专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

71. 发明专利

JP2014031468A Conductive composition and electric device 有权
标题翻译：导电组合物和电器件
公开(公告)号：JP2014031468A
公开(公告)日：2014-02-20
申请号：JP2012173936
申请日：2012-08-06
申请人： Lintec Corp , リンテック株式会社
发明人： NISHIJIMA KENTA , KATO KUNIHISA , KONDO KEN , MUTO TAKESHI
IPC分类号： C08L29/04 , C08K5/09 , C08L39/06 , C08L65/00 , C08L79/00 , H01B1/20 , H01L51/50
摘要： PROBLEM TO BE SOLVED: To provide a conductive composition which can form a conductive layer having low surface resistivity and good conductivity, and an electronic device including a conductive layer formed from the conductive composition.SOLUTION: A conductive composition includes water-soluble polyvinyl polymer (A), water-soluble carboxylic acid (B) with a melting point of 30-133°C, and at least one conductive organic polymer compound (C) selected from the group consisting of polyaniline, polypyrrole, polythiophene, and derivative thereof.
摘要翻译：要解决的问题：提供可形成具有低表面电阻率和良好导电性的导电层的导电组合物，以及包括由导电组合物形成的导电层的电子器件。溶液：导电组合物包括水溶性聚乙烯基聚合物 A），熔点为30-133℃的水溶性羧酸（B）和至少一种选自聚苯胺，聚吡咯，聚噻吩及其衍生物的导电有机高分子化合物（C）。

72. 发明专利

JP2014030039A Sheet peeling device, and peeling method 有权
标题翻译：薄膜剥离装置和剥离方法
公开(公告)号：JP2014030039A
公开(公告)日：2014-02-13
申请号：JP2013193797
申请日：2013-09-19
申请人： Lintec Corp , リンテック株式会社
发明人： YOSHIOKA TAKAHISA , SUGISHITA YOSHIAKI
IPC分类号： H01L21/683 , C09J5/00 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To prevent a defect in peeling of an adhesive sheet.SOLUTION: A sheet peeling device 10 peels an adhesive sheet S, stuck on one surface of a wafer W, from the wafer W through a peeling tape PT. The adhesive sheet S includes: a base sheet; and an adhesive layer provided on one surface of the base sheet. The sheet peeling device 10 includes: cutting means 16 for cutting the base sheet and adhesive layer; payoff means 12 for paying off the peeling tape PT; sticking means 14 for sticking the peeling tape PT on the adhesive sheet S; and moving means 15 capable of peeling the adhesive sheet S by moving the wafer W and peeling tape PT relatively. The cutting means 16 is so provided as to cut the adhesive sheet S into a plurality of division sheets by making a cut whose ends both reach outer edges of the base sheet respectively.
摘要翻译：要解决的问题：防止粘合片剥离的缺陷。解决方案：片材剥离装置10通过剥离带PT从晶片W剥离粘附在晶片W的一个表面上的粘合片S. 粘合片S包括：基片; 以及设置在基片的一个表面上的粘合剂层。片材剥离装置10包括：用于切割基片和粘合剂层的切割装置16; 用于支付剥离胶带PT的回收装置12; 用于将剥离带PT粘贴在粘合片S上的粘贴装置14; 以及通过相对移动晶片W和剥离胶带PT能够剥离粘合片S的移动装置15。切割装置16设置成通过使端部分别到达基片的外缘的切口将粘合片S切割成多个分割片。

