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81. 发明专利

JP2010034037A Resin film sheet having conductive particles therein and electronic components electrically connected by the resin film sheet having conductive particles therein 有权
标题翻译：具有导电颗粒的电影薄片和由具有导电颗粒的树脂薄膜电连接的电子组件
公开(公告)号：JP2010034037A
公开(公告)日：2010-02-12
申请号：JP2009148551
申请日：2009-06-23
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： KONO TSUTOMU , KOBAYASHI KOJI , KOJIMA KAZUYOSHI , MINO MASAYUKI
IPC分类号： H01R11/01 , H01B5/16 , H01L21/60
CPC分类号： H01L2224/2929 , H01L2224/293 , H01L2224/73204 , H01L2224/83851
摘要： PROBLEM TO BE SOLVED: To achieve cost reduction and enhance conductivity by increasing the rate of capture of particles on a conductive resin film sheet. SOLUTION: The conductive resin film sheet includes two or more of resin film layers having conductive particles 1 therein or of resin film layers having no conductive particles therein, which are laminated in the through-wall direction in order to increase the particle capture rate, which is represented by the ratio of the number of particles included in the resin film existing between pre-shaped electrodes and the number of particles sandwiched between post-shaped electrodes, wherein the resin film layer which includes therein a through-wall center plane located at an equidistance from both surfaces of the resin film sheet or at least one resin film layer adjacent to the through-wall center plane is formed by an insulating resin film layer having no conductive particles therein. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：通过提高导电树脂膜片上的颗粒的捕获速度，实现成本降低并提高导电性。
解决方案：导电树脂膜片包括其中具有导电颗粒1的树脂膜层或其中没有导电颗粒的树脂膜层的两个或更多层叠在贯通壁方向上以增加颗粒捕获速率，其由在预形状电极之间存在的树脂膜中包含的粒子数与夹在后形电极之间的粒子数之比的比率表示，其中，树脂膜层包括通孔壁中心面位于与树脂膜片的两个表面等距离或与贯通壁中心面相邻的至少一个树脂膜层的绝缘树脂膜层上形成绝缘树脂膜层。版权所有（C）2010，JPO＆INPIT

82. 发明专利

JP2009021595A Rework method 审中-公开
标题翻译： REWORK方法
公开(公告)号：JP2009021595A
公开(公告)日：2009-01-29
申请号：JP2008177952
申请日：2008-07-08
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TSUKAGOSHI ISAO , HIROZAWA YUKIHISA , KOBAYASHI KOJI , KOIDE NOBUKAZU , GOTO YASUSHI
IPC分类号： H01L21/60 , H05K3/32
CPC分类号： H01L24/27 , H01L24/98 , H01L2224/73204 , H01L2924/01005 , H01L2924/01006 , H01L2924/01018 , H01L2924/01033 , H01L2924/01049 , H01L2924/01054 , H01L2924/01075 , H01L2924/01079 , H01L2924/07802 , H01L2924/07811 , H01L2924/09701 , H01L2924/14 , H01L2924/15788 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a rework method of an electronic component by adhesive packaging, which can perform stripping work even in a minute space without having a significant effect on other peripheral joints. SOLUTION: The rework method of an electronic component sets the threshold of adhesive smaller than that of a circuit 4 when stripping the electronic component 2 connected electrically with the circuit 4 on a substrate 1 by adhesive, removes the electronic component 2 together with a connection member 3 by irradiating the side face of the electronic component 2 with excimer laser 6, and then connects the electronic component 2 electrically again to the stripped part using adhesive. If the residual connection member 3 exists when the electronic component 2 is stripped, the surface of the connection member 3 is irradiated with excimer laser 6 and the electronic component 2 is connected electrically again to the stripped part using adhesive. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：通过粘合剂包装提供电子部件的返工方法，即使在微小的空间中也可以进行剥离工作，而不会对其它外围接头产生显着影响。解决方案：当剥离通过粘合剂在基板1上与电路4电连接的电子部件2时，电子部件的返工方法设定粘合剂的阈值小于电路4的阈值，将电子部件2与通过用准分子激光器6照射电子部件2的侧面，然后使用粘合剂将电子部件2再次电连接到剥离部的连接部件3。如果电子部件2被剥离时存在残留连接部件3，则用准分子激光器6照射连接部件3的表面，并且使用粘合剂将电子部件2再次电连接到剥离部。版权所有（C）2009，JPO＆INPIT

