo IC's which face each other and make pairs.

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