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    • 75. 发明专利
    • FIBER FOR CONSTITUTING MAGNETIC CIRCUIT
    • JPH09330808A
    • 1997-12-22
    • JP14713196
    • 1996-06-10
    • HITACHI CABLE
    • KUMA SHOJISATO JUNICHINOMURA KATSUMI
    • H01F1/18
    • PROBLEM TO BE SOLVED: To reduce the dimension of a magnetism applied device by making the circuit configuration simpler by coating the outer periphery of a linear core material made of a high-permeability material with a superconducting material composed of a magnetic insulator. SOLUTION: A core material 11 made of a high-permeability material, such as Supermalloy, etc., is covered with a coating 12 made of a superconducting material, such as a Bi-based oxide superconducting material. In addition, an outside magnetic conductor layer made of the same material as the core material 11 is coaxially provided on the coating 12. Moreover, the core material 11 and coating 12 are separated from each other with a layer of a different metal, such as silver, etc., and the surface of the coating 12 is covered with a layer of a different metal, such as silver, etc. Therefore, the loss of a magnetic circuit can be reduced and the magnetic circuit which has been made in a large size due to leakage can be made in a very small size.
    • 77. 发明专利
    • PRODUCTION OF GAAS SINGLE CRYSTAL
    • JPH09142997A
    • 1997-06-03
    • JP30298095
    • 1995-11-21
    • HITACHI CABLE
    • SUZUKI TAKASHISHIBATA MASATOMOKUMA SHOJI
    • C30B15/20C30B27/02C30B29/42H01L21/208
    • PROBLEM TO BE SOLVED: To uniformly distribute the carbon concn. in a GaAs single crystal within a prescribed range with good accuracy by a simple control method in a process for producing the single crystal by a liquid sealed pulling-up method (LEC method). SOLUTION: Gaseous carbon monoxide or gas which generates carbon monoxide in a vessel 1 for crystal growth is introduced into the vessel 1. The concn. of the carbon monoxide in the vessel 1 is set at a prescribed value and thereafter, the crystal growth is started. The concn. of the carbon monoxide in an inert gas is kept detected during the crystal growth. The rate of generating the carbon monoxide generated per unit time in the vessel 1 is then determined. The gas substitution rate for substituting the gas in the vessel 1 necessary for controlling the concn. of the carbon monoxide in the vessel 1 to a desired value is determined from the determined generation rate and the volume of the vessel 1. The flow rate of the gas to be introduced into the vessel 1 during the crystal growth and the flow rate of the gas to be discharged from the vessel 1 are controlled in accordance with the gas substitution rate. The gaseous carbon monoxide or the gas which generates carbon monoxide in the vessel 1 for crystal growth is introduced into the vessel 1. The GaAs single crystal is grown while the pressure in the vessel 1 under the crystal growth is kept at .
    • 79. 发明专利
    • SURFACE TREATMENT OF EPITAXIAL WAFER
    • JPH0864567A
    • 1996-03-08
    • JP19976994
    • 1994-08-24
    • HITACHI CABLE
    • SATO TOYOHIKOUNNO TSUNEHIROKUMA SHOJI
    • C30B33/08H01L21/304H01L21/308
    • PURPOSE: To enhance the velocity of dissolution of an Si crystal by a method wherein GaAs or GaAlAs epitaxial wafers with the Si crystal adhered on their surfaces are dipped in an HF tank of a specified concentration or higher in the range of a special temperature in the range of a special time and thereafter, are dipped in an aqueous solution, which is a strong alkali, and the Si crystal is selectively dissolved. CONSTITUTION: A wafer carrier 1, in which GaAs epitaxial wafers or GaAlAs epitaxial wafers With an Si crystal adhered on their surfaces are set, is dipped in an HF tank 2 of a concentration of 20% or higher at a temperature of 0 deg.C or higher and 50 deg.C or lower in a hour of 10 minutes or longer to 30 minutes or shorter and an oxide film on the surfaces adhered with the Si crystal is removed. After that, the wafer carrier 1 is rapidly moved to a pure water water tank 3 and after being dipped in the water tank 3 for about 10 seconds, the carrier 1 is moved to a KOH water tank 4, which is a strong alkali, the Si crystal is selectively dissolved and the dissolution of the Si crystal is made to accelerate more effectively. Thereby, the time to take for the dissolution of the Si crystal can be significantly shortened and the epitaxial wafers can be produced at lower cost.