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1. 发明专利

JP2012194552A Photosensitive resin composition, and photoresist film, formation method of resist pattern and formation method of conductor pattern using the photosensitive resin composition 有权
标题翻译：光敏树脂组合物，光电薄膜，耐蚀图案的形成方法和使用感光树脂组合物的导体图案的形成方法
公开(公告)号：JP2012194552A
公开(公告)日：2012-10-11
申请号：JP2012042872
申请日：2012-02-29
申请人： Nichigo Morton Co Ltd , ニチゴー・モートン株式会社
发明人： TOYODA DAIKI
IPC分类号： G03F7/027 , C08F2/44 , C08F2/50 , C08F265/00 , G03F7/004 , H05K3/06 , H05K3/18
CPC分类号： H05K3/064 , G03F7/027 , G03F7/085 , H05K1/0346
摘要： PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which has good resolution and adhesion, ensures a very small trail of a cured resist after development, and also has good detachability; and a photoresist film including a photosensitive resin composition layer composed of the photosensitive resin composition and a support layer.SOLUTION: Provided is a photosensitive resin composition containing (A) binder polymer, (B) photopolymerizable monomer having an amino group, (C) photopolymerization initiator, and (D) benzotriazole derivative having a carboxyl group. Also provided is a photoresist film including a photosensitive resin composition layer composed of the photosensitive resin composition and a support layer.
摘要翻译：解决问题的方案为了提供具有良好的分辨率和粘附性的感光性树脂组合物，确保显影后的固化抗蚀剂的痕迹很小，并且还具有良好的分离性; 以及包含由感光性树脂组合物和支撑层构成的感光性树脂组合物层的光致抗蚀剂膜。解决方案：提供含有（A）粘合剂聚合物，（B）具有氨基的光聚合性单体，（C）光聚合引发剂和（D）具有羧基的苯并三唑衍生物的感光性树脂组合物。还提供了包括由感光性树脂组合物和支撑层构成的感光性树脂组合物层的光致抗蚀剂膜。版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2010020264A Solder resist film, resist pattern forming method and luminescent device 有权
标题翻译：耐蚀膜，电阻图案形成方法和发光器件
公开(公告)号：JP2010020264A
公开(公告)日：2010-01-28
申请号：JP2008204073
申请日：2008-08-07
申请人： Nichigo Morton Co Ltd , ニチゴー・モートン株式会社
发明人： MURAKAMI SHIGERU , SUZUKI TERUMI
IPC分类号： G03F7/004 , G03F7/029 , G03F7/033 , G03F7/38 , G03F7/40 , H05K3/28
摘要： PROBLEM TO BE SOLVED: To enhance the reflectance of a light emitting diode to that of a resist film formed from a solder resist ink or more, and to provide a solder resist film excellent in surface flatness, resist curability and developability. SOLUTION: The solder resist film includes a resist layer whose spectral reflectances measured at intervals of 10 nm in the wavelength range of 430-700 nm are ≥65% each in measurement in a colorimeter reflection mode after processing of the following (1): (1) an FR-4 copper clad laminate of 1.6 mm thickness with copper foil of 35 μm thickness on the whole surface is surface-conditioned once with buff polishing #600 and once with buff polishing #1,000, and the solder resist film is laminated with a vacuum laminator. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提高发光二极管与由阻焊油墨等形成的抗蚀剂膜的反射率，并且提供表面平坦性，抗蚀剂固化性和显影性优异的阻焊膜。解决方案：阻焊膜包括抗蚀剂层，其在430-700nm的波长范围内以10nm的间隔测量的光谱反射率在以下处理之后在色度计反射模式下测量为≥65％（1 ）：（1）在整个表面上使用厚度为1.6mm的厚度为35μm的铜箔的FR-4覆铜层压板用抛光抛光＃600进行表面处理，并用抛光抛光＃1000进行一次表面处理，并将阻焊膜与真空层压机层压。版权所有（C）2010，JPO＆INPIT