73. 发明专利

JP2014027171A Sheet sticking device and sheet sticking method 审中-公开
标题翻译：薄片贴边装置及薄片贴边方法
公开(公告)号：JP2014027171A
公开(公告)日：2014-02-06
申请号：JP2012167565
申请日：2012-07-27
申请人： Lintec Corp , リンテック株式会社
发明人： KATO HIDEAKI , TAKANO TAKESHI , TSUJIMOTO MASAKI
IPC分类号： H01L21/683 , H01L21/301
摘要： PROBLEM TO BE SOLVED: To provide a sheet sticking device which can supply a supply material without stopping a device and prevent deterioration of processing capacity per unit time of the device.SOLUTION: A sheet sticking device includes: a frame stocker in which a plurality of pieces of frame storage means capable of storing a plurality of frame members RF; support means 4 which supports the frame member RF and an adherend WF; transfer means which takes out the frame member RF accommodated in one of the plurality of pieces of frame storage means arranged in the frame stocker and transfers it to the support means 4; sheet supply means 6 which has a plurality of original sheet support members 61 for supporting original sheets RS to which first adhesive sheets AS are temporarily adhered; original sheet connection means 7 which connects an end region of the original sheet RS supported by one of the plurality of original sheet support members 61 and a tip region of the original sheet supported by the other original sheet support member; and sticking means 8 which brings the first adhesive sheets AS into contact with the frame member RF and the adherend WF supported by the support means 4 to stick the first adhesive sheets to the frame member and the adherend.
摘要翻译：要解决的问题：提供一种能够在不停止装置的情况下供给供给材料并防止设备的每单位时间的处理能力的劣化的片材粘贴装置。解决方案：片材贴装装置包括：框架储存器，其中多个能够存储多个帧构件RF的帧存储装置; 支撑框架构件RF和被粘物WF的支撑装置4; 传送装置，其将设置在框架储存器中的多个框架存储装置中的一个中的框架构件RF取出并将其传送到支撑装置4; 纸张供给装置6具有多个用于支撑暂时粘附有第一粘合片AS的原稿RS的原稿片材支撑部件61; 原稿片连接装置7，其连接由多个原稿片支承部件61中的一个支撑的原件片RS的端部区域与由另一个原稿片材支承件支承的原件片材的末端区域; 以及粘贴装置8，其使第一粘合片AS与由支撑装置4支撑的框架构件RF和被粘物WF接触，以将第一粘合片粘贴到框架构件和被粘物。

74. 发明专利

JP2014010473A Antenna circuit member, ic inlet, ic chip protection method and method for manufacturing antenna circuit member 审中-公开
标题翻译：天线电路成员，IC输入，IC芯片保护方法和制造天线电路成员的方法
公开(公告)号：JP2014010473A
公开(公告)日：2014-01-20
申请号：JP2012144335
申请日：2012-06-27
申请人： Lintec Corp , リンテック株式会社
发明人： MATSUSHITA KAORI , MATSUBAYASHI FUMIO , KAMATA MINORU
IPC分类号： G06K19/077 , G06K19/07
CPC分类号： H01L2224/73204
摘要： PROBLEM TO BE SOLVED: To provide an antenna circuit member capable of easily protecting an IC chip, and an IC inlet using the antenna circuit member, and to provide an IC chip protection method capable of easily protecting the IC chip, and a method for manufacturing the antenna circuit member.SOLUTION: An antenna circuit member 2A includes a base material 3, antenna wiring 4 provided on the base material 3, an IC chip mounting part 6 provided at the antenna wiring 4, and an IC chip reinforcing layer 7 formed by coating in the periphery of the IC chip mounting part 6. An IC inlet 2 includes the antenna circuit member 2A, and an IC chip 5 mounted in the IC chip mounting part 6.
摘要翻译：要解决的问题：提供一种能够容易地保护IC芯片的天线电路部件和使用天线电路部件的IC插座，并提供能够容易地保护IC芯片的IC芯片保护方法及其制造方法天线电路构件。解决方案：天线电路构件2A包括基材3，设置在基材3上的天线布线4，设置在天线布线4处的IC芯片安装部6和由IC芯片加强层7形成的IC芯片加强层7 在IC芯片安装部分6的外围涂覆IC封装。IC入口2包括天线电路部件2A和安装在IC芯片安装部分6中的IC芯片5。

75. 发明专利

JP2014003195A Sheet application device and application method 有权
标题翻译：表格应用程序和应用方法
公开(公告)号：JP2014003195A
公开(公告)日：2014-01-09
申请号：JP2012138430
申请日：2012-06-20
申请人： Lintec Corp , リンテック株式会社
发明人： KATO HIDEAKI , KIMURA KOJI
IPC分类号： H01L21/683 , H01L21/301
摘要： PROBLEM TO BE SOLVED: To provide a sheet application device and application method which prevent the deterioration of the processing capacity per unit time when a frame member is replaced.SOLUTION: A sheet application device 1 includes: first and second frame housing means 3A, 3B capable of housing multiple frame members RF, each of which is integrated with an adherend WF through an adhesion sheet; supporting means 6 which supports at least the frame member RF from among the frame member RF and the adherend WF; transporting means 7 which transports the frame member RF from the first frame housing means 3A to the supporting means 6; application means 9 which places the adhesive sheet in contact with the frame member RF supported by the supporting means 6 or the frame member RF and the adherend WF to apply the adhesive sheet thereto; and transfer means 10 which transfers the frame member RF from the second frame housing means 3B to the first frame housing means 3A.
摘要翻译：要解决的问题：提供一种在更换框架构件时防止每单位时间的处理能力恶化的片材施加装置和施加方法。解决方案：片材施加装置1包括：第一和第二框架壳体装置3A，3B 能够容纳多个框架构件RF，每个框架构件通过粘合片与被粘物WF集成; 支撑装置6，其支撑框架构件RF和被粘物WF中的至少框架构件RF; 传送装置7，其将框架构件RF从第一框架壳体装置3A传送到支撑装置6; 将粘合片与由支撑装置6或框架构件RF和被粘物WF支撑的框架构件RF接触的施加装置9将粘合片施加到其上; 以及将框架构件RF从第二框架壳体装置3B传送到第一框架壳体装置3A的传送装置10。

