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1. 发明专利

JP5052973B2 Nitride semiconductor light-emitting element array 有权
公开(公告)号：JP5052973B2
公开(公告)日：2012-10-17
申请号：JP2007172598
申请日：2007-06-29
申请人：サムソンエルイーディーカンパニーリミテッド.
发明人：ミン，キョンイク , 相晧尹
IPC分类号： H01L33/08 , H01L33/24 , H01L33/32 , H01L33/42
CPC分类号： H01L33/24

2. 发明专利

JP5037037B2 Nitride-based semiconductor light-emitting element 有权
公开(公告)号：JP5037037B2
公开(公告)日：2012-09-26
申请号：JP2006137663
申请日：2006-05-17
申请人：サムソンエルイーディーカンパニーリミテッド.
发明人：チャンテソン , チョンドンミン , カンピルグン , イボンイル
IPC分类号： H01L33/12 , H01L33/36 , H01L33/32 , H01L33/40
CPC分类号： H01L33/405 , H01L33/32

3. 发明专利

JP2012182482A Sub-mount, light-emitting diode package, and manufacturing method of the same 审中-公开
标题翻译：子装置，发光二极管封装及其制造方法
公开(公告)号：JP2012182482A
公开(公告)日：2012-09-20
申请号：JP2012108584
申请日：2012-05-10
申请人： Samsung Led Co Ltd , サムソンエルイーディーカンパニーリミテッド.
发明人： RI EIKI , CHOI SEOG MOON , JEON HYUNG-JIN , SHIN SANG-HYUN
IPC分类号： H01L33/64 , H01L23/36 , H01L33/48 , H01L33/56 , H01L33/60 , H01L33/62
CPC分类号： H01L25/0753 , F21K9/00 , H01L33/486 , H01L33/62 , H01L33/641 , H01L33/647 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a sub-mount which has high heat radiating effect and can reduce a manufacturing cost, and to provide a light-emitting diode package and a manufacturing method of the light-emitting diode package.SOLUTION: A sub-mount, attached by a plurality of light-emitting diodes, comprises a plurality of metal bodies, attached by the plurality of the light-emitting diodes respectively; and an oxidized wall interposed between adjacent metal bodies so that the adjacent metal bodies are supported by each other and are electrically separated from one another. The sub-mount, attached by the plurality of the light-emitting diodes is formed by selectively oxidizing metal.
摘要翻译：要解决的问题：提供一种具有高散热效果并且可以降低制造成本的子座，并且提供发光二极管封装和发光二极管封装的制造方法。解决方案：由多个发光二极管连接的子安装座分别包括多个金属体，分别由多个发光二极管连接; 以及介于相邻金属体之间的氧化壁，使得相邻的金属体彼此支撑并彼此电分离。通过选择性地氧化金属而形成由多个发光二极管附着的副安装座。版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2012169683A Led driving circuit and led array device 审中-公开
标题翻译： LED驱动电路和LED阵列设备
公开(公告)号：JP2012169683A
公开(公告)日：2012-09-06
申请号：JP2012134573
申请日：2012-06-14
申请人： Samsung Led Co Ltd , サムソンエルイーディーカンパニーリミテッド.
发明人： LEE YONG JIN , MIN BYOUNG OWN , PARK GIL HAN , ONUSHKIN GRIGORY
IPC分类号： H01L33/00
CPC分类号： H05B33/0803 , H05B33/0821 , Y02B20/342 , Y10S362/80 , Y10S362/808
摘要： PROBLEM TO BE SOLVED: To provide an LED driving circuit and an LED array device in which the number of LEDs employed can be reduced by directly employing an AC voltage.SOLUTION: A ladder network LED circuit of the present invention includes three first branches connected to one another by first middle junction points c1 and c2 between first and second junction points a and b, and three second branches connected to one another by second middle junction points d1 and d2 between the first and second junction points a and b. The LED circuit includes two middle branches connected between the first and second middle junction points c1 and d1, and c2 and d2 of an identical sequence. Here, LED devices 8, 9, 10, 11, 12, 13, 14, and 15 are disposed on the first and second branches and the middle branches, respectively.
摘要翻译：要解决的问题：提供一种LED驱动电路和LED阵列器件，其中可以通过直接采用AC电压来减少使用的LED的数量。解决方案：本发明的梯形网络LED电路包括通过第一和第二接合点a和b之间的第一中间连接点c1和c2彼此连接的三个第一分支，以及通过第二连接点彼此连接的三个第二分支第一和第二连接点a和b之间的中间连接点d1和d2。 LED电路包括连接在第一和第二中间连接点c1和d1之间的两个中间分支，以及相同顺序的c2和d2。这里，LED装置8,9,10,11,12,13,14和15分别设置在第一和第二分支和中间分支上。版权所有（C）2012，JPO＆INPIT

