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1. 发明专利

JP2000326112A MULTICRYSTALLINE DIAMOND TOOL 失效
公开(公告)号：JP2000326112A
公开(公告)日：2000-11-28
申请号：JP13728199
申请日：1999-05-18
申请人： SUMITOMO ELECTRIC INDUSTRIES
发明人： YOSHIDA KATSUTO , SHIRAISHI JUNICHI , NAKAI TETSUO
IPC分类号： B23B27/20 , B22F7/00 , B22F7/06 , B23B27/18 , C04B37/02 , C22C26/00 , C23C30/00
摘要： PROBLEM TO BE SOLVED: To provide a diamond sintered body superior in profitability and edge strength. SOLUTION: A cutting tool is formed by brazing a raw material of a diamond sintered body tool, which consists of a diamond sintered body sintered under super-high pressure and high temperature and a WC-Co alloy base material bonded directly to the diamond sintered body in a sintering process, onto a tool base via the WC-Co alloy base material. The ratio of the thickness of the layer of the diamond sintered body to the thickness of the WC-Co alloy base material is 0.8

2. 发明专利

JPH11240762A HIGH-STRENGTH, HIGH-ABRASION-RESISTANT DIAMOND SINTERED PRODUCT AND TOOL THEREFROM 失效
公开(公告)号：JPH11240762A
公开(公告)日：1999-09-07
申请号：JP4546898
申请日：1998-02-26
申请人： SUMITOMO ELECTRIC INDUSTRIES
发明人： OGATA YASUNOBU , KUKINO AKIRA , KANEDA YASUYUKI , SHIRAISHI JUNICHI , NAKAI TETSUO
IPC分类号： B23B27/14 , C04B35/52 , C22C26/00
摘要： PROBLEM TO BE SOLVED: To provide a diamond sintered product that has excellent abrasion resistance, chipping resistance, shock resistance and high thermal conductivity. SOLUTION: This diamond sintered product contains sintered diamond particles and a rest amount of sintering additives. The content of the sintered diamond particles is 80-99 vol.%. The sizes of the sintered diamond particles are in the range of from 0.1 μm to 70 μm. Adjacent sintered diamond particles directly joint to each other. The sintering additives include at least one selected from the group consisting of tungsten, iron, cobalt and nickel. The proportion of the tungsten in the sintered product is in the range of from 0.01 to 8 wt.%.

3. 发明专利

JPH10277831A CUTTING TOOL FOR MILLING 失效
公开(公告)号：JPH10277831A
公开(公告)日：1998-10-20
申请号：JP8627397
申请日：1997-04-04
申请人： SUMITOMO ELECTRIC INDUSTRIES
发明人： KAMISAKA SHINYA , NAKAI TETSUO
IPC分类号： B23C5/16 , B23C5/06 , B23C5/20 , B23C5/22
摘要： PROBLEM TO BE SOLVED: To check any nick due to a hot crack by using a CBN sintered body, making thermal conductibility and a coefficient of thermal expansion into a specified range each, as a cutting edge. SOLUTION: A CBN sintered body in a range of more than 3.0 and less than 4.0×10 /K in the range that thermal conductivity at 129 deg.C is more than 400 W/m.K and a coefficient of thermal expansion ranging from 20 deg.C to 600 deg.C in temperature is used as a cutting edge. With this constitution, in time of high speed milling cutting, heat to be produced in an interval of contact between this cutting edge and a work material is able to be efficiently set free through the whole sintered body. In addition, thermal expansion in the sintered body in and around the cutting edge is a little, and since the heat moves into the whole sintered body, a temperature gradient lying between the cutting edge and the sintered body inside is also a little, whereby a tensile stress attributable to a thermal expansion difference comes to be reduced in consequence.

4. 发明专利

JPH08323506A CUTTING TOOL COMPOSITELY COVERED WITH HARD ABRASION RESISTANT LAYER 失效
公开(公告)号：JPH08323506A
公开(公告)日：1996-12-10
申请号：JP15844095
申请日：1995-06-01
申请人： SUMITOMO ELECTRIC INDUSTRIES
发明人： KUKINO AKIRA , GOTO MITSUHIRO , NAKAI TETSUO
IPC分类号： B23B27/14
摘要： PURPOSE: To restain separation of a covering layer, and maintain high hardness of a hard abrasion resistant layer even under a high temperature condition at cutting time by forming a hard sintered body base material of a high pressure phase type boron nitride sintered body. CONSTITUTION: Since mechanical abrasion is dominant over a flank relief of a hard sintered body base material 1 composed of a hard sintered body containing high pressure phase type boron nitride by 20 volume % or more, particularly, a CBN sintered body excellent in defect resistance, a (Ti, Al) N layer excellent in hardness and defect resistance effective in restraining abrasion, an ultra particulate layered film layer of TiN and AlN or an ultra lattice layered compound layer 2 of TiN and AlN, are formed on the flank relief. On the other hand, since a cutting face of the hard sintered body base material 1 increases in a rate of thermal abrasion, to form an Al2 O3 layer 3 excellent in thermal stability effective in restaining crater abrasion is suitable. A layer thickness of respective layers of this ultra lattice layered compound layer 2 is 0.2nm to 20nm, and has a cubic system X-ray diffraction pattern as a whole. A thickness of respective layers of the ultra particulate layered film layer is 1nm to 60nm, and a particle diameter is 1nm to 50nm.

