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81. 发明专利

JP5294982B2 Electrical connecting apparatus 有权
公开(公告)号：JP5294982B2
公开(公告)日：2013-09-18
申请号：JP2009122771
申请日：2009-05-21
申请人：株式会社日本マイクロニクス
发明人：昌志長谷川
IPC分类号： G01R1/073 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To maximally suppress a circuit chip from being heated to a high temperature. SOLUTION: The electrical connection device includes a support having an upper surface and a lower surface; a probe substrate supported by being assembled on the lower surface of the support with a thickness direction used as a vertical direction; a plurality of contactors mounted on the lower surface of the probe substrate; a chip substrate having a plurality of circuit chips arranged on the upper surface, which is a chip substrate positioned at an interval over the support, in a state where a thickness direction is used as a vertical direction; a heat treatment member for absorbing the heat and discharging the heat on the chip substrate side and on the side different from the chip substrate side, which is a heat treatment member arranged on the lower surface of the chip substrate; and a heat treatment plate mounted on the lower side of the heat treatment member. COPYRIGHT: (C)2011,JPO&INPIT

82. 发明专利

JP5294954B2 Method of manufacturing a probe card 有权
公开(公告)号：JP5294954B2
公开(公告)日：2013-09-18
申请号：JP2009093003
申请日：2009-04-07
申请人：株式会社日本マイクロニクス
发明人：昌志長谷川 , 寿男成田 , 英博清藤
IPC分类号： G01R1/073 , G01R31/26 , G01R31/28 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To suppress a change in XY-coordinate position of a needle point caused by thermal deformation of a support and a probe substrate to the extent possible. SOLUTION: A method of manufacturing a probe card includes the steps of: heating or cooling a card assembly not including a contact to a set temperature; determining a thermal deformation ratio of the probe substrate under the temperature condition; determining a position of mounting the contact on the probe substrate based on the determined thermal deformation ratio; putting the contact on a lower surface of the probe substrate based on the determined mounting position; and obtaining the probe card. The method includes steps of: thereafter heating or cooling the probe card to the set temperature; measuring a needle point position of the contact when the probe card is put under the set temperature; determining whether the measured needle point position is within a reference range; and determining a temperature for using the probe card in testing an object to be tested. COPYRIGHT: (C)2011,JPO&INPIT

83. 发明专利

JP2013171005A Non-contact probe card 有权
标题翻译：非接触式探针卡
公开(公告)号：JP2013171005A
公开(公告)日：2013-09-02
申请号：JP2012036734
申请日：2012-02-22
申请人： Micronics Japan Co Ltd , 株式会社日本マイクロニクス
发明人： KAMIBAYASHI MASATOMO
IPC分类号： G01R1/073 , G01R1/06 , G01R31/26 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To accurately maintain a set interval between a sensor part and a signal pad of an inspected device even if overdrive is applied, and efficiently perform an inspection with high accuracy.SOLUTION: A non-contact probe card according to the present invention relates to non-contact probe cards that maintain the set interval from the inspected device to perform transmission and reception of a signal in an electrically non-contact state. The non-contact probe card is configured to include: a wiring substrate provided with a circuit and the like required for performing the transmission and reception of the signal in the non-contact state; and a plurality of non-contact probes, a power source probe and a GND probe that are provided on one surface of the wiring substrate. The non-contact probe card comprises: a tip contact part; an elastic support part; and a sensor part. With reference to a tip surface of the tip contact part, the sensor part is arranged in an integral structure with the tip contact part by keeping the set interval in a longitudinal direction of the tip contact part from the tip surface thereof.
摘要翻译：要解决的问题：即使施加过驱动，也能精确地保持检测装置的传感器部分和信号焊盘之间的设定间隔，并且高精度地有效地执行检查。解决方案：根据本发明的非接触式探针卡本发明涉及保持与被检查装置的设定间隔以执行电接触状态的信号的发送和接收的非接触式探针卡。非接触探针卡被配置为包括：布线基板，设置有用于执行非接触状态下的信号的发送和接收所需的电路等; 以及设置在布线基板的一个表面上的多个非接触式探针，电源探头和GND探针。非接触探针卡包括：尖端接触部分; 弹性支撑部; 和传感器部件。参照前端接触部的前端表面，通过将前端接触部的长度方向的设定间隔保持在与前端接触部的前端面相同的一体的结构中，将传感器部配置成一体。

