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81. 发明专利

JP2014125595A Resin composition, and molded product thereof 审中-公开
标题翻译：树脂组合物及其成型产品
公开(公告)号：JP2014125595A
公开(公告)日：2014-07-07
申请号：JP2012284808
申请日：2012-12-27
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： KIKUCHI IKUKO , KOYAMA NAOYUKI , GOTO AKIHITO , KOFUNE MIKA
IPC分类号： C08L97/00 , C08K5/13
摘要： PROBLEM TO BE SOLVED: To provide a resin composition derived from a plant using a wood-based material derived from a plant, and in particular, to provide a resin composition which contains lignin derived from a plant as a main raw material, and is excellent in workability with high plant-containing ratio and is applied with impact resistance by applying plasticity thereto with cardanol, and a molded product.SOLUTION: In a resin composition containing lignin, cardanol, a curing agent and a curing accelerator, the resin composition contains 20-90 mass% of organic solvent soluble lignin, and 0.1-50 mass% of cardanol. A molded product is formed by using the resin composition.
摘要翻译：要解决的问题：提供一种使用来自植物的木质材料从植物得到的树脂组合物，特别是提供含有以植物为主要原料的木质素的树脂组合物，其优异具有高含植物比例的可加工性，并通过用腰果酚施加可塑性而施加抗冲击性和成型产品。溶解性：在含有木质素，腰果酚，固化剂和固化促进剂的树脂组合物中，树脂组合物含有20 -90质量％的有机溶剂可溶性木质素，和0.1-50质量％的腰果酚。通过使用树脂组合物形成成型体。

82. 发明专利

JP2014125400A Method of producing spherical hollow silica particles 审中-公开
标题翻译：生产球形中空二氧化硅颗粒的方法
公开(公告)号：JP2014125400A
公开(公告)日：2014-07-07
申请号：JP2012284806
申请日：2012-12-27
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： MITANI IKUE , TAKANE NOBUAKI
IPC分类号： C01B33/18 , B01J13/04 , B01J13/20
摘要： PROBLEM TO BE SOLVED: To provide a method of producing spherical hollow silica particles in which the particle strength is improved.SOLUTION: A method of producing spherical hollow silica particles includes a step (a) for coating of spherical calcium carbonate with silica and a step (b) for elution of the calcium carbonate under an acidic condition, wherein (a) spherical calcium carbonate has a sphericity of 1.0-1.5.
摘要翻译：要解决的问题：提供一种制造球状中空二氧化硅颗粒的方法，其中颗粒强度得到改善。解决方案：球形中空二氧化硅颗粒的制备方法包括用二氧化硅涂覆球形碳酸钙的步骤（a）和步骤（b）在酸性条件下洗脱碳酸钙，其中（a）球形碳酸钙的球形度为1.0-1.5。

83. 发明专利

JP2014120689A Laminated body, laminated plate, multilayer laminated plate, printed wiring board, multilayer printed wiring board, and method for manufacturing laminated plate 有权
标题翻译：层压体，层压板，多层层压板，印刷线路板，多层印刷布线板及其制造方法
公开(公告)号：JP2014120689A
公开(公告)日：2014-06-30
申请号：JP2012276260
申请日：2012-12-18
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： YAMAZAKI YUKA , AOSHIMA MASAHIRO , KAMIGATA YASUO , MURAI HIKARI
IPC分类号： H05K3/46 , B32B17/10 , B32B27/20
摘要： PROBLEM TO BE SOLVED: To provide a laminated plate which solves such a problem that in a laminated plate including a cured resin layer and a glass substrate layer, when a resin composition layer is thick, the glass substrate cannot withstand the thermal expansion force of the resin composition layer and cracks at laminating and cutting; and hardly causes cracks, even when the cured resin layer is thick.SOLUTION: In a laminated body including one or more resin composition layers and one or more glass substrate layers, the resin composition layer is formed of a resin composition including a thermosetting resin and an inorganic filler or a resin composition including the thermosetting resin and a fiber base material, and the glass substrate layer has a thickness of 30-250 μm and is a glass substrate manufactured by a floating method. A laminated plate is obtained by heating and molding the laminated body, and a printed wiring board has a laminated plate provided with a circuit.
摘要翻译：要解决的问题：为了提供一种解决了在具有固化树脂层和玻璃基板层的层叠板中的问题的层压板，当树脂组合物层厚时，玻璃基板不能承受热塑性树脂的热膨胀力树脂组合物层和层压和切割时的裂纹; 即使固化树脂层厚，也难以产生裂缝。溶解性：在具有一个以上树脂组合物层和一个以上的玻璃基板层的层叠体中，树脂组合物层由包含热固性树脂和无机填料或包含热固性树脂和纤维基材的树脂组合物，玻璃基材层的厚度为30-250μm，是通过浮法制造的玻璃基板。通过对叠层体进行加热成型而得到层压板，印刷布线板具有设置有电路的层压板。