83. 发明专利

JP2008308682A Circuit connection material 审中-公开
标题翻译：电路连接材料
公开(公告)号：JP2008308682A
公开(公告)日：2008-12-25
申请号：JP2008128668
申请日：2008-05-15
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： KOBAYASHI TAKANOBU , FUKUTOMI TAKAHIRO , KOBAYASHI KOJI , FUKUSHIMA NAOKI
IPC分类号： C09J171/10 , C09J7/00 , C09J9/02 , C09J133/26 , C09J163/00 , H05K1/14
摘要： PROBLEM TO BE SOLVED: To provide a circuit connection material maintaining satisfactory adhesive strength after a high temperature-high humidity test.
SOLUTION: The circuit connection material contains: an adhesive composition containing the following (A), (B), (C) and (D); and conductive particles: (A) a phenoxy resin; (B) acrylic rubber including a monomer unit derived from N,N-dialkylacrylamide expressed by general formula (1); (C) an epoxy resin; and (D) a latent curing agent; wherein, R
1 and R
2 each independently represents a 1 to 5C straight chain or branched alkyl group.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供在高温高湿试验后保持良好的粘合强度的电路连接材料。电路连接材料包含：含有以下（A），（B），（C）和（D）的粘合剂组合物; 和导电颗粒：（A）苯氧基树脂; （B）丙烯酸橡胶，其包含由通式（1）表示的N，N-二烷基丙烯酰胺衍生的单体单元; （C）环氧树脂; 和（D）潜伏性固化剂; 其中R 1和R 2各自独立地表示1〜5的直链或支链烷基。版权所有（C）2009，JPO＆INPIT

84. 发明专利

JP2008288551A Circuit connecting adhesive film, connection structure, and manufacturing method thereof 有权
标题翻译：电路连接胶片，连接结构及其制造方法
公开(公告)号：JP2008288551A
公开(公告)日：2008-11-27
申请号：JP2008002577
申请日：2008-01-09
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： ARIFUKU MASAHIRO , MOCHIZUKI AKIOMI , KOBAYASHI KOJI , KOJIMA KAZUYOSHI , NAKAZAWA TAKASHI , HIROZAWA YUKIHISA
IPC分类号： H01L21/60 , C09J7/00 , C09J9/02 , C09J11/00 , C09J201/00
CPC分类号： H01L2224/2919 , H01L2924/01078 , H01L2924/01079 , H01L2924/0665 , H01L2924/07811 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To improve the transfer on a circuit component keeping an adhesive strength and long term reliability after a circuit is connected on a sufficient level in a circuit connecting adhesive film. SOLUTION: The circuit connecting adhesive film 1 is used to bond a first circuit component and a second circuit component and has an adhesive layer A11 and an adhesive layer B12 laminated on the adhesive layer A11. The peel strength, when the circuit connecting adhesive film 1 is stuck on the surface on the first connecting terminal side of the first circuit component by the adhesive layer B12 in the direction contacting with the first circuit component, is more than the peel strength when sticking the adhesive layer A11 on the surface on the first connecting terminal side of the first circuit component, and the thickness of the adhesive layer B12 is 0.1 to 5.0 μm. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了改善在电路连接粘合膜的电路连接足够的水平之后保持粘合强度和长期可靠性的电路部件上的转印。解决方案：连接粘合膜1的电路用于粘合第一电路部件和第二电路部件，并且具有层叠在粘合层A11上的粘合层A11和粘合层B12。当电路连接粘合剂膜1在第一电路部件的第一连接端子侧的表面上以与第一电路部件接触的方向通过粘合剂层B12粘附时的剥离强度大于粘附时的剥离强度第一电路部件的第一连接端子侧的表面上的粘合层A11和粘合剂层B12的厚度为0.1〜5.0μm。版权所有（C）2009，JPO＆INPIT

85. 发明专利

JP2008138182A Circuit connecting material 审中-公开
标题翻译：电路连接材料
公开(公告)号：JP2008138182A
公开(公告)日：2008-06-19
申请号：JP2007284204
申请日：2007-10-31
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： KOBAYASHI TAKANOBU , KOBAYASHI KOJI , FUKUSHIMA NAOKI , FUKUTOMI TAKAHIRO
IPC分类号： C09J163/00 , C09J7/00 , C09J9/02 , C09J11/04 , C09J11/06 , C09J171/10 , H01B1/22 , H01B5/16 , H01R11/01
摘要： PROBLEM TO BE SOLVED: To provide a circuit connecting material that is excellent in workability and heat resistance and enables good circuit connection in a short time.
SOLUTION: The circuit connecting material comprises an adhesive composition comprising a phenoxy resin, an epoxy resin derived from a dihydroxy benzene and a latent curing agent and electrically conductive particles.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供可加工性和耐热性优异的电路连接材料，并且能够在短时间内实现良好的电路连接。电路连接材料包括粘合剂组合物，其包含苯氧基树脂，衍生自二羟基苯的环氧树脂和潜在固化剂以及导电颗粒。版权所有（C）2008，JPO＆INPIT

