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    • 2. 发明专利
    • Abrasive composition used in wafer rough polishing
    • 用于粗糙抛光的磨料组合物
    • JP2012064938A
    • 2012-03-29
    • JP2011187674
    • 2011-08-30
    • Everlight Usa Incエバーライト ユーエスエー,インコーポレイテッド
    • OH WUI-KILI YEN-CHENG
    • H01L21/304B24B37/00C09K3/14
    • PROBLEM TO BE SOLVED: To provide an abrasive composition used in wafer rough polishing.SOLUTION: The abrasive composition, used in rough polishing of wafer, comprises: (A) polishing particles whose average particle diameter is 5-150 nm; (B) pH stabilizer whose pKa value is 9-10 and whose content is 7-28 wt% with respect to the polishing particle; (C) polishing accelerator; and (D) water. The abrasive composition according to the present invention effectively reduces by-product gelatinization in polishing particle and polishing process to increase polishing speed and at the same time maintains stability in polishing quality to achieve increased polishing pad performance and longer life of the polishing pad.
    • 要解决的问题:提供用于晶片粗抛光的磨料组合物。 解决方案:用于晶片粗抛光的磨料组合物包括:(A)研磨平均粒径为5-150nm的颗粒; (B)相对于研磨粒子的pKa值为9〜10,含量为7〜28重量%的pH稳定剂; (C)抛光加速器; 和(D)水。 根据本发明的研磨组合物有效地减少抛光颗粒中的副产物糊化和抛光过程,以提高抛光速度,同时保持抛光质量的稳定性,以实现增加的抛光垫性能和更长的抛光垫的使用寿命。 版权所有(C)2012,JPO&INPIT