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71. 发明专利

JP4365667B2 Excellent dissimilar metal joint member and a method for manufacturing the corrosion resistance 有权
公开(公告)号：JP4365667B2
公开(公告)日：2009-11-18
申请号：JP2003396050
申请日：2003-11-26
申请人：株式会社神戸製鋼所
发明人：秀和井戸 , 淳加藤 , 実佳子武田 , 亘漆原
IPC分类号： C23C18/54 , C23F13/00

72. 发明专利

JP2009203527A Corrosion prevention method for steel structure, and anode for forming electrodeposited coating 有权
标题翻译：钢结构腐蚀预防方法和形成电沉积涂层的阳极
公开(公告)号：JP2009203527A
公开(公告)日：2009-09-10
申请号：JP2008046992
申请日：2008-02-28
申请人： Ihi Corp , 株式会社Ihi
发明人： AKAMINE KENICHI , SUZUKI YASUTSUNE
IPC分类号： C23C18/54 , C23F13/00 , E02D31/06
摘要： PROBLEM TO BE SOLVED: To form an electrodeposited coating preventing corrosion of a steel structure in seawater without using an external power source. SOLUTION: An anode 12 for forming an electrodeposited coating is fitted to the part of a steel pipe pile 2 sunk into seawater. The anode 12 for forming an electrodeposited coating is composed of a metal lump 14 essentially composed of magnesium and a core material 13 electrically connected to the steel pipe pile 2. Since a potential difference between magnesium and iron is wide, a large quantity of electrons e are released toward the steel pipe pile 2 from the metal lump 14 in the anode 12 for forming an electrodeposited coating with seawater as an electrolytic solution in a real sea area 3, and reduction reaction between the electrons and oxygen and electrolysis reaction of water are caused so as to generate hydroxide ions. Then, by the hydroxide ions, and, calcium ions, magnesium ions and hydrogen carbonate ions contained in the seawater, an electrodeposited coating composed of calcium carbonate and magnesium hydroxide is formed at the site of the steel pipe pile 2 sunk into the real sea area 3. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：形成电沉积涂层，防止在海水中钢结构的腐蚀而不使用外部电源。解决方案：用于形成电沉积涂层的阳极12安装在沉入海水中的钢管桩2的部分上。用于形成电沉积涂层的阳极12由基本上由镁组成的金属块14和与钢管桩2电连接的芯材13组成。由于镁和铁之间的电位差很大，所以大量的电子e 从阳极12中的金属块14向真空海域3中形成作为电解液的电沉积涂层的电镀层2释放，并且引起电子与氧之间的还原反应和水的电解反应以产生氢氧根离子。然后，通过海水中含有的氢氧根离子，钙离子，镁离子和碳酸氢根离子，在钢管桩2的位置形成由碳酸钙和氢氧化镁组成的电沉积涂层，沉入实际海域 3.版权所有（C）2009，JPO＆INPIT

73. 发明专利

JP2006144076A Chemical plating method 审中-公开
标题翻译：化学镀层法
公开(公告)号：JP2006144076A
公开(公告)日：2006-06-08
申请号：JP2004335702
申请日：2004-11-19
申请人： Nec Schott Components Corp , エヌイーシーショットコンポーネンツ株式会社
发明人： NISHIWAKI SUSUMU
IPC分类号： C23C18/54 , H01L23/50
摘要： PROBLEM TO BE SOLVED: To provide a chemical plating method for consistently and efficiently performing contact or electroless plating.
SOLUTION: In the chemical plating method, when performing the partial plating on an airtight terminal 1 in which a lead member 5 is airtight-sealed to an opening of a metal outer ring 2 with glass 4, an electrochemical sacrifice electrode is provided on the lead member 5 forming a metal to be plated, and immersed in a plating liquid 8. The metal to be plated of the lead member 5 is formed of nickel, and the sacrifice electrode is formed of zinc and tin, and a gold plating film 9 controlled to a desired thickness by immersing the lead member and the sacrifice electrode in gilding liquid is free from any pin hole, and excellent in adhesivity.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一致和有效地进行接触或化学镀的化学镀方法。解决方案：在化学镀方法中，当在使用玻璃4将引线部件5气密密封到金属外环2的开口的气密端子1上进行部分电镀时，提供电化学牺牲电极在形成被镀金属的引线部件5上浸渍在电镀液8中。引线部件5的被镀金属由镍形成，牺牲电极由锌和锡形成，镀金通过将引线部件和牺牲电极浸渍在镀金液中而控制到所需厚度的薄膜9没有任何针孔，并且粘合性优异。版权所有（C）2006，JPO＆NCIPI