5. 发明专利

JP2539910B2 失效
公开(公告)号：JP2539910B2
公开(公告)日：1996-10-02
申请号：JP7894389
申请日：1989-03-29
申请人： SUMITOMO ELECTRIC INDUSTRIES
发明人： NAKAI TETSUO
IPC分类号： B23B27/18 , B23B27/20 , B23P15/28

6. 发明专利

JP2520971B2 失效
公开(公告)号：JP2520971B2
公开(公告)日：1996-07-31
申请号：JP12992490
申请日：1990-05-18
申请人： SUMITOMO ELECTRIC INDUSTRIES
发明人： NAKAMURA TSUTOMU , TANAKA KATSUYUKI , NAKAI TETSUO
IPC分类号： H01L21/52 , C04B37/02 , H01L21/60

7. 发明专利

JPH07156003A POLYCRYSTAL DIAMOND TOOL AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH07156003A
公开(公告)日：1995-06-20
申请号：JP30642893
申请日：1993-12-07
申请人： SUMITOMO ELECTRIC INDUSTRIES
发明人： NAKAMURA TSUTOMU , KANEDA YASUYUKI , NAKAI TETSUO
IPC分类号： B23B27/18 , B23B27/20 , B23K1/00 , B23K35/30 , B23P15/28 , C04B35/52 , C04B37/02
摘要： PURPOSE:To provide a new polycrystal diamond tool which can exhibit excellent performance not only in applicable range for a sintered diamond tool but also in the condition in which performance has not been satisfied because of problem in heat resistance. CONSTITUTION:In a cutting tool, extra high pressure sintered diamond containing almost no iron family metal substantially is used as a raw material so as to be brazed to a tool base material, and edge point formation of the tool raw material is carried out by laser processing. In practice, sintered diamond consists of 90-99.5% volume of diamond, 0.1-1 volume % of iron family metal, and the rest of empty pores.

8. 发明专利

JPH06198504A CUTTING TOOL FOR HIGH HARDNESS SINTERED BODY 失效
公开(公告)号：JPH06198504A
公开(公告)日：1994-07-19
申请号：JP132393
申请日：1993-01-07
申请人： SUMITOMO ELECTRIC INDUSTRIES
发明人： GOTO MITSUHIRO , NAKAI TETSUO
IPC分类号： B22F7/00 , B01J3/06 , B22F7/06 , B23B27/14 , B23P15/28 , B32B18/00 , C22C26/00 , C22C29/16 , C22C32/00
摘要： PURPOSE:To provide a cutting tool for a high hardness sintered body which can keep its tool life longer. CONSTITUTION:The cutting face of a blade edge is constituted of the main surface of the first sintered body layer which contains diamond over 80vol.% and under 98vol.%, and a flank of the blade edge is constituted of the second sintered layer which contains cubic boron nitride(CBN) over 30vol.% and under 75vol.%. Thickness of the first sintered body layer is made 0.02mm or more and less that 0.1mm, the ratio between the thickness of the first sintered body layer that of the second sintered body layer is made 1:5 or more.

9. 发明专利

JPH0621315B2 失效
公开(公告)号：JPH0621315B2
公开(公告)日：1994-03-23
申请号：JP30257086
申请日：1986-12-18
申请人： SUMITOMO ELECTRIC INDUSTRIES
发明人： NAKAI TETSUO , GOTO MITSUHIRO
IPC分类号： C22C1/05 , B22F3/14 , B22F3/15 , B24D3/06 , C09K3/14 , C22C26/00 , C22C29/00 , C22C29/02 , C22C29/04 , C22C29/14 , C22C29/16

10. 发明专利

JPH0679504A POLYCRYSTAL DIAMOND CUTTING TOOL AND ITS MANUFACTURE 失效
公开(公告)号：JPH0679504A
公开(公告)日：1994-03-22
申请号：JP23202792
申请日：1992-08-31
申请人： SUMITOMO ELECTRIC INDUSTRIES
发明人： NAKAMURA TSUTOMU , KANEDA YASUYUKI , NAKAI TETSUO
IPC分类号： B23B27/14 , B23B27/20 , B23P15/28 , C23C16/26 , C23C16/27 , C23C16/56 , C30B29/04
摘要： PURPOSE:To enhance welding resistance for cutting tool composed of polycrystal diamonds. CONSTITUTION:A polycrystal diamond cutting tool has a structure in which a polycrystal diamond layer synthesized by a low vapor phase process is used as tool raw material and the tool material is joined with a tool support body. The surface roughness of a tool cutting face shall be less than 0.2mum of Rmax. The grain size of each polycrystal diamond shall be 0.01 to 1mum in the cutting face side and shall be 5 to 15% of the film thickness of the polycrystal diamond layer on the joined surface side. The polycrystal diamond layer from its cutting face down to the depth of 10mum includes carbon elements of 99 to 100% by atom, and 99 to 100% carbon atoms are bound with diamonds. The surface having come in contact with a substrate when the polycrystal diamond layer was formed, constitutes the cutting face, after ion beams are applied onto the cutting face, it is heated up to 300 to 500 deg.C in atmosphere.

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