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1. 发明专利

JP2001192013A TRAY 失效
公开(公告)号：JP2001192013A
公开(公告)日：2001-07-17
申请号：JP2000001202
申请日：2000-01-07
申请人： HITACHI LTD , AKITA ELECTRONICS CO LTD
发明人： SATO FUMITAKA
IPC分类号： B65D1/34
摘要： PROBLEM TO BE SOLVED: To provide a tray with high efficiency for storage of taper carrier packaged(TCP) type semiconductor devices wherein an electrical characteristics test can be performed without damaging leads. SOLUTION: The tray serves as a tray for receiving a tape carrier package type semiconductor device including an insulating tape having a conductive lead pattern on a surface and also having a plurality of guide holes, a semiconductor chip fixed to the tape, a means for electrically connecting a predetermined lead provided on the tape with a predetermined electrode of the semiconductor chip and an insulating resin body covering a part including the semiconductor chip, and it also serves as a tray for testing electrical characteristics. The tray has a plurality of guide pins which are inserted into at least some of the guide holes respectively whereby the semiconductor device can be fixed to the tray and a support section for supporting a part of the tape which supports close a part of the lead with which a measurement terminal for testing the electrical characteristics is brought into contact.

2. 发明专利

JP2001068501A MANUFACTURE OF WIRE BONDING APPARATUS AND SEMICONDUCTOR DEVICE 失效
公开(公告)号：JP2001068501A
公开(公告)日：2001-03-16
申请号：JP24102399
申请日：1999-08-27
申请人： HITACHI LTD , AKITA ELECTRONICS CO LTD
发明人： SHIBATA TORU
IPC分类号： H01L21/60 , H01L21/607 , H01L23/28
摘要： PROBLEM TO BE SOLVED: To perform satisfactory wire bonding by reducing feeding abnormality of a wire. SOLUTION: In a wire bonding technique, in which an electrode pad of a semiconductor chip mounted on a lead frame and a lead are connected by a conductive wire 14, a vibration applying means 24 is provided in the vicinity of the wire feeding portion of a wire spool 21 around which a wire 14 is wound, and vibrations are applied to the wire 14 fed from the wire spool 21 by the vibration applying means device 24. The wire fed from the wire spool 21 is supplied to a capillary by the action of wire tension and is utilized to connect the electrode pad and the lead of the semiconductor chip. Accordingly, clinging of wound wires around the wire spool 21 is unfastened satisfactorily, and the wires can be supplied stably. Consequently, a feeding abnormality of a wire and the bending of the wire 14 resulting from it are decreased and the quality and a yield of a semiconductor device are improved. Furthermore, the working ratio of the semiconductor device can be improved.

3. 发明专利

JP2001203336A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JP2001203336A
公开(公告)日：2001-07-27
申请号：JP2000009118
申请日：2000-01-18
申请人： HITACHI LTD , AKITA ELECTRONICS CO LTD
发明人： KAWAKAMI MAKOTO
IPC分类号： G11C11/404 , G11C11/401 , G11C29/00 , G11C29/06 , H01L21/8242 , H01L27/108
摘要： PROBLEM TO BE SOLVED: To detect a defect such as a short circuit between adjacent capacitive elements C for storing information by using a simple selective high-potential circuit. SOLUTION: A semiconductor device comprises a plurality of word lines disposed in parallel along the row direction, a plurality of bit lines disposed perpendicularly to the word lines along the column direction, and a memory cell array including memory cells deposed on the intersections of the word lines and the bit lines, The memory cell is composed of a crown-shaped capacitive element for storing information and an MISFET for selecting a memory cell that is connected in series with the capacity element for storing information. An external application circuit is provided which is connected with the bit line, collectively select the memory cells in every other column and sets the cells at a high potential, and sets the memory cells on the adjacent column to a low potential.

