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71. 发明专利

JPS6226830A CHIP BONDING DEVICE 失效
公开(公告)号：JPS6226830A
公开(公告)日：1987-02-04
申请号：JP16513285
申请日：1985-07-26
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： INAGAKI NORIYUKI , MAKINO YUTAKA , YAMAMOTO AKIHIRO
IPC分类号： H01L21/52 , H01L21/58
摘要： PURPOSE:To enable positioning and connection with high accuracy by a method wherein a circuit forming surface of semiconductor chip and a substrate are positioned to be opposed to each other and then position detectors for respective semiconductor chip and substrate as well as a positioner to correct position deflection are provided. CONSTITUTION:A semiconductor chip 16 on a base 22 is positioned by a position detector 34 while the position deflection from the reference position is corrected by a positioner 26. On the other hand, a substrate 30 is positioned by another position detector 35 while the position deflection from the position detector 35 is detected and then the preliminarily specified distance B between the position detectors 34 and 35 is corrected to position the semiconductor chip 16 on the base 22 and the substrate 30 opposing to each other. In such an opposing position, the base 22 is lifted in the arrow A direction to bring a lead part 31 of the substrate 30 into contact with a pad part 16A of semiconductor chip 16. Through these procedures, the position detectors 34, 35 can position a semiconductor chip and a substrate lead part with high precision to be connected with each other.

72. 发明专利

JPS6225430A CHIP BONDING DEVICE 失效
公开(公告)号：JPS6225430A
公开(公告)日：1987-02-03
申请号：JP16513085
申请日：1985-07-26
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： YAMAMOTO AKIHIRO , MAKINO YUTAKA , INAGAKI NORIYUKI
IPC分类号： H01L21/52 , H01L21/58
摘要： PURPOSE:To enable the immediate response to a variation in the size of a chip merely by altering the setting of the rotating angle of a motor by composing chip correcting means of position restricting pawl for restricting the position of a chip from both sides, a threaded feed shaft to be engaged with the pawl, and the motor for rotating the shaft. CONSTITUTION:When a die 1 is transferred from a die container by a collet onto a bearer 2 of position correcting means D, a motor 10 rotates one revolution to rotate a threaded feed shaft 11, position restricting pawls 5a, 5b approach to one another, the position of the die 1 in X direction is restricted between contacting surfaces 8 and 8, and a rotating attitude around a vertical axis center is restricted. At this time, an extremely small gap is formed between the both side edges of the die 1 and the surface 8. Then, position restricting pawls 15a, 15b of Y direction are similarly moved to position the die 1 in the direction. Then, the die 1 is attracted to a bonding collet, transferred to the prescribed position, and bonded.

73. 发明专利

JPS61289638A BONDING UNIT 失效
公开(公告)号：JPS61289638A
公开(公告)日：1986-12-19
申请号：JP13221285
申请日：1985-06-18
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： INAGAKI NORIYUKI , MAKINO YUTAKA , YAMAMOTO AKIHIRO
IPC分类号： H01L21/60
摘要： PURPOSE:To establish a high-speed, high-precision connection between a semiconductor chip and circuits on a substrate by a method wherein the moving distance of a semiconductor chip is minimized, positional deviation between the substrate and semiconductur chip is detected, and a function is provided to accomplish positioning by correcting the positions of X, Y, and theta by means of a positioning device. CONSTITUTION:An optical detector 30 detects the position of a substrate 27. When the detection is over of the positions of the semiconductor chip 20 and substrate 27, positioning devices 24, 26 operate to compensate for the distances X, Y between the optical detectors 29, 30 and a needle 23. A process follows wherein alignment is accomplished whereby the center of the semiconductor chip 20 and the center of a lead 28 of the substrate 27 are positioned on the center of the needle 23. A guide 22 and the needle 23 descend, depressing an adhesive film 19. The guide 22 is caused to stop descending when the gap between the semiconductor chip 20 and the lead 28 is narrowed to 0.3mm-0.5mm. The needle 23 only is allowed to go on descending until bondage is established between the pad 21 of the semiconductor chip 20 and the lead 28.