3. 发明专利

JP2009166487A Flat pressing machine, laminating apparatus and laminating method using them 审中-公开
标题翻译：平压机，层压装置和使用它们的层压方法
公开(公告)号：JP2009166487A
公开(公告)日：2009-07-30
申请号：JP2008316067
申请日：2008-12-11
申请人： Nichigo Morton Co Ltd , ニチゴー・モートン株式会社
发明人： YASUMOTO RYOICHI , IWATA KAZUTOSHI
IPC分类号： B29C43/56 , B29C43/28 , B29C43/34 , B29C43/36 , B29L9/00 , H05K3/00
CPC分类号： B29C43/021 , B29C43/18 , B29C43/184 , B29C43/56 , B29C2043/3416 , B29C2043/3652 , B29C2043/3655 , B29C2043/5076 , B29C2043/561 , B29C2043/5808 , H05K3/4611
摘要： PROBLEM TO BE SOLVED: To provide a flat pressing machine, by which a laminated body can be smoothened, irrespective of unevenness of a base material, cost of a strip-like film for transfer is reduced, a laminated resin is adhered to the strip-like film and does not scatter at the time of peeling the laminated body, and furthermore, a rough surface of the strip-like film is not transferred to the laminated body, and to provide a laminating apparatus, and a laminating method using them. SOLUTION: The flat pressing machine (3) presses a laminated body, in which a resin layer (8d) is formed on an uneven surface of a base material (8a), by using facing pressing means, and smoothens a surface of the laminated body. The flat pressing machine includes: a pair of strip-like films; a transfer means for transferring the both strip-like films in the longitudinal direction of the film, in a state where the laminated body is sandwiched between the both strip-like films; a hermetically sealed space forming means (30) which forms a hermetically sealed space section (34) for pressing the laminated body by both pressing means (12, 13) in a depressurized state; and a pressure control means for controlling inside the hermetically sealed space section (34) in the depressurized state. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种平面压制机，通过该平压机，层压体可以平滑化，与基材的不均匀性相比，传递带状膜的成本降低，层压树脂被粘附到带状膜，并且在剥离层叠体时不散射，此外，带状膜的粗糙表面不转印到层叠体，并且提供层压装置和使用他们。解决方案：平压机（3）通过使用面对的按压装置将基体材料（8a）的不平坦表面上形成树脂层（8d）的层叠体压平，并使层压体。平压机包括：一对带状膜; 用于在层叠体夹在两个带状膜之间的状态下，在膜的长度方向上转印两个带状膜的转印装置; 密封空间形成装置（30），其形成用于通过两个按压装置（12,13）处于减压状态来挤压层压体的气密密封空间部分（34）以及用于在所述减压状态下控制所述气密密封空间部（34）内的压力控制单元。版权所有（C）2009，JPO＆INPIT

4. 发明专利

JP2007003740A Photosensitive resin composition and photoresist film using same 审中-公开
标题翻译：光敏树脂组合物和使用相同的光电胶片
公开(公告)号：JP2007003740A
公开(公告)日：2007-01-11
申请号：JP2005182747
申请日：2005-06-23
申请人： Nichigo Morton Co Ltd , Nippon Synthetic Chem Ind Co Ltd:The , ニチゴー・モートン株式会社 , 日本合成化学工業株式会社
发明人： HAMADA YASUHIRO , YAMAMOTO HISATOSHI , SATO HIROAKI , TSUJIMOTO ATSUSHI
IPC分类号： G03F7/004 , C08F290/06 , G03F7/027 , G03F7/033 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To provide a photoresist film having high sensitivity, high resolution, adhesion stability, plating resistance and peeling stability even under low exposure conditions by blue-violet laser exposure. SOLUTION: A photosensitive resin composition of the invention used in exposure with a laser exposure machine having an exposure wavelength of 390-420 nm contains a carboxyl group-containing polymer (A) obtained by copolymerizing a vinyl group-containing monomer in an amount of 15-40 wt.% based on the total amount of copolymerized components, an ethylenically unsaturated compound (B), a photopolymerization initiator (C) and a compound (D1) represented by formula (I) or a compound (D2) represented by formula (II). In the formula (I), R1 and R2 each independently denote a 1-10C alkyl, a 6-20C aryl, a 6-20C alkyl substituted aryl, a 6-20C aryloxy substituted aryl or a 6-20C alkoxy substituted aryl; R7 and R8 each independently denote a 1-10C alkyl, a 6-20C aryl, a 1-10C alkoxy or a 6-20C aryloxy; and X denotes a divalent organic group having an aromatic ring. In the formula (II), R1, R2, R7, R8 and X have the same meanings as the above. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：即使在低曝光条件下通过蓝紫激光曝光来提供具有高灵敏度，高分辨率，粘附稳定性，电镀电阻和剥离稳定性的光致抗蚀剂膜。解决方案：用曝光波长为390-420nm的激光曝光机曝光的本发明的感光性树脂组合物含有含有乙烯基的单体在相对于共聚成分的总量，烯键式不饱和化合物（B），光聚合引发剂（C）和式（I）表示的化合物（D1）或化合物（D2）表示的量为15〜40重量％由式（II）表示。在式（I）中，R 1和R 2各自独立地表示1-10C的烷基，6-20的芳基，6-20的烷基取代的芳基，6-20的芳氧基取代的芳基或6-20的烷氧基取代的芳基; R7和R8各自独立地表示1-10C烷基，6-20C芳基，1-10C烷氧基或6-20C芳氧基; X表示具有芳环的二价有机基团。在式（II）中，R 1，R 2，R 7，R 8和X具有与上述相同的含义。版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2004184714A Photosensitive resin composition and dry film using the same 有权
公开(公告)号：JP2004184714A
公开(公告)日：2004-07-02
申请号：JP2002351953
申请日：2002-12-04
申请人： Nichigo Morton Co Ltd , ニチゴー・モートン株式会社
发明人： TAKAMIYA HIROYUKI , MURAKAMI SHIGERU , YAMAMOTO HISATOSHI , HIUGA ATSUYOSHI
IPC分类号： G03F7/004 , G03F7/26
摘要： PROBLEM TO BE SOLVED: To provide a photosensitive resin composition useful as a resist for etching or pattern plating in the manufacture of a printed wiring board excellent in resolution, adhesion property of thin lines, stripping property and flexibility or in the precision processing of metal, and to provide a dry film using the composition.
SOLUTION: The photosensitive resin composition has 75 to 105 mgKOH/g acid value. The composition is formed into a layer of 35 to 60 μm thickness and hardened by exposing both surfaces of the photosensitive resin composition layer with the exposure light quantity corresponding to the 7-th step in the Stauffer ST-21 step tablet. When the hardened resist is immersed in a 1 wt.% sodium carbonate aqueous solution at 21°C, the resist shows ≤120% initial swelling rate for 30 minutes of immersion, 150 to 200% final swelling rate and ≤130 minutes of immersion period to reach the final swelling rate. The dry film is produced by using the above photosensitive resin composition.
COPYRIGHT: (C)2004,JPO&NCIPI