4. 发明专利

JP2001141429A BASE LENGTH MOVABLE-TYPE SURFACE PROFILE MEASURING DEVICE 失效
公开(公告)号：JP2001141429A
公开(公告)日：2001-05-25
申请号：JP32817699
申请日：1999-11-18
申请人： JAPAN ATOMIC ENERGY RES INST , LIGHT STEP KK , AKITA ELECTRONICS CO LTD
发明人： OKA KIYOSHI , OBARA KENJIRO , TADA EISUKE , TAKAHASHI SATORU , TAMURA MASAFUMI
IPC分类号： G01B11/00 , G01B11/24 , G01C3/06 , G01S7/481 , G01S17/89 , G02B7/32
摘要： PROBLEM TO BE SOLVED: To provide a device for measuring the surface profile of an object in extreme environments of high temperature, high radiation, etc. SOLUTION: In this surface profile measuring device, a triangulation system to measure the distance from a sensor head provided with a light projecting optical system and an observation optical system to an object to be measured is used. The light projecting optical system comprises a drive mechanism to adjust the location of laser projection i.e., a base length and uses a system to compute the distance to the object by measuring a base length at the time when a point of image formation comes to the center of an observation plane of a lamer spot beam projected downward to the object from the location of light projection. The measuring device further comprises a mechanism to move the sensor head horizontally and vertically in a circle with the location of light projection as its center. By two-dimensionally scanning points of measurement on the object with a laser beam by the horizontal and vertical movements of the sensor head, the surface profile of the object to be measured is measured.

5. 发明专利

JP2001043677A SEMICONDUCTOR MEMORY 失效
公开(公告)号：JP2001043677A
公开(公告)日：2001-02-16
申请号：JP21943199
申请日：1999-08-03
申请人： HITACHI LTD , AKITA ELECTRONICS CO LTD
发明人： YONO TERU , KIKUCHI KOJI , KONO CHIKASHI
IPC分类号： G11C11/406 , G11C11/403
摘要： PROBLEM TO BE SOLVED: To reduce power consumption of the whole chip and to reduce fluctuation of power consumption in ships by performing refreshing with optimum period for each memory block, each memory mat, or each memory chip, in a DRAM in which a memory array is composed of plural blocks or memory mats or a memory module in which plural memory chips are incorporated. SOLUTION: This device is composed of a refreshing period setting circuit 35, a timer 33, and an address counter 34 corresponding to each of plural blocks or memory mats 10A, 10B, 10C,... so that refresh control can be performed with different periods for each block or memory mat. And refreshing is performed by setting optimum refreshing period to a refreshing period setting circuit for each block or memory mat.

6. 发明专利

JP2001035197A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JP2001035197A
公开(公告)日：2001-02-09
申请号：JP20115999
申请日：1999-07-15
申请人： HITACHI LTD , AKITA ELECTRONICS CO LTD
发明人： KAWAKAMI MAKOTO
IPC分类号： G01R31/28 , G11C11/401 , G11C29/00 , G11C29/12
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device in which shortening a test time can be realized by reducing cycles of disturbance and refresh and improving the degree of freedom of assembling data. SOLUTION: This device is a DRAM, and has a test performing means by which the device is in a non-activation state at the time of normal operation, activated at the time of a test mode, and voltage of a data line is controlled in a non-selection state of a word line and a non-operation state of a sense amplifier. This test performing means is constituted of a word line selection control circuit 1 controlling selection of a word line WLi, a sense amplifier operation control circuit 2 controlling operation of a sense amplifier SAi, a column selection switch selection control circuit 3 controlling selection of column selection switch YSi, a data line voltage control circuit 4 controlling voltage of Di, and the like. A disturbance test of plural memory cells MCi can be performed by controlling voltage of Di arbitrarily without selecting a word line WLi and without operating a sense amplifier SAi.

7. 发明专利

JP2001022852A FACILITY OPERATION MANAGEMENT SYSTEM 失效
公开(公告)号：JP2001022852A
公开(公告)日：2001-01-26
申请号：JP19552999
申请日：1999-07-09
申请人： AKITA ELECTRONICS CO LTD
发明人： NAKAJIMA YOSHIHIRO
IPC分类号： B23Q41/08 , G05B15/02 , G05B19/418 , G06F17/40 , G06Q50/00 , G06Q50/04 , G06F17/60
摘要： PROBLEM TO BE SOLVED: To provide a facility operation management system where it is not required to attach an interface to the production facilities by making a sensor confront an operating state display body which displays the operating states of production facilities in the light or sounds, detecting the optical or sound signals sent from the display body in a non-contact state and outputting these detected signals to a computer. SOLUTION: An operating state display body 5 is attached to a production facility device 1, and the body 5 consists of a color pilot lamp 6, for example, that shows an operating state in a color. A sensor 7 confronts a lamp 6 and consists of an optical sensor 9 to detect each light 8 emitted from the lamp 6 in a non-contact state. In this example, the sensor 9 is placed independent of the device 1 and the lamp 6 is fixed to the device 1. Each sensor 7 is connected to its corresponding operation management unit 4 via a cable 10. In such a constitution of this facility operation management system, the unit 4 collects the operating states of each device 1 and these operating states are unitarily managed by a host computer 2.