84. 发明专利

JP2014120688A Laminated body, laminated plate, multilayer laminated plate, printed wiring board, multilayer printed wiring board, and method for manufacturing laminated plate 有权
标题翻译：层压体，层压板，多层层压板，印刷线路板，多层印刷布线板及其制造方法
公开(公告)号：JP2014120688A
公开(公告)日：2014-06-30
申请号：JP2012276258
申请日：2012-12-18
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： YAMAZAKI YUKA , AOSHIMA MASAHIRO , KAMIGATA YASUO , MURAI HIKARI
IPC分类号： H05K3/46 , B32B17/10 , B32B27/20
摘要： PROBLEM TO BE SOLVED: To provide a laminated plate which solves such a problem that in a laminated plate including a cured resin layer and a glass substrate layer, when a resin composition layer is thick, the glass substrate cannot withstand the thermal expansion force of the resin composition layer and cracks at laminating and cutting; and hardly causes cracks.SOLUTION: In a laminated body including one or more resin composition layers and one or more glass substrate layers, the resin composition layer is formed of a resin composition including a thermosetting resin and an inorganic filler or a resin composition including the thermosetting resin and a fiber base material, and a product d σ of an average thickness d of the resin composition layer after having been cured, and an average value σ of a coefficient of thermal expansion at 30-100°C is 1,000 μm ppm °Cor less. In a printed wiring board, the laminated plate obtained by heating and molding the laminated body is provided with a circuit.
摘要翻译：要解决的问题：为了提供一种解决了在具有固化树脂层和玻璃基板层的层叠板中的问题的层压板，当树脂组合物层厚时，玻璃基板不能承受热塑性树脂的热膨胀力树脂组合物层和层压和切割时的裂纹; 并且几乎不引起裂纹。解决方案：在包括一个或多个树脂组合物层和一个或多个玻璃基底层的层叠体中，树脂组合物层由包含热固性树脂和无机填料的树脂组合物或包含热固性树脂和纤维基材，以及产品d＆固化后的树脂组合物层的平均厚度d，平均值＆sgr; 在30-100℃下的热膨胀系数为1,000μmppm°Cor少。在印刷电路板中，通过对叠层体进行加热和模塑而获得的层压板设置有电路。

85. 发明专利

JP2014111784A Method for producing double-sided adhesive sheet, and the double-sided adhesive sheet 审中-公开
标题翻译：生产双面粘合片的方法和双面粘合片
公开(公告)号：JP2014111784A
公开(公告)日：2014-06-19
申请号：JP2014031933
申请日：2014-02-21
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： KAMOSHITA TAKUYA , HORIUCHI KOHEI , ISHIDA YUKIHISA , KAWAI HIROMASA , YAHATA SHINICHI , OGAWA YOSHINOBU
IPC分类号： C09J7/02 , C09J4/00
摘要： PROBLEM TO BE SOLVED: To provide a method for producing a double-sided adhesive sheet in which photopolymerizable resins having different physical properties are multi-layered without the loss of a light-transparent cover film at a high yield.SOLUTION: Provided is a method for producing a double-sided adhesive sheet having a plurality of resin layers with different physical properties, comprising: (1) a step of simultaneously applying a plurality of photopolymerizable resin compositions to faces as objects for application to form a plurality of resin layers; (2) a step of laminating a light-transparent film on the formed resin layers; and (3) a step of emitting ultraviolet rays or electron beans after the lamination to cure the resin layers.
摘要翻译：要解决的问题：提供一种制备双面粘合片的方法，其中具有不同物理性质的光聚合树脂是多层的，而不会以高产率损失光透过的覆盖膜。解决方案：提供一种方法用于生产具有不同物理性质的多个树脂层的双面粘合片，包括：（1）同时将多个可光聚合的树脂组合物施加到作为用于形成多个树脂层的物体的面的步骤; （2）在形成的树脂层上层叠透光膜的工序; 和（3）在层压后发射紫外线或电子豆以固化树脂层的步骤。

