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81. 发明专利

JPH07252581A SILICON COMPOUND-CONTAINING HIGH HARDNESS SINTERED BODY FOR TOOL 失效
公开(公告)号：JPH07252581A
公开(公告)日：1995-10-03
申请号：JP4082994
申请日：1994-03-11
申请人： SUMITOMO ELECTRIC INDUSTRIES
发明人： GOTO MITSUHIRO , NAKAI TETSUO
IPC分类号： B23B27/14 , B23P15/28 , C04B35/583 , C04B35/599 , C22C29/14
摘要： PURPOSE:To obtain excellent chipping resistance and wear resistance and to increase the service life of a tool by subjecting cubic boron nitride to sintering using a bonding material essentially consisting of sialon. CONSTITUTION:This sintered body has a compsn. contg., by volume (%), 60 to = two or more kinds with inevitable impurities. As the sialon, beta-sialon (Si6-2Al2O2N8-2; 0 100m/min, sialon forms a protective film on the front rake face and relief face of the cutting tool, and a wear resisting effect is attained.

82. 发明专利

JPH0762468A PRODUCTION OF DIAMOND SINTERED COMPACT FOR TOOL 失效
公开(公告)号：JPH0762468A
公开(公告)日：1995-03-07
申请号：JP5197791
申请日：1991-03-18
申请人： SUMITOMO ELECTRIC INDUSTRIES
发明人： NAKAI TETSUO , YATSU SHUJI
IPC分类号： B23B27/14 , B23P15/28 , C04B35/52 , C04B38/00 , C22C1/05 , C22C26/00
摘要： PURPOSE:To produce a diamond bite for a tool utilizable as a diamond bit, a drawing die, a ceramic cutting bite, etc. CONSTITUTION:This diamond sintered compact consists of 20-85vol.% coarse diamond grains having >=3mum grain size and the balance 10-79vol.% binder and 1 to

83. 发明专利

JPH0621312B2 失效
公开(公告)号：JPH0621312B2
公开(公告)日：1994-03-23
申请号：JP29136086
申请日：1986-12-05
申请人： SUMITOMO ELECTRIC INDUSTRIES
发明人： NAKAI TETSUO , GOTO MITSUHIRO
IPC分类号： C22C1/05 , B01J3/06 , B22F3/14 , B22F3/15 , C04B35/5831 , C22C26/00 , C22C29/14 , C22C29/16

84. 发明专利

JPH05185366A GRINDING WHEEL HOLDER 失效
公开(公告)号：JPH05185366A
公开(公告)日：1993-07-27
申请号：JP402692
申请日：1992-01-13
申请人： SUMITOMO ELECTRIC INDUSTRIES
发明人： NAKAMURA TSUTOMU , NAKAI TETSUO
IPC分类号： B24B35/00
摘要： PURPOSE:To greatly enhance the abrasion resistance by fixing a hard material mainly containing diamond in part of at least two mating surfaces of the inner side-face of the opening of a grinding wheel holder. CONSTITUTION:The body 1 of a grinding wheel holder is provided with an opening 1a having a quadriangular section perpendicular to the grinding wheel inserting direction. A hard material chiefly containing diamond 2 is fixed to a part of at least two mating surfaces of the inner side-face of this opening 1a. Examples of this hard material are a synthesized monocrystal diamond, sintered diamond, and ceramic covered with polycrystal diamond by the low pressure gaseous phase method and a single substance of plate-shaped polycrystal diamond synthesized by the low pressure gaseous phase method.

85. 发明专利

JPH0567651A BONDING TOOL 失效
公开(公告)号：JPH0567651A
公开(公告)日：1993-03-19
申请号：JP23009691
申请日：1991-09-10
申请人： SUMITOMO ELECTRIC INDUSTRIES
发明人： TANAKA KATSUYUKI , NAKAMURA TSUTOMU , NAKAI TETSUO
IPC分类号： H01L21/60
摘要： PURPOSE:To make it possible to relax a thermal stress due to the difference in thermal expansion coefficient by a method wherein stress relaxation layers are provided between a tool tip part formed with a bonding surface and a shank. CONSTITUTION:A bonding tool is formed by bonding a tool tip part A to a shank 4 interposing two layers of stress relaxation layers B1 and B2 between the tip part A and the shank 4. The tip part A is constituted of a sintered body containing Si, Si3N4 or the like as its main component and/or a material obtainable by applying a polycrystalline diamond, which is made to deposit by a vapor-phase synthesis method, on a base body consisting of these composite materials or the like. The first layer of the layers B1 and B2 is constituted of a material having a thermal expansion coefficient of 10X10 / deg.C or smaller between a room temperature and 600 deg.C and the second layer of the layers B1 and B2 is constituted of one kind or more of materials chosen from among Au, Cu, Ag and Ta. As a result, as the materials having a small Young's modulus are adopted for the layers B1 and B2, a thermal stress caused by thermal strain can be lessened.