86. 发明专利

JP2008124029A Connecting member 审中-公开
标题翻译：连接会员
公开(公告)号：JP2008124029A
公开(公告)日：2008-05-29
申请号：JP2007305067
申请日：2007-11-26
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TSUKAGOSHI ISAO , HIROZAWA YUKIHISA , KOBAYASHI KOJI , UENO KATSUYUKI , MATSUOKA HIROSHI
IPC分类号： H01R11/01 , C09J7/00 , H01B5/16
摘要： PROBLEM TO BE SOLVED: To provide a connecting member for bonding and connecting circuit boards to each other, and electrically connecting electrodes of both the circuit boards.
SOLUTION: In the connecting member for connecting the electrodes opposed to each other, a conductive bonding layer made of a conductive material and a binder and having a conductivity in the pressure direction, and an insulating bonding layer are alternately formed, the conductive bonding layer and the insulating bonding layer are formed in cross-section when cut vertically with respect to the length direction of the tape, the insulating bonding layer is further formed on one or both faces of the conductive bonding layer and the insulating bonding layer arranged alternately, along the direction of the conductive bonding layer and insulating bonding layer arranged alternately.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于将电路板彼此接合和连接的连接构件，以及电连接两个电路板的电极。解决方案：在用于连接彼此相对的电极的连接构件中，交替地形成由导电材料和粘合剂制成并且在压力方向上具有导电性的导电接合层和绝缘粘结层，导电接合层和绝缘接合层在相对于带的长度方向垂直切割时形成为横截面，绝缘接合层进一步形成在交替布置的导电接合层和绝缘接合层的一个或两个表面上沿着交替配置的导电接合层和绝缘接合层的方向。版权所有（C）2008，JPO＆INPIT

87. 发明专利

JP2008027921A Connection member, and connection structure and connection method of electrode using same 有权
标题翻译：连接构件，以及使用其的电极的连接结构和连接方法
公开(公告)号：JP2008027921A
公开(公告)日：2008-02-07
申请号：JP2007228030
申请日：2007-09-03
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TSUKAGOSHI ISAO , HIROZAWA YUKIHISA , KOBAYASHI KOJI , OTA TOMOHISA , MATSUOKA HIROSHI , WATANABE ITSUO , TAKEMURA KENZO , SHIOZAWA NAOYUKI , WATANABE OSAMU , KOJIMA KAZUYOSHI
IPC分类号： H01R11/01 , H01L21/60 , H01R43/00
CPC分类号： H01L2224/2929 , H01L2224/293 , H01L2224/83851
摘要： PROBLEM TO BE SOLVED: To provide a high-resolution connection member that has improved long-term connection reliability, and has improved working efficiency by dispensing with the accurate alignment between a conductive particle and an electrode, and to provide a connection structure of the electrode using the connection member. SOLUTION: In a multilayer connection member, where an insulation adhesive layer is formed at least on one side of an adhesive layer that is made of a conductive material and a binder and is conductive in a pressurization direction, the binder and the insulation adhesive layer are mainly made of an epoxy resin modified by a high molecular weight component, and a heat-resistant difference is provided between the binder and the insulation adhesive layer for preferentially separating the connection member for semiconductor chips from one substrate surface after connection. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种提高长期连接可靠性的高分辨率连接构件，并且通过分配导电颗粒和电极之间的精确对准而提高工作效率，并提供连接结构的电极。解决方案：在多层连接构件中，绝缘粘合剂层形成在由导电材料和粘合剂制成并且在加压方向上导电的粘合剂层的至少一侧上，粘合剂和绝缘体粘合剂层主要由通过高分子量组分改性的环氧树脂制成，并且在粘合剂和绝缘粘合剂层之间提供耐热差异，用于在连接后优先从半导体芯片的连接构件与一个基板表面分离。版权所有（C）2008，JPO＆INPIT