74. 发明专利

JP2005206945A Method for maintaining plating bath 审中-公开
标题翻译：维护镀层浴的方法
公开(公告)号：JP2005206945A
公开(公告)日：2005-08-04
申请号：JP2005008890
申请日：2005-01-17
申请人： Enthone Inc , エンソーンインコーポレイテッド
发明人： MOBIUS ANDREAS , KONIG AXEL , DUN HUBERTUS F A M VAN
IPC分类号： C23C18/54 , B01D61/24 , B01D61/44 , B01D61/54 , C23C18/16
CPC分类号： C23C18/1617 , B01D61/243 , B01D61/44
摘要： PROBLEM TO BE SOLVED: To ensure the longer usable time and driving performance of an electrolyte used for the electroless deposition of metal.
SOLUTION: At least the partial flow of an electrolyte is derived to a regeneration apparatus from a process vessel, the derived electrolyte flow is regenerated, and the regenerated electrolyte flow is returned to the process vessel. The regeneration apparatus has a dialyzer and/or an electrodialyzer provided with an anion selectable film, and anions generated in the electroless plating process are exchanged with hydroxide ions. The regenerated electrolyte flow compensates for consumed components.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：确保用于金属化学沉积的电解质的更长的可用时间和驱动性能。解决方案：至少电解质的部分流动从处理容器导出到再生装置，所产生的电解质流被再生，并且再生的电解质流返回到处理容器。再生装置具有透析器和/或具有阴离子选择膜的电渗析器，并且在化学镀处理中产生的阴离子与氢氧根离子交换。再生的电解质流补偿消耗的组分。版权所有（C）2005，JPO＆NCIPI

75. 发明专利

JP2004131800A Conductive electroless plating powder and method for manufacturing the same 有权
标题翻译：导电电镀粉末及其制造方法
公开(公告)号：JP2004131800A
公开(公告)日：2004-04-30
申请号：JP2002297901
申请日：2002-10-10
申请人： Nippon Chem Ind Co Ltd , 日本化学工業株式会社
发明人： OYAMADA MASAAKI , ABE SHINJI , KAWAZOE TETSUHIRO
IPC分类号： C23C18/34 , C23C18/30 , C23C18/44 , C23C18/54
摘要： PROBLEM TO BE SOLVED: To provide conductive electroless plating powder having improved adhesion properties of a plating film and core member powder, and to provide a method for manufacturing the powder.
SOLUTION: The conductive electroless plating powder in which a nickel film is formed by an electroless plating method on the surface of the core member powder is characterized in that grain boundaries are not admitted at the section in the thickness direction of the nickel film when the section is observed by a scanning electron microscope at magnifying power up to 100,000 times.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供具有改善的镀膜和芯构件粉末的粘附性的导电化学镀粉末，并提供制造粉末的方法。解决方案：在芯材粉末的表面上通过无电镀法形成镍膜的导电化学镀粉末的特征在于，在镍膜的厚度方向的截面处不允许晶界当通过扫描电子显微镜以放大功率观察截面达100,000次时。版权所有（C）2004，JPO

76. 发明专利

JP2004124261A Electroless precipitation method for metal 有权
公开(公告)号：JP2004124261A
公开(公告)日：2004-04-22
申请号：JP2003346929
申请日：2003-10-06
申请人： Enthone Inc , エンソーンインコーポレイテッド
发明人： STARK FRANZ-JOSEF , HORSTHEMKE HELMUT , TREUNER ULRICH
IPC分类号： C23C18/54 , C23C18/36
CPC分类号： C23C18/36 , C23C18/1617 , C23C18/1662
摘要： PROBLEM TO BE SOLVED: To provide an electrolyte for electroless precipitation by which a uniform metal phosphorus film having fixed film properties and a fixed phosphorus content, and free of fine pores and cracks can be precipitated at a higher precipitation rate for a relatively long period of time.
SOLUTION: The electrolyte is used for precipitating a nickel film comprising a metal basic salt, a reducing agent, a complexing agent, an accelerator and a stabilizer, and having residual compressive stress. The electrolyte comprises a metal salt in which the anion includes at least one carbon atom, and whose initial concentration is 0.01 to 0.30 mol/l as the metal basic salt. As the metal salt in which the anion includes at least one carbon atom, at least one salt selected from the group consisting of a metal acetate, metal formate, metal oxalate, metal nitrate, metal propionate, metal citrate and metal ascorbate, in particular, metal acetate is used. In the method suitable for the application of the same electrolyte, a metal coating having closed substance circulation, particularly free of fine pores and cracks, and having fixed film properties is uniformly precipitated for a using time of a bath of at least 14 to 22 MTO (metal turn over).
COPYRIGHT: (C)2004,JPO

