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    • 1. 发明专利
    • PRODUCTION OF COMPOUND SEMICONDUCTOR SINGLE CRYSTAL
    • JPH01264995A
    • 1989-10-23
    • JP9110288
    • 1988-04-13
    • HITACHI CABLE
    • SEKI MINORUTAWARASAKO SHUICHI
    • H01L21/208C30B27/02
    • PURPOSE:To suppress the polycrystallization during the growth of the single crystal and to decrease the concn. of carbon in the crystal by adopting the constitution consisting in inserting the bottom end of a specific cylindrical body into a liquid sealing layer without directly inserting a sub-heater for local heating in order to suppress the polycrystallization into the liquid sealing layer at the time of pulling up the compound semiconductor single crystal by an LEC method. CONSTITUTION:A crystal raw material melt 4 housed in a crucible 3 heated by a heater 1 is covered by the liquid sealing layer 5 and the single crystal 6 grown by pulling up the same from the melt 4 is pulled up while heating the crystal 6 by the cylindrical sub-heater 7 provided on the outside circumference of the single crystal 6. The under-mentioned constitution is added in this method: At least either of the inside or outside surface of the sub-heater 7 is covered by the cylindrical body 8 which is made of pyrolytic boron nitride and projects downward from the bottom end of the sub-heater 7. The bottom end of the above-mentioned cylindrical body 8 is inserted into the liquid sealing layer 5 without bringing the sub-heater into contact with the liquid sealing layer 5.
    • 2. 发明专利
    • PRODUCTION OF COMPOUND SEMICONDUCTOR SINGLE CRYSTAL
    • JPS63239191A
    • 1988-10-05
    • JP7133687
    • 1987-03-27
    • HITACHI CABLE
    • YASUDA SADAOTAWARASAKO SHUICHISEKI MINORU
    • C30B27/02
    • PURPOSE:To enhance the purity of the title single crystal by preheating a crucible contg. a raw material and a capsulating agent by a separate melting furnace to enclose the raw material with the capsulating agent, and then transferring the crucible to a pulling up furnace to grow a single crystal at the time of producing the compd. semiconductor single crystal by the LEC method. CONSTITUTION:A seed crystal is brought into contact with the raw material soln. enclosed by the capsulating agent in the pulling up furnace, and pulled up the seed crystal to produce the compd. semiconductor single crystal. In this case, the following constitution is used. Namely, the raw materials 5 and 6 and capsulating agent 7 contained in the crucible 4 is heated (heater 2) by a melting furnace 1 not using a carbon material in an inert gas atmosphere to melt the capsulating agent 7 to enclose the raw materials 5 and 6 with the capsulating agent 7, the crucible 4 contg. the materials is transferred into the pulling up furnace from the melting furnace 1, and a single crystal is grown.
    • 6. 发明专利
    • SEMICONDUCTOR WAFER GRINDING METHOD AND DEVICE THEREOF
    • JPS6322259A
    • 1988-01-29
    • JP16280286
    • 1986-07-10
    • HITACHI CABLE
    • MARUYAMA TAKATOSHITAWARASAKO SHUICHI
    • B24B9/00B24B9/06H01L21/304
    • PURPOSE:To prevent chipping and stone loading from occurring as well as to make accuracy of finishing in a wafer and service life in a grindstone improvable, by moving the wafer onto a machining surface of the finishing grindstone installed as connected to the same driving shaft after grinding it with a roughing grindstone, and chamfering it. CONSTITUTION:When a wafer 1 is set to a chucking part 3 completely, a driving shaft 4 is moved in a horizontal direction, and a roller 5 comes into contact with a copying model 2 whereby a rough grindstone 7 and the chucking part 3 are rotated, and rough grinding for the circumference of the wafer 1 takes place is accordance with a profile of the copying model 2. And, the driving shaft 4 is moved horizontally, and the roller 5 comes off the copying model 2. Next, when travel of the driving shaft 4 is over, the wafer 1 goes down up to a grinding position of a finishing grindstone 8, whereby the driving shaft 4 travels again and the copying model 2 an the roller 5 are made contact with each other, so that the wafer 1 is chamfered by the finishing grindstone 8. Thus, the wafer is ground by two grindstones different in grain size for both roughing and finishing operations so that accuracy of finishing and machining efficiency are well improved and, what is more, service life in these grindstones is prolongable.
    • 9. 发明专利
    • PRODUCTION OF COMPOUND SEMICONDUCTOR SINGLE CRYSTAL AND RAW MATERIAL SUPPORTING MEMBER THEREFOR
    • JPH04280893A
    • 1992-10-06
    • JP4323691
    • 1991-03-08
    • HITACHI CABLE
    • WACHI MICHINORITAWARASAKO SHUICHI
    • C30B15/02C30B27/02C30B29/40H01L21/208
    • PURPOSE:To stably grow gallium arsenide crystal having extremely low compositional fluctuation while suppressing the sublimation and evaporation of arsenic by effectively covering arsenic with molten gallium in the melting of the arsenic. CONSTITUTION:Raw material arsenic 2 having higher vapor pressure among gallium arsenide raw materials is solidified in the form of a circular disk having nearly the same shape as the cross section of a crucible 1 and the disk is placed at the bottom of the crucible. Gallium raw material 3 is placed on the arsenic raw material 2 and, further, B2O3 4 is placed on the gallium raw material 3. The charged materials in the crucible 1 are heated and melted while holding the raw material arsenic on the crucible bottom with an arsenic supporting member 5 and the molten raw material is covered with the sealant 4. The arsenic supporting member 5 is made of PBN and has a cylindrical form having an inner diameter larger than the diameter of the pull-up crystal and an outer diameter smaller than the inner diameter of the crucible. The arsenic supporting member 5 has a ring-shaped pressing part 5a at the lower part to press the raw material and an engaging part at the upper part to fix the arsenic supporting member 5 to the crucible 1. The upper part of the arsenic supporting member 5 is fixed to the crucible 1 and the raw material arsenic is pressed to the bottom of the crucible with the ring-shaped pressing part 5a to prevent the flotation of the arsenic in the melting of gallium raw material.