74. 发明专利

JPS60242952A BEVELLING MACHINE 失效
公开(公告)号：JPS60242952A
公开(公告)日：1985-12-02
申请号：JP9905384
申请日：1984-05-17
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： INAGAKI NORIYUKI , YOSHIDA TAKEICHI , MAKINO MASASHI , OKADA TOSHIHARU , NAKADA KUNIO
IPC分类号： B24B9/00 , B24B9/06 , B24B19/00 , B24B19/26 , B24B21/00 , B24B21/06
摘要： PURPOSE:To prevent fluctuation of quality of bevelling machine for a floppy disc head and the like by arranging work holding means in parallel with the axis of rotary shaft of polishing machine and machining the work while rolling on a face parallel with said axis. CONSTITUTION:Bevelling machine is provided with a polishing device formed with a polishing face 21 circumferentially in the direction of the axis of rotary shaft S and a pluraity of work holding means 26 for holding a work A having planar machining face 1 and spinning around the axis P normal to the machining face 1 while energizing toward the polishing face 21 such that the outer edge section 2 of the machining face 1 will pressure contact with the polishing face 21 while displaceably in the direction of said axis P. In this machine, the work holding means 26 is arranged in parallel with said axis S to roll the work A on a face F parallel with said axis S.

75. 发明专利

JPS59110565A Grinding liquid supplying device 失效
标题翻译：研磨液体供应装置
公开(公告)号：JPS59110565A
公开(公告)日：1984-06-26
申请号：JP22236482
申请日：1982-12-17
申请人： Matsushita Electric Ind Co Ltd
发明人： OOMURA TAKUJI , MAKINO MASASHI , OOGAMI ISAMU , OSADA KEIJI , INAGAKI NORIYUKI
IPC分类号： B24B55/02 , B24D7/10
CPC分类号： B24B55/02
摘要： PURPOSE:To provide a cooling effect without reducing the turning accuracy of a spindle by providing a grinding liquid supplying nozzle having a directional property on a spindle central part without making no contact with the spindle, in a surface grinding rotary machine of traverse axis type. CONSTITUTION:A grinding fluid supplying pipe 14 is arranged in a hole 12 formed on the central portion of a spindle 11 without making no contact with the spindle 11, and is fixed on a spindle housing 13 by means of a fixing part 16. Further, a nozzle 15 having a directional property in the prescribed direction is attached onto the tip of the grinding fluid supplying pipe 14. And, a grinding fluid is supplied to the nozzle 15 through the grinding fluid supplying pipe 14, and injected in the respective directions according to nozzle shapes. With this situation, it is possible to attain sufficient cooling and a chip elimination effect with a small quantity of the grinding fluid without reducing the turning accuracy of the spindle.
摘要翻译：目的：通过在横轴型的表面磨削旋转机中提供在主轴中心部分上具有定向性的研磨液供给喷嘴而不与主轴接触，从而不降低主轴的转动精度来提供冷却效果。构成：研磨液供给管14布置在形成在心轴11的中心部分上的孔12中，而不与主轴11接触，并通过固定部16固定在心轴壳体13上。此外，将具有规定方向的定向性的喷嘴15安装在研磨液供给管14的前端。另外，研磨液通过研磨液供给管14供给到喷嘴15，到喷嘴形状。在这种情况下，可以在不降低主轴的转动精度的情况下，利用少量的研磨液获得足够的冷却和切屑效果。

76. 发明专利

JP2001053040A POLISHING DEVICE AND METHOD 失效
公开(公告)号：JP2001053040A
公开(公告)日：2001-02-23
申请号：JP22509799
申请日：1999-08-09
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： TSUTSUMI HIDETAKA , INAGAKI NORIYUKI , KANESHIMA KEINOSUKE , KAWA TOMOHIRO
IPC分类号： B23Q11/00 , B23Q11/08 , B24B55/04 , B24B57/02 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To confine scattering of a polishing liquid caused during polishing in a certain space to prevent contamination of elements of a polishing device with the polishing liquid. SOLUTION: There are provided a rotating portion 13 on which a polishing pad 15 is mounted, a fixed portion 12 on which the rotating portion is mounted, and a head cover 14 for enclosing the rotating portion. A polishing head 10 whose lower edge portion is positioned below a polishing surface of the polishing pad is used. A liquid is supplied on the outside surface of the head cover 14. The supplied liquid is allowed to flow down from the whole periphery of the lower edge portion of the head cover 14 to form a water curtain 26. Thus, scattering of the polishing liquid is confined in a space formed by the head cover 14 and the water curtain 26.