6. 发明专利

JP2003291168A Lamination method 有权
标题翻译：层压法
公开(公告)号：JP2003291168A
公开(公告)日：2003-10-14
申请号：JP2002104680
申请日：2002-04-08
申请人： Nichigo Morton Co Ltd , ニチゴー・モートン株式会社
发明人： IWATA KAZUTOSHI , YASUMOTO RYOICHI , TAKAOCHI NAOKI
IPC分类号： B29C43/56 , B29C43/18 , B29C43/32 , B29L31/34 , B32B37/00
摘要： PROBLEM TO BE SOLVED: To provide a lamination method for obtaining a laminate which is good in followability of a film-shaped resin layer even when lamination is repeated for a long period, excellent in film thickness uniformity and specular properties after lamination when the resin layer is laminated on an uneven substrate, and useful for a built-up process. SOLUTION: In the lamination method, the use of a vacuum lamination apparatus 6 has a vacuum chamber fitted with an upper plate 1 fitted with a flexible sheet 3, and a lower plate 2 fitted with a flexible sheet 4 between the upper and the lower plats in the chamber, after the laminate 5 comprising the uneven substrate 5a and the film-shaped resin layer 5b is press-fastened. The laminate 5 is heated and pressed by a plane press 9 having upper and lower press blocks 7 and 8 for lamination. The upper and lower press blocks 7 and 8 are used, in which a cushioning material 10 and a flexible metal plate 11 are mounted in turn on at least one surface so that the metal plate is arranged on the laminate 5 side. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：为了提供即使长时间重复层压也能获得膜状树脂层的随动性好的层叠体的层压方法，膜厚均匀性优异，层压后的镜面性能优异树脂层层压在不平坦的基板上，对于建立的方法是有用的。解决方案：在层压方法中，使用真空层压装置6具有装有安装有柔性片3的上板1的真空室，以及装配有柔性片4的下板2，该柔性片4在上和在包括不平坦基板5a和薄膜状树脂层5b的层压板5之后，室内的下层被压紧。层压板5被具有上下压块7和8的平面压板9加热和压制以进行层压。使用上下压块7和8，其中缓冲材料10和柔性金属板11依次安装在至少一个表面上，使得金属板布置在层压体5一侧。版权所有（C）2004，JPO

