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81. 发明专利

JPS62154653A IC PACKAGE 失效
公开(公告)号：JPS62154653A
公开(公告)日：1987-07-09
申请号：JP29768085
申请日：1985-12-26
申请人： HITACHI CABLE
发明人： NUMAJIRI FUMIYA , YOSHIDA HIROMICHI
IPC分类号： H01L23/29 , H01L23/16 , H01L23/31 , H01L23/30
摘要： PURPOSE:To improve the reliability of an IC package by burying a crack development preventing material in a molding resin to prevent the crack generated from the interior of the resin and particularly from a many cracking portion from developing. CONSTITUTION:Since cracks 8 tends to occur from corners of the end of a placing base 3, the end of an IC element 5 or the end of a lead pin 4 in a resin 7, a crack development preventing material 10 is so buried to cover this portion, i.e., a many cracking portion 9. The crack development preventing material is preferably fiber or woven fabric of the fiber. Since the material 10 is buried only in the vicinity of the cracking portion 9, the development of the generated cracks 8 can be almost prevented. When the material 10 is buried entirely in the resin 7 and the density is so decided that the portion near a lead frame 2, i.e., the deep portion in the resin is dense and the vicinity of the outer surface of the resin 7 is rough, the development of the crack can be completely prevented.

82. 发明专利

JPS6229152A LEAD FRAME 失效
公开(公告)号：JPS6229152A
公开(公告)日：1987-02-07
申请号：JP16732385
申请日：1985-07-29
申请人： HITACHI CABLE
发明人： OTAKA TATSUYA , YOSHIDA HIROMICHI
IPC分类号： H01L23/50 , H01L23/495
摘要： PURPOSE:To reliably define the area to be subjected to plating in the lead section sides, to prevent the plating liquid from entering the area not to be subjected to plating, and thereby to keep high the IC package reliability, by a method wherein each lead is provided with a protrusion extending in a region neighboring the area to be subjected to plating. CONSTITUTION:A lead frame 1 is provided at its center with a mount 2 for the installation of a semiconductor integrated circuit element. Formed around the mount 2 are pin-shaped leads 3 extending toward the mount 2. Every one of the leads 3 is provided on its side with a protruding bar 5 extending outside a border line 4 marking the limit of the inner area to be subjected to plating. The protruding bars 5 are so arranged that the end 7 of a protruding bar 5 extends beyond the end 7 of a neighboring bar 5. This arrangement stops a plating liquid from reaching a region not designed to be subjected to plating, which properly defines the dimensions to be subjected to plating. This in addition prevents short-circuiting attributable to migration. There will be no poor adhesion in the process of packaging the frame into resin, either.

83. 发明专利

JPS61195996A LIQUID FLOW-DOWN TYPE PLATING METHOD 失效
公开(公告)号：JPS61195996A
公开(公告)日：1986-08-30
申请号：JP3604785
申请日：1985-02-25
申请人： HITACHI CABLE
发明人： KAYANE KOICHI , YOSHIDA HIROMICHI , HAGITANI SHIGEO , OKABE NORIO
IPC分类号： C25D5/08 , C25D7/06 , C25D17/00
摘要： PURPOSE:To attain the speed-up of the plating by providing a material to be treated in a plating liquid flow which is stirred by the synthesis of both the plating liquid flow in the axial direction of a liquid duct and the plating liquid flow in the direction rectangular thereto and plating it. CONSTITUTION:A liquid duct 18 is constituted of a flow path wall 3 provided to the inside of the first plating vessel 1 and a stirring flow 8 of the specified pressure is fed in the inside of the liquid duct 18 from a bottom of the liquid duct 18. Simultaneously the injection flows 9 are fed in the direction nearly rectangular to the stirring flow 8 by providing the injection holes 5 for a plating soln. in the neighborhood of the flow path wall 3. The plating liquid flow 10 synthesized by both the stirring flow 8 and the injection flows 9 is formed by such a way and a material 15 to be plated is provided in the plating liquid flow 8.