77. 发明专利

JP3456092B2 Hydrogen storage alloy body and a method of manufacturing the same 失效
公开(公告)号：JP3456092B2
公开(公告)日：2003-10-14
申请号：JP16317596
申请日：1996-06-24
申请人：株式会社豊田自動織機
发明人：一彦伊東 , 友仁伊藤 , 貴司吉田 , 君江宮野 , 真一砥綿
IPC分类号： C22C1/00 , B22F1/02 , C22C30/02 , C23C18/54 , C23F1/30 , H01M4/24 , H01M4/26 , H01M4/38
CPC分类号： Y02E60/124

78. 发明专利

JP2003503597A Corrosion resistance of semiconductor processing equipment member and a method of manufacturing the same 有权
公开(公告)号：JP2003503597A
公开(公告)日：2003-01-28
申请号：JP2001506301
申请日：2000-06-14
申请人：ラムリサーチコーポレーション
发明人：ロバート，ジェイ．ステガー， , クリスチャン，
IPC分类号： C23C18/31 , C23C18/36 , C23C18/50 , C23C18/54 , C23C28/00
CPC分类号： C23C28/321 , C23C18/36 , C23C28/00 , C23C28/34 , C23C28/345
摘要： (57)【要約】プラズマ・チャンバなどの半導体処理装置の耐腐食性部材が、ニッケル−リンめっきとその外側がアルミナ、炭化シリコン、窒化シリコン、炭化ホウ素または窒化アルミニウムなどのセラミック・コーティングでコートされたアルミニウムまたはアルミニウム合金、ステンレス鋼、あるいは高融点金属などの金属表面を含む。ニッケル−リンめっきは無電界めっきによって堆積でき、セラミック・コーティングは熱溶射によって堆積することができる。セラミック・コーティングをよく付着させるために、セラミック・コーティングを堆積する前に、ニッケル−リンめっきに表面粗化処理をすることもできる。

79. 发明专利

JP2002289654A SEMICONDUCTOR DEVICE TAPE CARRIER AND ITS MANUFACTURING METHOD 失效
公开(公告)号：JP2002289654A
公开(公告)日：2002-10-04
申请号：JP2001086914
申请日：2001-03-26
申请人： HITACHI CABLE
发明人： AKINO HISANORI , MIZUNO MASAHIRO , SUGANO MASARU
IPC分类号： C23C18/31 , C23C18/54 , C23C28/00 , C23C30/00 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To prevent excess melting of copper of a lead wire in a lower part of a solder resist and suppress the whisker of tin plating in a semiconductor device tape carrier. SOLUTION: A tin-plated layer 4 of 0.01 to 0.2 μm in thickness is formed on the whole surface of a copper foil which is formed on a dielectric film 1 via an adhesive layer 2 and is heat-treated, and a photo resist is coated on it, a fine wiring pattern 30 then is formed on the copper foil 3 by performing treatments of exposure, development, etching, and layer peeling. Thereafter, the solder resist 6 is applied on the wiring pattern in a position except its terminal portion, a tin-plated layer 4 of 0.15 to 0.80 μm in thickness 4 is formed on the terminal portion, and a tin-copper alloy layer 5b of 0.20 μm or more in thickness and a pure tin layer 4b of 0.15 to 0.80 μm in thickness are formed by heat treatment.

80. 发明专利

JP2000132830A MAGNETIC RECORDING MEDIUM AND ITS PRODUCTION 失效
公开(公告)号：JP2000132830A
公开(公告)日：2000-05-12
申请号：JP30053498
申请日：1998-10-22
申请人： FUJI ELECTRIC CO LTD
发明人： SAKAGUCHI SHOJI , MASUDA MITSUO
IPC分类号： G11B5/82 , C23C18/54 , C23C22/32 , G11B5/738 , G11B5/84
摘要： PROBLEM TO BE SOLVED: To provide a magnetic recording medium in which the flying height of a magnetic head can be reduced and the flying running stability of the magnetic head is improved by providing a manufacturing method capable of reducing the roll off of the outer peripheral part of a magnetic recording medium to reduce contact with the head in the outer peripheral part of the medium. SOLUTION: At the time of forming a foundation layer 12 consisting of Ni-P layers with an electroless plating method on a disk substrate 11, plating is performed while making the substrate 11 rotate and revolve to control film thickness of plated layers of the surface of the inside of the substrate 12 and the surface of the outer peripheral part of the substrate 12 by controlling the rotating speed and the revolving speed at that time. After the film thickness of the outer peripheral part of the substrate 2 is made to be thicker than that of the inside of the layer 12 by 2% to 8% by using this technology and a polishing and texturing processing is applied to these surfaces, a recording medium 1 in which the roll off of the outer peripheral part is small can be obtained by manufacturing the media 1 while forming a magnetic layer 13 and a protective layer 14 and the media 1 in with the flying height of the head can be reduced at the flying running stability of the head is improved is obtained.

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