7. 发明专利

JP2003076015A Photosensitive resin composition and dry film using the same 审中-公开
标题翻译：使用相同的感光性树脂组合物和干膜
公开(公告)号：JP2003076015A
公开(公告)日：2003-03-14
申请号：JP2001272159
申请日：2001-09-07
申请人： Nichigo Morton Co Ltd , ニチゴー・モートン株式会社
发明人： TAKAMIYA HIROYUKI , HIUGA ATSUYOSHI , NAKAHARA KOICHIRO
IPC分类号： G03F7/038 , C08F2/44 , C08F2/50 , C08F290/12 , C08L33/04 , G03F7/004 , G03F7/027 , G03F7/031 , G03F7/033 , G03F7/11
CPC分类号： G03F7/031 , G03F7/033
摘要： PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in sensitivity, resolving power, adhesion of thin lines, flexibility as a resist, developing solution resistance, plating property and removability as a resist and to provide a dry film using the composition.
SOLUTION: The photosensitive resin composition comprises (a) an unsaturated group-free carboxyl-containing polymer, (b) a functional polymer obtained by reacting a specified compound with a carboxyl-containing polymer and having 0.3-3.5 mmol/g unsaturated groups, (c) an ethylenically unsaturated compound and (d) a photopolymerization initiator, and the dry film is obtained by using the composition.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：提供灵敏度，分辨率，细线粘附性，作为抗蚀剂的柔韧性，显影剂溶液性，电镀性和作为抗蚀剂的可除去性优异的感光性树脂组合物，并提供使用该组合物的干膜。解决方案：感光性树脂组合物包含（a）不含不饱和基团的含羧基聚合物，（b）通过使特定化合物与含羧基聚合物反应而得到的官能聚合物，并且具有0.3-3.5mmol / g不饱和基团（ c）烯属不饱和化合物和（d）光聚合引发剂，通过使用该组合物获得干膜。

8. 发明专利

JP2002287347A PHOTOSENSITIVE RESIN COMPOSITION 失效
公开(公告)号：JP2002287347A
公开(公告)日：2002-10-03
申请号：JP2001087136
申请日：2001-03-26
申请人： NICHIGO MORTON CO LTD
发明人： HIUGA ATSUYOSHI , TAKAMIYA HIROYUKI
IPC分类号： G03F7/027 , C08F2/44 , C08F2/50 , C08F291/00 , G03F7/004 , G03F7/031 , G03F7/033 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in tent film strength and deformed through hole reliability without impairing sensitivity, resolution, adhesion to a substrate, resist removability, etc. SOLUTION: The photosensitive resin composition contains a binder resin (A), an ethylenically unsaturated compound (B) and a photopolymerization initiator (C), and the component (B) contains an acrylic compound having urethane bonds represented by formula (1) (where R is H or a 1-3C alkyl; R1 and R2 are each a 2-5C alkylene; X is a 2-20C divalent hydrocarbon, the symbols X are different or identical; Y is a divalent group obtained by removing H atoms from both OH groups of bisphenol; m, m', n and n' are each an integer of 0-30; and l and l' are each an integer of 1-10).

9. 发明专利

JP2002023359A PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE ELEMENT USING THE SAME 失效
公开(公告)号：JP2002023359A
公开(公告)日：2002-01-23
申请号：JP2000204480
申请日：2000-07-06
申请人： NICHIGO MORTON CO LTD
发明人： HIUGA ATSUYOSHI , MURAKAMI SHIGERU , HAMADA YASUHIRO
IPC分类号： G03F7/027 , C08F2/44 , C08F2/50 , C08F265/00 , C08F290/06 , G03F7/004 , G03F7/029 , G03F7/031 , G03F7/033 , H05K3/06 , H05K3/18
摘要： PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having high sensitivity even under low light exposure and excellent in adhesion and tent film strength and a photosensitive element using the composition. SOLUTION: The photosensitive resin composition contains a binder component (A), an ethylenically unsaturated compound (B) and a photopolymerization initiator (C). The component (B) includes an ethylenically unsaturated compound having a urethane bond and 2.0-6.0 pts.wt. lophin dimer, 0.05-0.5 pt.wt. acridine derivative, 0.05-0.5 pt.wt. N-arylglycine and 0.01-0.5 pt.wt. alkylaminobenzophenone, based on 100 pts.wt., in total, of the components (A) and (B) are contained as the component (C).

10. 发明专利

JP2001343759A PEELING LIQUID FOR CURED FILM OF PHOTOPOLYMERIZABLE COMPOSITION 失效
公开(公告)号：JP2001343759A
公开(公告)日：2001-12-14
申请号：JP2000161655
申请日：2000-05-31
申请人： NICHIGO MORTON CO LTD
发明人： KOSAKA EIJI , SUZUKI TERUMI
IPC分类号： G03F7/42 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To provide a peeling liquid for peeling off a cured film of a photopolymerizable composition formed on a substrate, particularly a tinned substrate through irradiation with light from the substrate. SOLUTION: The peeling liquid, used in removing a cured film obtained by applying or laminating a photopolymerizable composition developable with an aqueous alkali solution on a substrate and curing the composition with active light from the substrate, has a composition containing (a) 85-94 pts.wt. water, (b) 1-10 pts.wt. water-soluble alkanolamine, (c) 0.1-5 pts.wt. quaternary ammonium hydroxide and 0.001-0.02 pt.wt. metal ions capable of oxidizing a divalent tin ion to a tetravalent tin ions.

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