84. 发明专利

JPS6170391A Evaporating heat transfer wall 失效
标题翻译：蒸发热交换器墙
公开(公告)号：JPS6170391A
公开(公告)日：1986-04-11
申请号：JP19157884
申请日：1984-09-14
申请人： Hitachi Cable Ltd , Hitachi Ltd
发明人： KUWABARA HEIKICHI , TAKAHASHI KENJI , YANAGIDA TAKEHIKO , NAKAYAMA HISASHI , SUGIMOTO SHIGEO , YOSHIDA HIROMICHI , OIZUMI KIYOSHI
IPC分类号： F28F13/02 , F28F1/10 , F28F1/12 , F28F1/40 , F28F13/18
CPC分类号： F28F13/18
摘要： PURPOSE:To improve the heat transfer performance by providing projections in the inner parts of opening communicating minute cavities with the external part, and determining, in a plan view of the evaporating heat transfer wall, the ratio of the projection area to the opening area to a specific ratio. CONSTITUTION:Below the surface of a heat transfer wall 1, which makes contact with a fluid, are provided a large number of adjacent fins, thin and long cavities at minute intervals, and a number of minute holes 5 which bring the cavities 2 into communication with the external part are disposed regularly along the longitudinal direction of the cavities 2 at the ceiling 4 of the cavities 2. Within the holes 5 are provided projections 6 protruding in a direction intercrossing holes 5 from the vicinities of holes including holes 5, respectively. When the heat transfer wall 1 is viewed in a plan, the ratio of the area of the projection 6 to the opening area is set in a range of from 0.4-0.8. As a result, the heat transfer efficiency is improved further and it can contribute to the miniaturization and the achievement of higher performance of apparatuses using the heat transfer wall.
摘要翻译：目的：通过在与外部开口连通的微小腔的内部部分提供突起来提高传热性能，并且在蒸发传热壁的平面图中确定投影面积与开口面积的比率具体比例。构成：在与流体接触的传热壁1的表面下方设有大量相邻的翅片，以较小间隔的薄且长的空腔，以及使空腔2进入通信的多个微孔5 外部部分沿着空腔2的空腔2的纵向方向规则地设置在空腔2的天花板4处。在孔5内设置有突出部6，突出部6沿着与包括孔5的孔附近的交叉孔5的方向突出。当在平面图中观察传热壁1时，突起6的面积与开口面积的比率被设定在0.4-0.8的范围内。结果，进一步提高了传热效率，并且能够有助于使用传热壁的设备的小型化和更高性能的实现。

85. 发明专利

JPS6155949A Partial peeling method of plated article 失效
标题翻译：部分剥离方法
公开(公告)号：JPS6155949A
公开(公告)日：1986-03-20
申请号：JP17796084
申请日：1984-08-27
申请人： Hitachi Cable Ltd
发明人： KAKIZAKI KIMIO , YOSHIDA HIROMICHI , SUZUMURA TAKASHI , OTAKA TATSUYA , YAMAGISHI RYOZO , OKABE NORIO , NAGAYAMA SADAO
IPC分类号： H01L23/50 , C25F5/00 , H01L21/48
CPC分类号： H01L21/4835
摘要： PURPOSE:To form a distinct plating shape, which does not ooze out to the side surface of a lead frame, etc., easily by pushing a mask with a flexible layer against a plating surface, dipping a plating peeling section in a peeling liquid and peeling and removing the plating of a section with which the mask is not brought into contact. CONSTITUTION:A mask 2 consisting of a flexible material or a composite material in which a flexible layer 2B is formed onto the surface of a rigid body is pushed against one part of the plating surface of a plated article 1, and the plating of a section with which the mask 2 is not brought into contact is peeled and removed. When the plated article takes a metal sheet shape as a lead frame, etc., a keep-plate 4 composed of the rigid body, the flexible material or the composite material in which the flexible layer is formed onto the surface of the rigid body is mounted onto the back of the plating surface, and the plated article 1 is held between the hold-down plate 4 and the mask 2. When the plated article takes the metal sheet shape, through-holes 2C, 4C are formed to at least one of the mask 2 and the hold-down plate 4 for an improvement in a circulation to a peeling surface of a peeling liquid and a use as a path for currents on electrolytic peeling.
摘要翻译：目的：通过将具有柔性层的掩模压靠在电镀表面上，可以容易地形成不渗出引线框等的侧面的不同电镀形状，将电镀剥离部浸渍在剥离液中，剥离并除去掩模未接触的部分的电镀。构成：由柔性材料或复合材料构成的面罩2，其中柔性层2B形成在刚体的表面上，被压靠在电镀制品1的电镀表面的一部分上，剥离并除去掩模2未与其接触的部分。当电镀制品采用金属片形状作为引线框架等时，由刚性体，柔性材料或其中柔性层形成在刚体表面上的复合材料构成的保持板4是安装在电镀表面的背面，并且电镀制品1保持在压板4和掩模2之间。当电镀制品采取金属片形时，通孔2C，4C形成至少一个掩模2和压板4，用于改善对剥离液的剥离表面的循环以及用作电解剥离电流的路径。

86. 发明专利

JPS6099999A BOILING HEAT TRANSFER WALL 失效
公开(公告)号：JPS6099999A
公开(公告)日：1985-06-03
申请号：JP20484383
申请日：1983-11-02
申请人： HITACHI LTD , HITACHI CABLE
发明人： KUWABARA HEIKICHI , NAKAJIMA TADAKATSU , OOGURO TAKAHIRO , NAKAYAMA HISASHI , KASUYA KATSUHIKO , YOSHIDA HIROMICHI
IPC分类号： F28F13/02 , F28F1/12 , F28F13/18
摘要： PURPOSE:To introduce liquid, entered into a tunnel from opening holes of liquid capillary tubes on a rough surface, to facilitate to wet the whole periphery of the tunnel and improve heat transfer by a method wherein the internal wall of the tunnel of heat transfer wall, having the opening holes and the tunnels, is worked so as to be the rough surface. CONSTITUTION:A shallow groove is made on the surface of a circular tube by knurling work in the direction of substantially 45 deg. with respect to the axis of the tube. Then, plow-up work is applied by a tool into substantially orthogonal direction to the axis of the tube to form the row of fins provided with recesses and protuberances. Successively, fine metallic powder is collided against the heat transfer wall of valleys between fins to roughen the wall surface. The fins are laid down by rolling work, brushing work or the like to form the tunnels by connecting neighboring fins. The tips of the fins are provided with the recesses and protuberances, therefore, the recesses form the opening holes after the rolling work or the like and the size of the opening hole may be controlled easily in the process of production.