5. 发明专利

JP5000612B2 Gallium nitride-based light-emitting diode element 有权
公开(公告)号：JP5000612B2
公开(公告)日：2012-08-15
申请号：JP2008248815
申请日：2008-09-26
申请人：サムソンエルイーディーカンパニーリミテッド.
发明人：コンユコ , スンファンチェ , ソンアチュ , ヨンジュンチョン , チュンギュパク
IPC分类号： H01L33/06 , H01L33/62 , H01L33/32 , H01L33/42
CPC分类号： H01L33/0075 , H01L33/32 , H01L33/486 , H01L33/62 , H01L2224/05001 , H01L2224/05023 , H01L2224/05568 , H01L2224/16

8. 发明专利

JP2012142581A Manufacturing method of light emitting diode and the light emitting diode manufactured by using the manufacturing method 有权
标题翻译：使用制造方法制造的发光二极管和发光二极管的制造方法
公开(公告)号：JP2012142581A
公开(公告)日：2012-07-26
申请号：JP2012000735
申请日：2012-01-05
申请人： Samsung Led Co Ltd , サムソンエルイーディーカンパニーリミテッド.
发明人： LEE DONG JU , LEE HOON-HO , SIM HYUN-UK , KIM YONG-SUN
IPC分类号： H01L33/32 , H01L21/205
CPC分类号： H01L33/0075 , H01L33/007 , H01L33/32
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method which improves the operational capability and the productivity of a process system and also improves crystallinity of a semiconductor layer.SOLUTION: A manufacturing method of a light emitting diode includes: a stage where a first conductive type nitride semiconductor layer 102 and an undoped nitride semiconductor layer 103 are sequentially grown on a substrate 101 in a first reaction chamber; a stage where the substrate on which the first conductive type nitride semiconductor layer and the undoped nitride semiconductor layer are grown is transferred to a second reaction chamber; a stage where an additional first conductive type nitride semiconductor layer is grown on the undoped nitride semiconductor layer in the second reaction chamber; a stage where an active layer 105 is grown on the additional first conductive type nitride semiconductor layer; and a stage where a second conductive type nitride semiconductor layer 106 is grown on the active layer.
摘要翻译：要解决的问题：提供一种提高处理系统的操作能力和生产率并且还提高半导体层的结晶度的制造方法。解决方案：发光二极管的制造方法包括：在第一反应室中在基板101上依次生长第一导电型氮化物半导体层102和未掺杂的氮化物半导体层103的阶段; 将第一导电型氮化物半导体层和未掺杂氮化物半导体层生长的基板转移到第二反应室的阶段; 在第二反应室中的未掺杂的氮化物半导体层上生长附加的第一导电型氮化物半导体层的阶段; 在附加的第一导电型氮化物半导体层上生长有源层105的阶段; 以及在有源层上生长第二导电型氮化物半导体层106的阶段。版权所有（C）2012，JPO＆INPIT

9. 发明专利

JP4982137B2 led drive control circuit having a temperature compensation function 有权
公开(公告)号：JP4982137B2
公开(公告)日：2012-07-25
申请号：JP2006237425
申请日：2006-09-01
申请人：サムソンエルイーディーカンパニーリミテッド.
发明人：一權 ▲鄭▼
IPC分类号： H01L33/00 , H05B37/02
CPC分类号： G09G3/3406 , G09G2310/06 , G09G2320/041 , G09G2320/043 , G09G2320/064

10. 发明专利

JP4976824B2 Led packages and backlight unit using the same 有权
公开(公告)号：JP4976824B2
公开(公告)日：2012-07-18
申请号：JP2006312965
申请日：2006-11-20
申请人：サムソンエルイーディーカンパニーリミテッド.
发明人：英衫朴 , 大淵金
IPC分类号： H01L33/48 , H01L33/54 , F21S2/00 , F21V5/00 , F21V5/04 , G02F1/13357 , H01L33/56 , H01L33/60
CPC分类号： H01L33/58 , H01L33/46
摘要： The invention relates to an LED package having a large beam angle of light emitted from an LED, simplifying a shape of a lens and an assembly process, and to a backlight unit using the same. The LED package includes a housing with a seating recess formed therein and at least one LED seated in the seating recess. The LED package also includes a lens having a predetermined sag on an upper side thereof, covering an upper part of the LED. The LED package and the backlight unit using the same can emit light uniformly without bright spots formed in an output screen, uses a simpler shaped lens with an increased beam angle, and minimizes a color mixing region to achieve miniaturization.

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