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    • 76. 发明专利
    • MANUFACTURE OF SEMICONDUCTOR STORAGE DEVICE
    • JPH02194555A
    • 1990-08-01
    • JP1381989
    • 1989-01-23
    • MATSUSHITA ELECTRIC IND CO LTD
    • NIWA MASAAKI
    • H01L27/04H01L21/822H01L21/8242H01L27/10H01L27/108
    • PURPOSE:To realize a cell of a large capacity for an occupied area per cell by a method wherein a MOS transistor is formed at the upper part of a capacitor by using an SIO technique. CONSTITUTION:Ions of boron 3 and ions of arsenic 4 are implanted in four directions from the upper part of a silicon substrate 1; an Hi-C structure is formed on an inner wall of a trench 2. Then, a thin thermal oxide film 5 is formed by a thermal oxidation operation; an interelectrode capacity of a capacitor is formed. The inside of the trench is filled with polysilicon by a flattening technique; a plate electrode 6 is formed. In order to connect an electrode of a MOS transistor to be formed to an electrode for charge storage use, ions of arsenic 7 for connection use are implanted into an etched shoulder part and are formed. In addition, an oxide film is formed on the whole surface of an isolation region 8 from the plate electrode 6 and the arsenic 7 for connection use by a thermal oxidation operation; the oxide film on the arsenic 7 for connection use is removed by a wet etching operation; the isolation region 8 is formed. A formed U-shaped part is filled with an insulating material 9; after that, it is flattened and used as a substratum of a MOS transistor formation region.
    • 77. 发明专利
    • PHOTOELECTRIC CONVERSION ELEMENT
    • JPS62141787A
    • 1987-06-25
    • JP28332985
    • 1985-12-16
    • MATSUSHITA ELECTRIC IND CO LTD
    • NISHIO MIKIOYANO KOSAKUAOKI YOSHITAKANIWA MASAAKI
    • H01L27/146H01L27/14H01L31/0248H01L31/08
    • PURPOSE:To produce an element with excellent transit photoresponding characteristics and better blocking effect on charge injection than an element using conventional a-SiC:H (B) as a blocking layer by a method wherein a SiC:H containing no impurity with optical band width within specified range and film thickness not exceeding specified value is used as a blocking layer. CONSTITUTION:A first electrode 1, a hydrogenated amorphous silicon a-SiC:H layer 2 mainly composed of silicon and a second transparent electrode 4 are provided while a blocking layer 3 is laid between the a-SiC:H layer 2 and the second electrode 4. At this time, hydrogenated amorphous silicon carbon a-SiC:H with film thickness not exceeding 1000Angstrom and optical band width of 1.8eV-2.2eV is used as the blocking layer 3. For an example, a photoelectric conversion element is produced by using Mo as the first electrode; a film using SiH4 formed by plasma CVD process with optical band width of 1.7eV and film thickness of around 1mum as the a-SiC:H layer 2; an a-SiC:H film using Si4, CH4 formed by plasma CVD process with optical band width of 2.1eV and film thickness of 500Angstrom as the blocking layer 3 and an ITO transparent electrode as the second electrode 4.
    • 79. 发明专利
    • CONTROLLING EQUIPMENT FOR THICK FILM
    • JPS6212122A
    • 1987-01-21
    • JP15072685
    • 1985-07-09
    • MATSUSHITA ELECTRIC IND CO LTD
    • NIWA MASAAKI
    • H01L21/66H01L21/203H01L21/205
    • PURPOSE:To make it possible to control with high precision the optical characteristics in the wavelength region near absorption band edge which is important to determine the optical features of film, by irradiating the light near the optical absorption band edge of the material to be deposited in the forming process of film, such as, the photoelectric conversion film which requires optical characteristics, and measuring the quantity of transmitted light during the deposition process. CONSTITUTION:The He-Ne laser (632.8nm wavelength) light source and the photo diode are used as the light emitting device 6 and the photo detector 7, respectively. The detected signal processing circuit 12 calculates the transmission coefficient T from the detected quantity of transmitted light, and calculates the film thickness (d) based on the absorption coefficient alpha obtained from the preliminary deposition material. When the calculated (d) reaches the desired film thickness previously input, the high frequency power source B, the driving power source for plasma discharge, is turned OFF. In this manner, the discharge automatically stops to half the deposition when the detected film thickness reaches the desired film thickness.