76. 发明专利

JP2014002188A Method of manufacturing light diffusion film 有权
标题翻译：制造光扩散膜的方法
公开(公告)号：JP2014002188A
公开(公告)日：2014-01-09
申请号：JP2012135603
申请日：2012-06-15
申请人： Lintec Corp , リンテック株式会社
发明人： KATAGIRI BAKU , KUSAMA KENTARO , ORUI TOMOO
IPC分类号： G02B5/02 , B32B7/02
摘要： PROBLEM TO BE SOLVED: To provide a method of easily manufacturing a light diffusion film, which has good incident angle dependence of light transmission and diffusion and a wide light diffusion incident angle range, using a linear light source.SOLUTION: A method of manufacturing a light diffusion film having a first structural region and a second structural region includes steps (a) to (d) as follows: (a) a step for preparing a light diffusion film composition, (b) a step for forming a coating layer, (c) a step for forming a prescribed louver structure region as the first structural region in the lower portion of the coating layer while leaving a region without a louver structure in the upper portion of the coating layer, (d) a step for forming a prescribed columnar structure region as the second structural region in the region without a louver structure, where active energy ray irradiation is done by irradiating the coating layer with irradiation light from a linear light source via an irradiation light collimating member.
摘要翻译：要解决的问题：提供一种使用线性光源容易地制造光扩散膜的方法，该方法具有良好的光透射扩散入射角依赖性和宽的光扩散入射角范围。解决方案：制造具有第一结构区域和第二结构区域的光漫射膜包括以下步骤（a）至（d）：（a）制备光漫射膜组合物的步骤，（b）形成涂层的步骤（ c）在涂层的上部形成规定的百叶窗结构区域作为涂层下部的第一结构区域，同时留下没有百叶窗结构的区域，（d）形成规定的步骤在没有百叶窗结构的区域中作为第二结构区域的柱状结构区域，其中通过经由线性光源的照射光照射涂层进行活性能量射线照射， n照射光准直构件。

77. 发明专利

JP2014002187A Light diffusion film 有权
标题翻译：光扩散膜
公开(公告)号：JP2014002187A
公开(公告)日：2014-01-09
申请号：JP2012135602
申请日：2012-06-15
申请人： Lintec Corp , リンテック株式会社
发明人： ORUI TOMOO , KUSAMA KENTARO , TOMIOKA KENTA , KATAGIRI BAKU
IPC分类号： G02B5/02
摘要： PROBLEM TO BE SOLVED: To provide a light diffusion film whose incident light diffusion area has been effectively increased by allowing incident light to diffuse not only in a longitudinal direction of the film but also in a direction orthogonal to the longitudinal direction.SOLUTION: A longitudinally extending light diffusion film has a first louver structure and a second louver structure arranged in order from the bottom in the film thickness direction. The first louver structure and the second louver structure each comprise a plurality of tabular regions, each having a different refractive index, which are arranged alternately in parallel in an arbitrary direction along the film surface. Looking from above the film, an acute angle θ1 between an extending direction of the tabular regions in the first louver structure and an extending direction of the tabular regions in the second louver structure shall be within a range of 10 to 90 degrees.
摘要翻译：要解决的问题：提供一种光扩散膜，其通过使入射光不仅在膜的长度方向上而且在与纵向方向正交的方向上也能够有效地增加入射光扩散面积。解决方案：纵向延伸光漫射膜具有从底部沿膜厚度方向依次排列的第一百叶窗结构和第二百叶窗结构。第一百叶窗结构和第二百叶窗结构各自包括多个平片状区域，每个具有不同的折射率，沿着膜表面沿任意方向交替平行布置。从薄膜的上方观察，第一百叶窗结构中的平板状区域的延伸方向与第二百叶窗结构中的平板状区域的延伸方向之间的锐角和角度为1.在10至90度的范围内。