84. 发明专利

JP2013145210A Substrate-laminated type probe card 审中-公开
标题翻译：基板层压型探针卡
公开(公告)号：JP2013145210A
公开(公告)日：2013-07-25
申请号：JP2012006445
申请日：2012-01-16
申请人： Micronics Japan Co Ltd , 株式会社日本マイクロニクス
发明人： KONO TAKASHI , ITO TATSUYA , KASAMA TAKAHIRO , AZUMA YUKI
IPC分类号： G01R1/073 , G01R31/26 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To reliably accommodate to even an increase in the number of mounted components and improve workability of assembling work and the like.SOLUTION: A substrate-laminated type probe card includes a plurality of main substrates on which electronic components are mounted, and a fan-out substrate to be connected to a probe side. The respective main substrates are mounted at some intervals apart for mounting the electronic components on both sides thereof. The main substrates and the fan-out substrate are electrically directly connected by connecting means without another substrate electrically interposed therebetween. The respective main substrates and a tester side are electrically directly connected without another substrate electrically interposed therebetween.
摘要翻译：要解决的问题：为了可靠地适应安装部件的数量的增加，提高组装作业等的可加工性。解决方案：基板层叠型探针卡包括多个主基板，电子部件安装在该主基板上，以及与探头侧连接的扇出基板。相应的主基板以一定间隔分开安装，以将电子部件安装在其两侧。主基板和扇出基板通过连接装置电连接而不插入其间的另一基板。相应的主要基板和测试仪侧电连接而没有另一基板电连接在它们之间。

85. 发明专利

JP5239716B2 Led of test equipment 有权
公开(公告)号：JP5239716B2
公开(公告)日：2013-07-17
申请号：JP2008259986
申请日：2008-10-06
申请人：株式会社日本マイクロニクス
发明人：賢一鷲尾 , 昌志長谷川
IPC分类号： G01M11/00 , G01J1/00 , G01J3/50

86. 发明专利

JP2013137241A Parallel confirmation method and parallel confirmation device for probe card, probe card, and test head 有权
标题翻译：并行确认方法和并行确认设备，用于探针卡，探头卡和测试头
公开(公告)号：JP2013137241A
公开(公告)日：2013-07-11
申请号：JP2011288388
申请日：2011-12-28
申请人： Micronics Japan Co Ltd , 株式会社日本マイクロニクス
发明人： KIKUCHI YOSHINORI , HOSHI KATSUSHI
IPC分类号： G01R1/073 , G01R31/26 , G01R31/28 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To securely confirm that a probe card is fitted in parallel to a test head.SOLUTION: There is provided a parallel confirmation method for a probe card that confirms that when the probe card is pressed against and fixed to the test head of an inspection device, the probe card is fitted in parallel to the test head side as a parallel standard. The method includes a fitting process of fitting the probe card to the test head while bringing a height reference surface provided to the test head and a height reference surface provided to the probe card into contact with each other, one to one; and a contact detecting process of detecting a change in physical quantity due to contact between each height reference surface of the test head and each height reference surface of the probe card. The parallel confirmation device includes a contact detecting mechanism which detects a change in physical quantity.
摘要翻译：要解决的问题：安全地确认探头卡与测试头并联安装。解决方案：提供了一种探针卡的并行确认方法，用于确认当探头卡被按压并固定在测试头上时的检测装置，探针卡作为平行标准与测试头侧并联安装。该方法包括将探针卡安装在测试头上的装配过程，同时使提供给测试头的高度参考表面和提供给探针卡的高度参考表面彼此接触; 以及接触检测处理，其检测由于测试头的每个高度参考表面与探针卡的每个高度参考表面之间的接触而导致的物理量的变化。并行确认装置包括检测物理量的变化的接触检测机构。

87. 发明专利

JP5232593B2 Electrical connecting apparatus 有权
公开(公告)号：JP5232593B2
公开(公告)日：2013-07-10
申请号：JP2008269667
申请日：2008-10-20
申请人：株式会社日本マイクロニクス
发明人：衛知大里 , 良仁後藤 , 光洋安部
IPC分类号： G01R31/26 , H01R33/76
CPC分类号： G01R1/0483
摘要： An embodiment of an electrical connecting apparatus comprises an electrical insulating plate, an elastic plate made of an electrical insulating material arranged on the electrical insulating plate, a sheet-like conductive plate arranged on the elastic plate, and first and second contacts. The conductive plate comprises a hole area having at least one first hole portion allowing the probe tip portion of the first contact to abut to the conductive plate and a plurality of second hole portions not allowing the probe tip portions of the second contacts to abut thereon regardless of whether or not overdriving acts on the contacts.