8. 发明专利

JP2002151625A SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD 审中-公开
公开(公告)号：JP2002151625A
公开(公告)日：2002-05-24
申请号：JP2001211771
申请日：2001-07-12
申请人： HITACHI LTD , AKITA ELECTRONICS CO LTD
发明人： SAKURABA TADAKI , TAKESHIMA HIDEHIRO , ITO HIROYUKI , TAMAI YOSHIAKI , SAGA TORU
IPC分类号： H01L23/12 , H01L21/56 , H01L21/60 , H01L23/28 , H01L23/50 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To eliminate occurrence of damages or adhesion of foreign matters on a mounting surface of an external electrode terminal. SOLUTION: A method for manufacturing a semiconductor device comprises the steps of preparing a matrix type lead frame, in which a plurality of unit lead frame patterns are arranged laterally and longitudinally in a matrix state, then fixing a semiconductor chip, wire-connecting electrodes of the chip to inner ends of the leads via wirings, thereafter single-surface molding inner ends of the chip, the wirings and the leads, and covering them with a seal. In this case, the outside of a package is formed with resin, in which a thicker contact preventing piece than one package is filled. When the matrix type lad frame is stored or supplied, the lead frame is superposed. The surface of the lead which becomes the external electrode terminal is not contaminated or damaged, since the preventing piece is interposed between the upper and lower lead frames, when the lead frames are superposed. The lead frame is cut to manufacture a non-lead type semiconductor device.

9. 发明专利

JP2002093829A MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE 失效
公开(公告)号：JP2002093829A
公开(公告)日：2002-03-29
申请号：JP2000284653
申请日：2000-09-20
申请人： HITACHI LTD , AKITA ELECTRONICS CO LTD
发明人： SATO TSUKASA , ONODERA TADASHI
IPC分类号： H01L21/60 , H01L21/50 , H01L21/56
摘要： PROBLEM TO BE SOLVED: To reduce facility costs in processing, in a tape transport system. SOLUTION: The tape section of an endless; flexible tape is passed successively and moved along at least one machining station; at the same time, a stripe body (stripe-like tape) having a processing section requiring processing is mounted to the tap before reaching a first machining station; then is made to the treatment machining section at each machining station; and the stripe body is removed from the tape that has passed the final machining station. A liquid-like object is deposited on the processing section by potting at one of the machining stations, and the liquid-like object is baked for curing at the succeeding machining stations. A locking section, that is freely detachable from the tape, or the tape and the stripe body is provided, and is operated for attaching or detaching the stripe body to or from the tape.

10. 发明专利

JP2002047621A ENTRANCE REGULATING DEVICE AND AUTOMOBILE ENTRANCE REGULATING DEVICE 失效
公开(公告)号：JP2002047621A
公开(公告)日：2002-02-15
申请号：JP2000235576
申请日：2000-08-03
申请人： AKITA ELECTRONICS CO LTD , AJISU KK
发明人： OBUCHI TAKUMI , OTANI MORIYOSHI
IPC分类号： E01F13/00
摘要： PROBLEM TO BE SOLVED: To provide an entrance regulating device using no commercial electric power (a power source) as well as to provide a remote controllable automobile entrance regulating device having a lightweight and simple structure. SOLUTION: An entrance preventive device is provided with an entrance regulator for regulating an entrance into a specific area and capable of being buried in the ground, a control device for controlling lifting motion of the entrance regulator, a storage battery connected to the control device and a solar battery connected to the storage battery. The entrance regulator is provided with an entrance regulating bar-shaped column (or an entrance regulating pipe frame), an entrance regulating bar-shaped column (or entrance regulating pipe frame) support mechanism for supporting the entrance regulating bar-shaped column (or entrance regulating pipe frame) and capable of the lifting motion and a sliding cover arranged in a prescribed position of a ground surface appearing part of the entrance regulating bar-shaped column (or the entrance regulating pipe frame).

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