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81. 发明专利

JP2012076937A Method for manufacturing ceramic-metal joined body, and ceramic-metal joined body 有权
标题翻译：制造陶瓷金属接合体和陶瓷金属接合体的方法
公开(公告)号：JP2012076937A
公开(公告)日：2012-04-19
申请号：JP2010221021
申请日：2010-09-30
申请人： Ngk Insulators Ltd , 日本碍子株式会社
发明人： TAKAHASHI HIRONORI
IPC分类号： C04B37/02 , B23K1/19 , B23K1/20 , B23K101/02 , C04B35/565 , C04B38/00
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a ceramic-metal joined body for bonding a ceramic member and a metal member by brazing with high electroconductivity secured.SOLUTION: The method for manufacturing the ceramic-metal joined body includes a step for bonding the ceramic member 131 and the metal member 132 via a brazing material 133 after removing by reduction an oxidized filling in the bonding face 131a by applying reducing agent 134 with reducing property on the bonding face 131a of the ceramic member 131 comprising a ceramic material having electroconductivity.
摘要翻译：解决的问题：提供一种用于制造陶瓷 - 金属接合体的方法，用于通过确保高导电性的钎焊将陶瓷构件和金属构件接合。＆lt; P＆gt;解决方案：陶瓷 - 金属接合体的制造方法包括通过钎焊材料133在通过还原剂还原接合面131a中的氧化填充而去除之后将陶瓷构件131和金属构件132接合的步骤 134，其具有包含具有导电性的陶瓷材料的陶瓷构件131的接合面131a上的降低性能。版权所有（C）2012，JPO＆INPIT

82. 发明专利

JP2012502797A Method for soldering a metal honeycomb body for exhaust gas treatment 有权
公开(公告)号：JP2012502797A
公开(公告)日：2012-02-02
申请号：JP2011526451
申请日：2009-08-25
申请人：エミテックゲゼルシヤフトフユアエミツシオンステクノロギーミツトベシユレンクテルハフツング
发明人：ルートビッヒヴァイレス , ハンス−ペーターキャスパー , ヨルググトースキー , フベルトゥスコトホフ , ディートマルシャウチェット
IPC分类号： B23K1/00 , B23K1/008 , B23K1/19 , B23K1/20 , B23K31/02 , B23K35/30 , B23K101/02 , B23K103/02 , C22C19/05 , C22C38/00 , C22C38/18 , F01N3/28
CPC分类号： B23K1/012 , B23K2201/02
摘要： A method for brazing a metallic honeycomb body (1) for exhaust gas treatment, includes at least: a) pretreatment of a honeycomb body (1) at a temperature above 400° C.; b) cooling the honeycomb body (1); c) brazing the honeycomb body (1) at a temperature in a range of from 1050° C. to 1100° C. under atmospheric pressure; and d) cooling the honeycomb body (1). A suitable apparatus for carrying out the method is also provided.

84. 发明专利

JP2012000644A Joining method of aluminum pipe and copper pipe, joining structure and heat exchanger having the joining structure 有权
标题翻译：铝管和铜管的接合方法，接合结构和具有接合结构的热交换器
公开(公告)号：JP2012000644A
公开(公告)日：2012-01-05
申请号：JP2010138169
申请日：2010-06-17
申请人： Fuji Electric Co Ltd , Fuji Electric Retail Systems Co Ltd , 富士電機リテイルシステムズ株式会社 , 富士電機株式会社
发明人： IMAMURA SEIJI , OKAMOTO KOICHI , TSUCHIYA TOSHIAKI
IPC分类号： B23K1/19 , B23K1/00 , B23K1/18 , B23K1/20 , B23K101/14 , B23K103/18
摘要： PROBLEM TO BE SOLVED: To provide an inexpensive joining method of an aluminum pipe and a copper pipe which can improve joining quality, a joining structure and a heat exchanger having the joining structure.SOLUTION: The joining method which joins the aluminum pipe 3 and the copper pipe 4 via a stainless pipe 1 is composed of: a first step in which both ends 2a, 2b of the stainless pipe 1 are applied with pipe contraction processing, nickel plating 9 is applied to the whole surface of the stainless pipe 1, and the copper pipe 4 and the stainless pipe 1 are torch-brazed by inserting and arranging one end 2a of the stainless pip 1 in the copper pipe 4; and a second step in which the aluminum pipe 3 and the stainless pipe 1 are aluminum-brazed by inserting and arranging the other end 2b of the stainless pipe 1 in the aluminum pipe 3 after the first step.
摘要翻译：要解决的问题：提供一种廉价的能够提高接合质量的铝管和铜管的接合方法，接合结构和具有接合结构的热交换器。解决方案：通过不锈钢管1连接铝管3和铜管4的接合方法包括：第一步骤，其中对不锈钢管1的两端2a，2b进行管收缩处理，将镍镀层9施加到不锈钢管1的整个表面，并且通过将不锈钢口1的一端2a插入铜管4中将铜管4和不锈钢管1焊接钎焊; 以及第二步骤，其中铝管3和不锈钢管1通过在第一步骤之后将不锈钢管1的另一端2b插入并排列在铝管3中而进行铝钎焊。版权所有（C）2012，JPO＆INPIT