86. 发明专利

JP2014111696A Thermosetting resin composition, prepreg using the same, laminate, and multilayer printed wiring board 有权
标题翻译：热固性树脂组合物，使用它的PREPREG，层压板和多层印刷线路板
公开(公告)号：JP2014111696A
公开(公告)日：2014-06-19
申请号：JP2012266667
申请日：2012-12-05
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： KOTAKE TOMOHIKO , MIYATAKE MASATO , NAGAI SHUNSUKE , HASHIMOTO SHINTARO , TAKANEZAWA SHIN , MURAI HIKARI
IPC分类号： C08G59/00 , C08K3/00 , C08K5/17 , C08K5/20 , C08L35/00 , C08L79/04
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting resin composition particularly excellent in surface smoothness and warpage reduction, a prepreg using the same, a laminate, and a multilayer printed wiring board.SOLUTION: There are provided: the thermosetting resin composition containing (A) at least one thermosetting resin selected from an epoxy resin and a cyanate resin, (B) a maleimide compound having at least two N-substituted maleimide groups in one molecule, (C) an amine compound having at least two primary amino groups in one molecule, (D) a monoamine compound having an acidic substituent, and (E) a rheology control agent; the prepreg using the thermosetting resin composition; the laminate; and the multilayer printed wiring board.
摘要翻译：要解决的问题：提供特别优异的表面光滑度和翘曲降低的热固性树脂组合物，使用该热固性树脂组合物的预浸料，层压体和多层印刷线路板。提供：含有（A）至少一种选自环氧树脂和氰酸酯树脂的热固性树脂，（B）在一个分子中具有至少两个N-取代马来酰亚胺基团的马来酰亚胺化合物，（C）在一个分子中具有至少两个伯氨基的胺化合物，（D）具有酸性取代基的单胺化合物，和（E）流变控制剂; 使用热固性树脂组合物的预浸料; 层压板和多层印刷线路板。

87. 发明专利

JP2014110252A Organic electronics element and method of manufacturing the same 有权
标题翻译：有机电子元件及其制造方法
公开(公告)号：JP2014110252A
公开(公告)日：2014-06-12
申请号：JP2012262320
申请日：2012-11-30
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： ASANO NAOKI , FUNYU SHIGEAKI , ISHIZUKA KENICHI
IPC分类号： H01L51/50 , C07F5/02 , H05B33/10
摘要： PROBLEM TO BE SOLVED: To provide an organic electronics element in which an organic layer can be easily multilayered to allow efficiency of the element to be enhanced, and to provide a method of manufacturing the same.SOLUTION: There are provided: the organic electronics element having at least a laminated structure formed by laminating an electrode, a coating film of a first ink composition containing an ionic compound, and a coating film of a second ink composition containing a charge transport material in a state where they are adjacent to one another; and the method of manufacturing the organic electronics element.
摘要翻译：要解决的问题：提供一种有机电子元件，其中有机层可以容易地多层化，以提高元件的效率，并提供其制造方法。解决方案：提供：有机电子元件至少具有通过层叠电极，含有离子性化合物的第一油墨组合物的涂膜和在彼此相邻的状态下含有电荷输送材料的第二油墨组合物的涂膜而形成的叠层结构; 以及制造有机电子元件的方法。