87. 发明专利

JPS6012724B2 失效
公开(公告)号：JPS6012724B2
公开(公告)日：1985-04-03
申请号：JP7051580
申请日：1980-05-27
申请人： HITACHI CABLE
发明人： FUKUDA SHIGEO , YOSHIDA HIROMICHI , TOYOSHIMA MASAHIKO
IPC分类号： G02B6/04 , G02B6/44 , H01B11/22 , H01B13/00 , H01B13/02

88. 发明专利

JPS6016431A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS6016431A
公开(公告)日：1985-01-28
申请号：JP12513383
申请日：1983-07-08
申请人： HITACHI CABLE
发明人： SUZUMURA TAKASHI , YOSHIDA HIROMICHI , MIYAKE YASUHIKO , SANKI SADAHIKO , OOTAKA TATSUYA , KOBAYASHI AKIMITSU
IPC分类号： H01L21/52 , H01L21/58
摘要： PURPOSE:To reduce a thermal stress and temperature rise by forming an electrode material with a composite material of high thermal conductive material holding a low thermal expansion material and bonding element and sink to the side of high thermal conductive material with solder on the occasion of forming a semiconductor device by fixing a semiconductor element and a heat sink provided in parallel thereto on the electrode material. CONSTITUTION:An electrode material is composed of three layer composite electrode plate 2 consisting of a high thermal conductive materials 6 and 8 such as Cu, Al holding a low thermal expansion material 7 consisting of Fe-Ni alloy or Fe-Ni-Co alloy and a semiconductor element 1 is welded to the side of conductive material 6 through the soldering layer 5. An insulating material 3 is bonded adjacently to such element through the soldering layer 5 and a heat sink 4 which becomes the thermal absorbing region is welded thereon by the soldering layer 5. Thereby, thermal conductivity of composite electrode plate 2 can be increased and temperature of element 1 can be lowered.

89. 发明专利

JPS6015937A CLADDING MATERIAL FOR SEMICONDUCTOR SUPPORT ELECTRODE 失效
公开(公告)号：JPS6015937A
公开(公告)日：1985-01-26
申请号：JP12364983
申请日：1983-07-07
申请人： HITACHI CABLE
发明人： KOBAYASHI AKIMITSU , KONISHI KENJI , HORII FUMIO , KODAMA HIROFUMI , YOSHIDA HIROMICHI , SANKI SADAHIKO , OOTAKA TATSUYA
IPC分类号： H01L21/52 , H01L21/58
摘要： PURPOSE:To give excellent heat dissipation properties, electrical conductivity and soldering properties as an electrode material providing in combination thermal expansion aligning properties by keeping the volume ratio of an Invar plate in a cladding material having constitution in which copper plates are arranged to both surfaces of the Invar plate within a specified range. CONSTITUTION:Cu plates 2, 2 are arranged to both surfaces of an Invar plate 1, and these Invar plate and Cu plates are pressure-welded and unified through cold rolling, thus obtaining a clad material 3. Accordingly, the volume ratio of the Invar plate 1 in the cladding material 3 is brought to 20-80% of the whole cladding material 3. Such a cladding material 3 having three layer structure of Cu and Invar is used as an electrode material 4, and silicon 5 is soldered 6 directly on the electrode material 4.

90. 发明专利

JPS59219493A PLATING METHOD OF STRIPE PLATED ROD 失效
公开(公告)号：JPS59219493A
公开(公告)日：1984-12-10
申请号：JP9427783
申请日：1983-05-27
申请人： HITACHI CABLE
发明人： KAYANE KOUICHI , OKABE NORIO , YOSHIDA HIROMICHI , SUZUMURA TAKASHI , NAGAYAMA SADAO , OGINOME NOBORU , NAKANO FUMIO , TERAKADO KATSUMI
IPC分类号： C25D5/02
摘要： PURPOSE:To obtain extremely efficiently a broad and thin stripe plated rod requiring high dimensional accuracy by combining the advantages of the respective masking tape fixing and plating during horizontal and vertical traveling of the rod. CONSTITUTION:A thin and broad rod 4 which travels horizontally is exactly positioned by a guide 3 just before sticking rolls 8. Masking tapes 1 slightly broader than the width of the rod are supplied from above and below through guide rolls 2 in an arrow direction and are cut to the same size as stripe plating width by a cutter 9. These tapes are stuck to the top and bottom surface of the rod 4 advancing in an arrow direction. The cut tapes 11 are stripped near the rolls 2 and are taken up on a reel 12. The rod is rotated by a rotating jig mechanism at around the optional point 5 having the space between a plating cell 7 and the rolls 8 enough to avoid hindering the 90 deg. rotation of the rod surface in a way as to obviate generation of residual strain on the rod. The rod is thereafter introduced into the cell 7 and is plated.

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