88. 发明专利

JP2013130400A Probe assembly, probe card including the same and manufacturing method thereof 审中-公开
标题翻译：探针组件，包括其的探针卡及其制造方法
公开(公告)号：JP2013130400A
公开(公告)日：2013-07-04
申请号：JP2011278018
申请日：2011-12-20
申请人： Micronics Japan Co Ltd , 株式会社日本マイクロニクス
发明人： NARITA SATOSHI , SASAKI KENJI
IPC分类号： G01R1/073 , G01R31/26
CPC分类号： G01R1/073 , G01R1/07342 , H05K13/00 , Y10T29/49117
摘要： PROBLEM TO BE SOLVED: To improve the quality of a connection part between a probe and wiring in a probe assembly, to shorten the time required for connecting the probe and the wiring, and to eliminate erroneous connection between the probe and the wiring.SOLUTION: A probe assembly comprises an electrically insulated substrate, a plurality of probes supported on one side of the substrate, a plurality of through holes which are provided on the substrate correspondingly to the plurality of probes and filled with conductive materials and of which the conductive materials are adhered to the probes partially, and a plurality of conductive coatings formed on another side of the substrate and adhered to the conductive materials of the plurality of through holes, respectively.
摘要翻译：要解决的问题：为了提高探头组件中的探头和接线之间的连接部分的质量，缩短连接探头和接线所需的时间，并消除探头和接线之间的错误连接。解决方案：探针组件包括电绝缘基板，支撑在基板的一侧上的多个探针，多个通孔，其对应于多个探针设置在基板上并且填充有导电材料，并且其中导电材料是部分地附着在探针上，以及多个导电涂层，分别形成在基板的另一侧并且粘附到多个通孔的导电材料。

89. 发明专利

JP2013127408A Wiring of probe structure unit and manufacturing method 审中-公开
标题翻译：探索结构单元接线和制造方法
公开(公告)号：JP2013127408A
公开(公告)日：2013-06-27
申请号：JP2011277104
申请日：2011-12-19
申请人： Micronics Japan Co Ltd , 株式会社日本マイクロニクス
发明人： NARITA SATOSHI
IPC分类号： G01R1/073 , G01R1/06 , G01R31/26
摘要： PROBLEM TO BE SOLVED: To provide a probe card with a probe structure reducing wiring layers of a multilayer wiring board in a cantilever type probe configured by laminating metal materials by MEMS technique, and to provide a manufacturing method thereof.SOLUTION: A probe structure unit includes probe wiring parts at probe structures 12 for reducing wiring layers of a multilayer wiring board and is manufactured integrally. The probe structure unit includes: an arm having one end on which a needle tip portion is mounted and the other end fixed; and a probe support provided on the fixed end side of the arm. Either one of or both of the arm and the probe support has a multilayer laminate structure formed by laminating a plurality of flat sheets. A laminate layer same as the either one laminate sheet includes a probe wire for connecting the plurality of probe structures 12.
摘要翻译：要解决的问题：提供一种探针结构，其具有通过MEMS技术层叠金属材料构成的悬臂型探针中的多层布线基板的布线层的降低的探针结构，并提供其制造方法。解决方案：探针结构单元包括用于减少多层布线板的布线层的探针结构12处的探针布线部分，并整体制造。探针结构单元包括：臂，其一端安装有针尖部分，另一端固定; 以及设置在臂的固定端侧的探针支架。臂和探针支架中的任一个或两者具有通过层压多个平板形成的多层层压结构。与任一个层合片相同的层叠层包括用于连接多个探针结构12的探针线。版权所有（C）2013，JPO＆INPIT

90. 发明专利

JP2013117476A Probe assembly for inspecting semiconductor device for power and inspection device using the same 有权
标题翻译：用于检查用于功率和检测装置的半导体器件的探针组件
公开(公告)号：JP2013117476A
公开(公告)日：2013-06-13
申请号：JP2011265798
申请日：2011-12-05
申请人： Micronics Japan Co Ltd , 株式会社日本マイクロニクス
发明人： YASUDA KATSUO , MASUDA HIKARI , NEI HIDEKI , ISHIWATARI TATSUYA
IPC分类号： G01R31/26 , G01R1/073 , H01L21/66
CPC分类号： G01R1/067 , G01R1/06777 , G01R1/44 , G01R31/2608
摘要： PROBLEM TO BE SOLVED: To provide a probe assembly for inspecting a semiconductor device for power for preventing the rise of temperature due to the electric conduction of a probe or a semiconductor device, and for performing accurate measurement and an inspection device using the probe assembly.SOLUTION: There is provided the probe assembly for inspecting a semiconductor device for power including: a probe block having a plurality of probe storage holes; a plurality of probes respectively stored in the probe storage holes, that is, the probes the outer periphery of each of which is brought into contact with the inner periphery of each of the probe storage holes, and the lower end of each of which to be brought into contact with an object in inspection is projected from the probe block; and one or more cooling means for cooling the probe block. There is provided an inspection device including the probe assembly.
摘要翻译：要解决的问题：提供一种用于检查用于防止由于探针或半导体器件的导电引起的温度上升的电力的半导体器件的探针组件，并且用于执行精确的测量和使用该测量装置的检查装置探头组件。解决方案：提供用于检查用于功率的半导体器件的探针组件，包括：具有多个探针存储孔的探针块; 分别存储在探针存储孔中的多个探针，即探针，其每个的外周与每个探针存储孔的内周接触，并且每个探针的下端为与检测对象物体接触从探针块投射出来; 以及用于冷却探针块的一个或多个冷却装置。提供了包括探针组件的检查装置。版权所有（C）2013，JPO＆INPIT

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