88. 发明专利

JP2014101399A Cyanate ester-based resin composition, and prepreg and laminate plate using the same 审中-公开
标题翻译：基于氰酸酯的树脂组合物，以及使用它的预制和层压板
公开(公告)号：JP2014101399A
公开(公告)日：2014-06-05
申请号：JP2012252173
申请日：2012-11-16
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： NAGAI YUKI , MIZUNO YASUYUKI , FUKUDA TOMIO
IPC分类号： C08L79/04 , B32B15/09 , B32B27/36 , C08J5/24 , C08K5/13 , C08K5/315 , C08L25/08 , C08L63/00
摘要： PROBLEM TO BE SOLVED: To provide a cyanate ester-based resin composition which can impart excellent dielectric characteristics in a high-frequency region to a printed wiring board while sufficiently securing compatibility with a resin component.SOLUTION: A resin composition contains (A) a saturation type thermoplastic elastomer having a styrene skeleton, (B) a cyanate ester compound, (C) monofunctional phenol, and (D) an epoxy resin. A mass ratio of the styrene with respect to the mass of the whole (A) components is 10% to 70%.
摘要翻译：要解决的问题：提供一种能够在充分确保与树脂成分的相容性的同时，赋予印刷线路板高频区域优异的介电特性的氰酸酯系树脂组合物。溶液：树脂组合物含有（A）具有苯乙烯骨架的饱和型热塑性弹性体，（B）氰酸酯化合物，（C）单官能苯酚和（D）环氧树脂。苯乙烯相对于整个（A）组分的质量的质量比为10％至70％。

89. 发明专利

JP2014099660A Composition for forming p-type diffusion layer, process of manufacturing p-type diffusion layer, and process of manufacturing solar cell element 审中-公开
标题翻译：用于形成P型扩散层的组合物，制造P型扩散层的方法以及制造太阳能电池元件的方法
公开(公告)号：JP2014099660A
公开(公告)日：2014-05-29
申请号：JP2014035733
申请日：2014-02-26
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： MACHII YOICHI , YOSHIDA MASATO , NOJIRI TAKESHI , OKANIWA KAORU , IWAMURO MITSUNORI , ADACHI SHUICHIRO , SATO TETSUYA , KIZAWA KEIKO
IPC分类号： H01L31/04
CPC分类号： H01L31/1864 , C03C8/16 , C03C8/18 , H01L21/2225 , H01L21/2255 , H01L31/022425 , H01L31/032 , H01L31/1804 , Y02E10/547 , Y02P70/521
摘要： PROBLEM TO BE SOLVED: To provide a composition for forming a p-type diffusion layer capable of forming a p-type diffusion layer while suppressing generation of internal stress in a silicon substrate and warpage of the substrate in a manufacturing process of a solar cell element using a silicon substrate, and preventing a lifetime of carriers from largely lowering at a substrate having a p-type diffusion layer obtained thereby, and to provide a process of manufacturing a p-type diffusion layer and a process of manufacturing a solar cell element.SOLUTION: The composition for forming a p-type diffusion layer includes: a glass powder, containing an acceptor chemical element, in which a total amount of lifetime killer chemical elements is 1000 ppm or less; and a dispersion medium. By coating the composition for forming a p-type diffusion layer and performing a thermal diffusion treatment, a p-type diffusion layer and a solar cell element having the same are manufactured.
摘要翻译：要解决的问题：提供一种能够形成p型扩散层的p型扩散层的形成用组合物，同时抑制硅衬底中的内部应力的产生和太阳能电池元件的制造过程中的衬底翘曲使用硅衬底，并且在由其获得的具有p型扩散层的衬底上防止载流子寿命大大降低，并提供制造p型扩散层的工艺和制造太阳能电池元件的工艺。解决方案：用于形成p型扩散层的组合物包括：含有受体化学元素的玻璃粉末，其中终期杀伤化学元素的总量为1000ppm以下; 和分散介质。通过涂布用于形成p型扩散层的组合物并进行热扩散处理，制造p型扩散层和具有该p型扩散层的太阳能电池元件。

90. 发明专利

JP2014097957A Metal dithiocarbamate monomer, and polymer thereof 审中-公开
标题翻译：金属二异氰酸酯单体及其聚合物
公开(公告)号：JP2014097957A
公开(公告)日：2014-05-29
申请号：JP2012250687
申请日：2012-11-14
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： YAMASHITA YUKIHIKO , OCHIAI BUNGO
IPC分类号： C07C333/16 , C07F3/06 , C08F26/02
摘要： PROBLEM TO BE SOLVED: To provide a highly refractive monomer and a polymer thereof.SOLUTION: This invention provides a monomer including a metal atom and a sulfur atom and represented by general formula (1), uses the monomers to prepare a polymer by homopolymerization or copolymerization of the monomers, and prepares a high refractive index material.
摘要翻译：要解决的问题：提供高折射率单体及其聚合物。本发明提供包含金属原子和硫原子并由通式（1）表示的单体，使用单体通过均聚制备聚合物或共聚单体，并制备高折射率材料。

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