78. 发明专利

JP2013251448A Sheet peeling device and sheet peeling method 有权
标题翻译：薄片剥离装置和薄片剥离方法
公开(公告)号：JP2013251448A
公开(公告)日：2013-12-12
申请号：JP2012126209
申请日：2012-06-01
申请人： Lintec Corp , リンテック株式会社
发明人： SUGISHITA YOSHIAKI
IPC分类号： H01L21/683 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a sheet peeling device and a sheet peeling method capable of peeling an unpeeled sheet by connecting with a peeling sheet, even if an already peeled sheet and an unpeeled sheet cannot be bonded.SOLUTION: An unpeeled sheet AS2 is peeled from a wafer body WF to obtain an already peeled sheet AS1, which is then connected to the unpeeled sheet AS2 of a next wafer WF and a tension is given thereto. When an already peeled sheet AS1 cannot be bonded to an unpeeled sheet AS2, it can be connected indirectly by a peeling sheet PS. Connection means 15 performs direct connection of an already peeled sheet AS1 and an unpeeled sheet AS2, and indirect connection of an already peeled sheet AS1 and an unpeeled sheet AS2 via a peeling sheet selectively.
摘要翻译：要解决的问题：提供一种能够通过与剥离片连接来剥离未剥离片材的片材剥离装置和片材剥离方法，即使已经剥离的片材和未剥离的片材不能被粘合。解决方案：未剥皮片材AS2为从晶片体WF剥离以获得已经剥离的片材AS1，然后将其连接到下一个晶片WF的未剥离片材AS2并给予张力。当已经剥离的片材AS1不能结合到未剥离片材AS2时，可以通过剥离片材PS间接地连接。连接装置15直接连接已经剥离的片材AS1和未剥离片材AS2，并且经由剥离片材选择性地间接连接已经剥离的片材AS1和未剥离片材AS2。

79. 发明专利

JP2013235980A Sheet pasting device and method for pasting sheet 审中-公开
标题翻译：表面处理装置和方法
公开(公告)号：JP2013235980A
公开(公告)日：2013-11-21
申请号：JP2012107787
申请日：2012-05-09
申请人： Lintec Corp , リンテック株式会社
发明人： SUGISHITA YOSHIAKI
IPC分类号： H01L21/683
摘要： PROBLEM TO BE SOLVED: To provide a sheet pasting device capable of suppressing device upsizing.SOLUTION: A sheet pasting device 1 comprises: support means 2 for supporting a wafer WF; and pasting means 5 for pressing and pasting an adhesive sheet AS to the wafer WF supported by the support means 2. The support means 2 is provided so that the wafer WF arranged in a position apart from the support means 2 can be supported and transported. The pasting means 5 is provided so that the adhesive sheet AS can be pasted to the wafer WF being transported.
摘要翻译：要解决的问题：提供能够抑制装置尺寸增大的片材粘贴装置。解决方案：片材粘贴装置1包括：用于支撑晶片WF的支撑装置2; 以及用于将粘合片AS压入和粘贴到由支撑装置2支撑的晶片WF的粘贴装置5.支撑装置2被设置成使得布置在远离支撑装置2的位置的晶片WF能够被支撑和运输。提供了粘贴装置5，使得粘合片AS可以被粘贴到被输送的晶片WF上。

80. 发明专利

JP2013215893A Apparatus and method of printing 有权
标题翻译：装置和打印方法
公开(公告)号：JP2013215893A
公开(公告)日：2013-10-24
申请号：JP2012085653
申请日：2012-04-04
申请人： Lintec Corp , リンテック株式会社
发明人： AMIMOTO MASANORI
IPC分类号： B41F33/06 , B41F33/08 , B41F33/14
摘要： PROBLEM TO BE SOLVED: To provide a printing apparatus capable of surely performing overprint.SOLUTION: A printing apparatus includes a sheet conveying means normally sending and reversely sending a belt-like raw sheet RS in an extending direction, and a plurality of respective printing units 3A-3C having plate cylinders 32 performing print on a normally sent original sheet RS. A sending control means is caused to perform: sending processing for print in which the raw sheet RS is normally sent by the sheet conveying means and the respective printing units 3A-3C are caused to perform printing; or reverse sending processing for overprint in which the raw sheet RS is reversely sent so that the respective printing units 3A-3C perform overprint. A print avoiding means 4 avoids printing performed by the respective printing units 3A-3C during a period when the sending processing for over print is performed.
摘要翻译：要解决的问题：提供一种能够可靠地执行套印的打印设备。解决方案：打印设备包括通常沿延伸方向发送和反向传送带状原纸RS的纸张传送装置，以及多个相应的打印单元 3A-3C具有在正常发送的原稿片RS上执行打印的印版滚筒32。使发送控制装置执行：通过纸张传送装置正常发送原始纸张RS的打印的发送处理和相应的打印单元3A-3C进行打印; 或反向发送处理，其中原纸RS反向发送，使得各打印单元3A-3C进行套印。打印避免装置4避免在执行用于过度打印的发送处理的时间段期间由各个打印单元3A-3C执行的打印。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式