85. 发明专利

JP4821800B2 Preliminary plating method of the coil ends 有权
公开(公告)号：JP4821800B2
公开(公告)日：2011-11-24
申请号：JP2008134508
申请日：2008-05-22
申请人：千住金属工業株式会社
发明人：司大西
IPC分类号： C23C2/34 , B23K1/00 , B23K1/20 , B23K35/26 , B23K101/36 , B23K103/12 , C22C13/00 , C23C2/04 , C23C2/08 , C23C2/38
CPC分类号： C23C2/04 , B23K35/262 , C22C13/00

86. 发明专利

JP2011235581A Metal hollow ball, ball block and laminated panel using the metal hollow ball, and method for manufacturing them 审中-公开
标题翻译：使用金属中空球的金属中空球，球块和层压板及其制造方法
公开(公告)号：JP2011235581A
公开(公告)日：2011-11-24
申请号：JP2010110302
申请日：2010-05-12
申请人： Jfe Techno Research Corp , Jfeテクノリサーチ株式会社
发明人： FUKUDA YASUTAKA , HAYASHI IHEI
IPC分类号： B32B1/00 , B22F1/00 , B22F1/02 , B22F3/11 , B22F9/22 , B23K1/00 , B23K1/20 , B23K101/04 , B23K103/02 , B32B3/12 , B32B9/00 , B32B15/02
摘要： PROBLEM TO BE SOLVED: To provide a hollow metal ball (called a metal hollow ball, hereinafter) easy to be bonded and excellent in compressive strength, low thermal conductivity, and vibration proof property, a block body composed by bonding the plurality of metal hollow balls (called a ball block, hereinafter), a laminated body composed by sandwiching the plurality of metal hollow balls between plate members (called a laminated panel, hereinafter), and a method for manufacturing the ball block and the laminated panel.SOLUTION: The metal hollow ball 4 includes a barrier layer 2 formed of barrier material on a surface of a metal hollow body 1 formed of metal material or metal oxide, and also includes a bonding layer 3 formed of bonding material on an upper surface of the barrier layer.
摘要翻译：解决问题的方案为了提供一种容易粘合的中空金属球（以下称为金属中空球），抗压强度低，导热性和抗振性优异的块体，其通过将多个的金属中空球（以下称为球块），通过将多个金属中空球夹在板构件之间（以下称为层压板）而构成的层叠体以及制造球块和层压板的方法。解决方案：金属中空球4包括由金属材料或金属氧化物形成的金属中空体1的表面上的由阻挡材料形成的阻挡层2，并且还包括由上部的接合材料形成的接合层3 阻挡层的表面。版权所有（C）2012，JPO＆INPIT

87. 发明专利

JP2011173778A Ceramic member with metal layer, metal-ceramic joined member and method for manufacturing ceramic member with metal layer 审中-公开
标题翻译：具有金属层的陶瓷构件，金属 - 陶瓷接合构件和用于制造具有金属层的陶瓷构件的方法
公开(公告)号：JP2011173778A
公开(公告)日：2011-09-08
申请号：JP2010122948
申请日：2010-05-28
申请人： Kyocera Corp , 京セラ株式会社
发明人： IWAMOTO KOICHI
IPC分类号： C04B35/10 , B23K1/19 , B23K1/20 , C04B37/02
摘要： PROBLEM TO BE SOLVED: To provide a ceramic member with a metal layer which has high joining strength.
SOLUTION: The ceramic member with the metal layer is provided with a ceramic body and the metal layer provided on the surface of the ceramic body. The ceramic body contains Al and O and further contains at least one or more kinds of oxides of specific transition elements selected from the third transition elements (Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn) and the forth transition elements (Y, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd). The metal layer has a first layer joined to the surface of the ceramic body and contains the specific transition element as an essential component and a second layer joined to the first layer and containing the specific transition element and at least one kind of Ag, Au, Pt, Cu, Pd, V, Hf and V, wherein the content (mass%) of the specific transition element in the first layer is higher than that in the second layer.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有高接合强度的金属层的陶瓷构件。解决方案：具有金属层的陶瓷构件设置有陶瓷体，并且设置在陶瓷体的表面上的金属层。陶瓷体含有Al和O，并且还含有选自第三过渡元素（Sc，Ti，V，Cr，Mn，Fe，Co，Ni，Cu，Zn）中的至少一种以上的特定过渡元素的氧化物和第四过渡元素（Y，Zr，Nb，Mo，Tc，Ru，Rh，Pd，Ag，Cd）。金属层具有接合到陶瓷体的表面的第一层，并且包含特定的过渡元素作为主要成分，第二层与第一层接合并含有特定的过渡元素和至少一种Ag，Au， Pt，Cu，Pd，V，Hf和V，其中第一层中的特定过渡元素的含量（质量％）高于第二层中的含量（质量％）。版权所有（C）2011，JPO＆INPIT