86. 发明专利

JPH0525639A POLYCRYSTALLINE DIAMOND CUTTING TOOL AND ITS MANUFACTURE 失效
公开(公告)号：JPH0525639A
公开(公告)日：1993-02-02
申请号：JP29162991
申请日：1991-11-07
申请人： SUMITOMO ELECTRIC INDUSTRIES
发明人： NAKAMURA TSUTOMU , KANEDA YASUYUKI , NAKAI TETSUO
IPC分类号： B23P5/00 , B23B27/14 , C23C16/26 , C23C16/27
摘要： PURPOSE:To improve the heat resistance and tool strength of a cutting tool using polycrystalline diamond. CONSTITUTION:This polycrystalline diamond cutting tool uses polycrystalline diamond formed by a low pressure vapor phase method as tool stock 3 and is joined to a shank 4 constituted of a sintered hard alloy via a brazing layer 5. The thickness of the polycrystalline diamond layer is set to 0.1 to 1.0mm. Then, the thickness of the brazing layer 5 is set to 10 to 50mum. As the brazing layer 5, the material having 950 to 1300 deg.C m.p. is used, and it is formed from an alloy layer contg. a material of the IVa, Va, VIa and VII group metals in a periodic table and one or more kinds selected from their carbides and a material of one or more kinds selected from Au, Ag, Cu, Pt, Pd and Ni.

87. 发明专利

JPH058153B2 失效
公开(公告)号：JPH058153B2
公开(公告)日：1993-02-01
申请号：JP11335785
申请日：1985-05-27
申请人： SUMITOMO ELECTRIC INDUSTRIES
发明人： GOTO MITSUHIRO , NAKAI TETSUO , HARA AKIO
IPC分类号： B23B27/14 , B24D3/06 , C04B35/52 , C04B41/87 , C04B41/88

88. 发明专利

JPH0513843A HEAT DISSIPATING PARTS AND SEMICONDUCTOR LASER EQUIPPED WITH SAID HEAT DISSIPATING PARTS 失效
公开(公告)号：JPH0513843A
公开(公告)日：1993-01-22
申请号：JP16021091
申请日：1991-07-01
申请人： SUMITOMO ELECTRIC INDUSTRIES
发明人： NAKAMURA TSUTOMU , IGUCHI TAKEHISA , NAKAI TETSUO
IPC分类号： H01L23/373 , H01L20060101 , H01S3/04 , H01S5/00 , H01S5/024
摘要： PURPOSE:To enhance the heat conduction efficiency from vapor phase synthetic diamond layer to a stem and improve heat dissipation, by covering the whole part of a stem mounting surface with a polycrystalline diamond layer formed by vapor phase synthesis. CONSTITUTION:A semiconductor laser element 1 is bonded on the surface of vapor phase synthetic polycrystalline diamond layer 3 via soldering material 2. The layer 3 is formed on the upper surface of the stem 4 by using a vapor phase synthetic method. The layer 3 is synthesized on the whole part of the upper surface of the stem 4. Hence the heat generated by the semiconductor laser element 1 is conducted to the layer 3. Said heat diffuses in the depth direction and the horizontal direction in the layer 3, and further diffuses in the inside of the stem 4 from the interface between the layer 3 and the stem 4. Hence the region of the stem 4 contributing to heat dissipation is increased, and the heat dissipation efficiency is improved.

89. 发明专利

JPH04240007A POLYCRYSTAL DIAMOND CUTTING TOOL AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH04240007A
公开(公告)日：1992-08-27
申请号：JP315191
申请日：1991-01-16
申请人： SUMITOMO ELECTRIC INDUSTRIES
发明人： NAKAMURA TSUTOMU , NAKAI TETSUO
IPC分类号： B23B27/14 , B23B27/20 , B23P15/28 , C22C1/05
摘要： PURPOSE:To obtain a polycrystal diamond cutting tool of a high defect resistance. CONSTITUTION:A polycrystal diamond tool raw material composed on the base material surface with the use of a low pressure vapor phase method is taken, and the side coming into contact with the base material of the polycrystal diamond is utilized for the rake face of a tool. A honing treatment is executed at the edge tip formed by grinding with the use of a laser beam machining.

90. 发明专利

JPH04146007A POLYCRYSTAL DIAMOND CUTTING TOOL AND ITS MANUFACTURE 失效
公开(公告)号：JPH04146007A
公开(公告)日：1992-05-20
申请号：JP27101190
申请日：1990-10-08
申请人： SUMITOMO ELECTRIC INDUSTRIES
发明人： NAKAMURA TSUTOMU , NAKAI TETSUO
IPC分类号： B23B27/14 , B23B27/20 , B23K20060101 , B23K26/352 , B23P15/28 , C23C16/26 , C23C16/27 , C30B20060101
摘要： PURPOSE:To acquire excellent blade setting property and especially a favourably finished surface by coating an addendum flank with graphite formed by laser processing, and finishing its cutting face as a mirror-like surface of less than 0.1mum at Rmax. CONSTITUTION:A polycrystal diamond of 0.5-15mum of an average crystal grain diameter of diamond is composed on a base plate made of a metal and/or ally or Si the surface of which is finished as a mirror-like surface of less than 0.1mum at Rmax. Laser beam is radiated from the side of the cutting face of a tool or the opposite side. At this time, the tool is inclined against the laser beam so as to have a set clearance angle and moved. A laser processing condition is selected so that chipping of an addendum is to be 0.5-5mum and the thickness of a graphite layer is to be 0.5-10mum. A cutting tool manufactured in this way has less than 5mum of chipping, and it is possible to easily acquire a diamond tool which is excellent in its blade setting property which had been difficult to manufacture in the conventional manner.

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