88. 发明专利

JP2008022036A Connection member, connection structure of electrode using the same, and connection method 有权
标题翻译：连接构件，使用其的电极的连接结构和连接方法
公开(公告)号：JP2008022036A
公开(公告)日：2008-01-31
申请号：JP2007260090
申请日：2007-10-03
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TSUKAGOSHI ISAO , HIROZAWA YUKIHISA , KOBAYASHI KOJI , OTA TOMOHISA , MATSUOKA HIROSHI , WATANABE ITSUO , TAKEMURA KENZO , SHIOZAWA NAOYUKI , WATANABE OSAMU , KOJIMA KAZUYOSHI
IPC分类号： H01L21/60
摘要： PROBLEM TO BE SOLVED: To obtain a high-resolution connection member that has superior long connection reliability, dispenses with the precise alignment between a conductive particle and an electrode, and has excellent workability; and to obtain the connection structure of the electrode using the connection member. SOLUTION: In the connection structure between electrode rows having a plurality of chips, at least one of the electrode rows standing face to face is formed on a substrate. In this case, one electrode row is connected to the other via the connection member. The connection member is a multilayer connection member, where an insulating adhesive layer is formed on at least one side of an adhesive layer that is made of a conductive material and a binder and has conductivity in the direction of pressurization. Melting viscosity when a binder component is connected is not more than that as compared with the insulating adhesive layer. The insulating adhesive layer covers the periphery of at least the substrate side of a projected electrode. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题为了获得具有优异的长连接可靠性的高分辨率连接件，省去了导电颗粒和电极之间的精确对准，并且具有优异的可加工性; 并且使用连接构件获得电极的连接结构。解决方案：在具有多个芯片的电极列之间的连接结构中，在基板上形成至少一个电极列彼此面对面地形成。在这种情况下，一个电极列经由连接构件而彼此连接。连接构件是多层连接构件，其中在由导电材料和粘合剂制成的粘合剂层的至少一侧上形成绝缘粘合剂层，并且在加压方向上具有导电性。当粘合剂组分连接时的熔融粘度不大于与绝缘粘合剂层相比的熔融粘度。绝缘粘合剂层覆盖突起电极的至少基板侧的周边。版权所有（C）2008，JPO＆INPIT

89. 发明专利

JP2007305583A Circuit connection material and connection structure of circuit terminal using the same 有权
标题翻译：使用相同电路的电路连接材料和电路终端的连接结构
公开(公告)号：JP2007305583A
公开(公告)日：2007-11-22
申请号：JP2007116049
申请日：2007-04-25
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： ARIFUKU MASAHIRO , WATANABE ITSUO , GOTO YASUSHI , KOBAYASHI KOJI , FUJINAWA MITSUGI , KOJIMA KAZUYOSHI , NAKAZAWA TAKASHI
IPC分类号： H01B1/22 , C09J4/00 , C09J7/00 , C09J9/02 , C09J11/04 , C09J163/00 , C09J171/10 , G02F1/1345 , H01B1/00 , H05K3/36
摘要： PROBLEM TO BE SOLVED: To provide an electric/electronic circuit connection material and a connection structure of a circuit terminal using the material. SOLUTION: The circuit connection material contains conductive particles. A diameter of a conductive particle and a hardness have the following relation (e). (e) A diameter of the conductive particle is 1 μm or more and less than 2 μm and a hardness of the conductive particle is in a range of 4.903 GPa (500 kgf/mm 2 ) to 9.807 GPa (1,000 kgf/mm 2 ). COPYRIGHT: (C)2008,JPO&INPIT

90. 发明专利

JP2007009215A Connecting member 审中-公开
标题翻译：连接会员
公开(公告)号：JP2007009215A
公开(公告)日：2007-01-18
申请号：JP2006187861
申请日：2006-07-07
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： FUKUSHIMA NAOKI , TSUKAGOSHI ISAO , KOBAYASHI KOJI
IPC分类号： C09J7/00 , C09J11/00 , C09J123/08 , C09J131/04 , C09J171/10 , C09J201/00 , H01B5/16 , H01R11/01
摘要： PROBLEM TO BE SOLVED: To provide a connecting member not necessitating a base film, free from fault of peeling of the base film in temporary pressure sticking or production of industrial waste, low in elution of conductive particles from an electrode in connecting and excellent in longterm connection reliability because it is easy to make contact of the electrode with the conductive particles, not liable to contain bubbles in connection part, excellent in working property by not necessitating accurate positioning of the conductive particles and the electrode.
SOLUTION: The connecting member comprises an adhesive layer comprising the conductive material and a binder, having conductivity to the direction of pressing, and a heat melting layer on at least one side of the adhesive layer, wherein the heat melting layer comprises a phenoxy resin or an EVA copolymer having tensile strength of ≥0.3 kgf/mm
2 and elongation of ≤100%.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供不需要基膜的连接构件，在临时压力粘附或工业废弃物的生产中不会发生基膜剥离的缺陷，导电颗粒从电极在连接和由于容易使电极与导电性颗粒接触，不容易在连接部分含有气泡，因此不需要精确定位导电性粒子和电极，因此具有优异的工作性能，因而具有良好的连接可靠性。
解决方案：连接构件包括粘合剂层，其包含导电材料和粘合剂，其对于压制方向具有导电性，以及在粘合剂层的至少一侧上的热熔融层，其中该热熔层包含苯氧基树脂或EVA共聚物，其拉伸强度≥0.3kgf/ mm 2＆lt; SP＆gt;伸长率≤100％。版权所有（C）2007，JPO＆INPIT

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