88. 发明专利

JP2011167714A Solder joined body of aluminum material, solder joining method, and battery pack using the solder joining method 审中-公开
标题翻译：铝合金材料的接合体，焊接接合方法以及使用焊接接合方法的电池组
公开(公告)号：JP2011167714A
公开(公告)日：2011-09-01
申请号：JP2010032954
申请日：2010-02-17
申请人： Toshiba Corp , 株式会社東芝
发明人： THAN TRONG LONG , KURI YUUJI , ITO YASUYUKI
IPC分类号： B23K35/26 , B23K1/00 , B23K1/19 , B23K1/20 , B23K103/10 , C22C13/00 , C22C13/02 , H01M2/10 , H01M2/20
CPC分类号： Y02E60/12
摘要： PROBLEM TO BE SOLVED: To obtain a joined body in which aluminum materials or an aluminum material and a different kind of material are joined, and which has excellent joining strength and reliability.
SOLUTION: The joined body contains: a first metal member made of an aluminum material, a second metal member made of an aluminum material or a different kind of metal material, and a connection part connecting the first metal member and the second metal member. The connection part is formed on the surface of the first metal member and includes a metal layer made of at least one kind of first metal element selected from a group composed of Cu, Ni, Co, Zn, Ge, Au, Pd and Sn, and a joining layer formed on the metal layer and made of an Sn based solder containing at least one kind of second metal element capable of forming a solid solution or an intermetallic compound with the at least one kind of first metal element, and the second metal element is selected from a group composed of Cu, Ag, In, Bi, Co and Ti.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：获得铝材料或铝材料和不同种类的材料接合的接合体，并且具有优异的接合强度和可靠性。解决方案：接合体包括：由铝材料制成的第一金属构件，由铝材料或不同种类的金属材料制成的第二金属构件，以及连接第一金属构件和第二金属的连接部会员。连接部形成在第一金属构件的表面上，并且包括由选自由Cu，Ni，Co，Zn，Ge，Au，Pd和Sn组成的组中的至少一种第一金属元素制成的金属层，以及形成在所述金属层上并且由含有能够与所述至少一种第一金属元素形成固溶体或金属间化合物的至少一种第二金属元素的Sn基焊料构成的接合层，并且所述第二金属元素选自由Cu，Ag，In，Bi，Co和Ti组成的组。版权所有（C）2011，JPO＆INPIT

89. 发明专利

JPWO2009122912A1 はんだ構造体、はんだ構造体の形成方法、はんだ構造体を含む半導体モジュール、および携帯機器审中-公开
公开(公告)号：JPWO2009122912A1
公开(公告)日：2011-08-04
申请号：JP2010505577
申请日：2009-03-18
申请人：三洋電機株式会社
发明人：水原　秀樹 , 秀樹水原 , 初小林 , 初小林 , 敏哉清水 , 敏哉清水
IPC分类号： B23K35/14 , B23K1/00 , B23K1/20 , B23K31/02 , B23K35/26 , C22C1/00 , C22C1/02 , C22C13/00 , C22C13/02 , H01L21/60 , H05K3/34
CPC分类号： B23K1/0016 , B23K31/02 , B23K35/262 , B23K35/3013 , B23K2201/42 , B32B15/018 , C22C13/00 , C22C13/02 , H01L23/544 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2224/0231 , H01L2224/02313 , H01L2224/02319 , H01L2224/0233 , H01L2224/0239 , H01L2224/0401 , H01L2224/1132 , H01L2224/13099 , H01L2224/131 , H01L2224/16 , H01L2924/0001 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H05K3/3463 , H05K2203/0435 , H01L2924/00
摘要：【課題】Sn合金はんだにおいてSnのウイスカーの発生を抑制する。【解決手段】はんだ構造体2は、固液共存状態になりうるSn合金4とSn合金4の表面の少なくとも一部を覆うAu(またはAu合金)被膜6とで構成されている。Au被膜6がSn合金4の表面の少なくとも一部を覆う被膜となっている。望ましい形態として、Au被膜6はSn合金4の表面に網目構造を形成している。Au被膜6の厚さは、たとえば、1〜5μmである。【選択図】図1

90. 发明专利

JP4732699B2 Soldering method 有权
公开(公告)号：JP4732699B2
公开(公告)日：2011-07-27
申请号：JP2004040237
申请日：2004-02-17
申请人：神港精機株式会社
发明人：孝中森 , 丈二加々見 , 恭秀大野 , 誠末永 , 達也竹内 , 泰三萩原
IPC分类号： B23K1/20 , B23K1/008 , B23K3/08 , B23K31/02 , B23K35/26 , C22C13/00 , H05K3/34
CPC分类号： B23K3/087 , B23K1/008 , B23K35/26 , B23K2201/42 , C22C13/00 , H05K3/3463 , H05K3/3489

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