77. 发明专利

JPH11288917A METHOD AND DEVICE FOR PROCESSING SUBSTRATE 失效
公开(公告)号：JPH11288917A
公开(公告)日：1999-10-19
申请号：JP9195198
申请日：1998-04-03
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： MINO YOSHIMITSU , TSUTSUMI HIDETAKA , INAGAKI NORIYUKI
IPC分类号： B08B15/00 , H01L21/304 , H01L21/677 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To adequately attain various processes of a substrate in a single chamber by an in-line system. SOLUTION: For processes at high-order process parts 32 to 34 having other process parts 31 to 33 as lower-order parts, the lower-order process parts 31 to 33 are nearly shielded by annular partition walls 7a to 7c having a downward flowing-down gap S, such as a processing material, etc., left with the internal surface of the chamber 1 around a support body 3 and the processes at the higher-order process parts 32 to 34 are performed for attaining the purpose.

78. 发明专利

JPH1152391A SPACER SPRAYING METHOD AND SPACER SPRAYING DEVICE 失效
公开(公告)号：JPH1152391A
公开(公告)日：1999-02-26
申请号：JP20366697
申请日：1997-07-30
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： UCHIDA HARUTO , INAGAKI NORIYUKI
IPC分类号： G02F1/1339
摘要： PROBLEM TO BE SOLVED: To maintain the spraying density of the spacer materials to be sprayed on the surface of an object in a prescribed range. SOLUTION: The spraying density of the spacer materials of the object 1 after spraying is evaluated by an image recognition device 7 and the data thereof is computed by a microcomputer 8 as a control section. The spacer spraying of the next panel is executed by optimizing the voltage impressed on a spraying device 2, the voltage impressed on a table 4 and the metered value at a spacer metering device 6, by which the spraying density is maintained within a prescribed range.

79. 发明专利

JPH0679597A DUPLEX HEAD GRINDING MACHINE 失效
公开(公告)号：JPH0679597A
公开(公告)日：1994-03-22
申请号：JP23336992
申请日：1992-09-01
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： UCHIDA HARUTO , INAGAKI NORIYUKI , YASUDA KAZUNARI , TAKAHASHI MASAYUKI
IPC分类号： B24B7/17 , B24B41/06 , B24B49/03
摘要： PURPOSE:To peripherally drive a thin plate-shaped rotary carrier and realize precise and continuous grinding of a flake-shape work piece, in a duplex head grinding machine. CONSTITUTION:A work piece is automatically charged from a container 22 to a peripherally driven type rotary carrier 28 by using a loader 23. After double-side grinding is performed, the work piece is moved onto a conveyor 25 by using an unloader 24. After that, the thickness of the work piece is measured by a measuring instrument 26 and feedback is applied to the cutting-in mechanism of a magnetic bearing spindle 27. In this way, the work piece can be always ground into the fixed thickness.

80. 发明专利

JPH0494354A TAKE UP DEVICE FOR FILM 失效
公开(公告)号：JPH0494354A
公开(公告)日：1992-03-26
申请号：JP21284790
申请日：1990-08-10
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： INAGAKI NORIYUKI , UESUGI YUJI , FUNEMI KOJI
IPC分类号： B65H18/26 , B65H18/08 , H01G13/02
摘要： PURPOSE:To discharge air between respective layers of a film wound up to a take-up bobbin by providing driving means of the take-up bobbin such as a nip roller rotates around the outer periphery of a bobbin in the opposite direction to the rotational direction of the take-up bobbin in one rotation per one rotation of the take-up bobbin. CONSTITUTION:A nip roller 14 is surely followed to the surface of a take-up bobbin 13 with a specified pressure regardless of thickness, shape of the take-up bobbin 13 or revolution speed of the take-up bobbin 13 by providing driving means 22, 24 in which the nip roller 14 is synchronized with rotation of the take-up bobbin 13, the nip roller 14 presses the surface of the take-up bobbin 13 with specified pressure, and moves around the surface of the take-up bobbin 13 in opposite direction to rotational direction of the take-up bobbin 13 in one rotation around the outer periphery of the take-up bobbin 13 per one rotation of the take-up bobbin 13. It is possible thereby to discharge air wound up between respective layers of a wound up film 26 outside while making pressing force of the nip roller 14 constant.

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