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71. 发明专利

JPH01183449A PREPARATION OF HIGH-TEMPERATURE SUPERCONDUCTING SUBSTANCE 失效
公开(公告)号：JPH01183449A
公开(公告)日：1989-07-21
申请号：JP370888
申请日：1988-01-13
申请人： HITACHI LTD
发明人： ISADA NAOYA
IPC分类号： H01L39/24 , C01G1/00 , C01G3/00 , C04B35/00 , C04B35/45 , H01B13/00
摘要： PURPOSE:To obtain the title Y(Ba.Sr)2Cu3O7-delta-type high-temperature superconducting substance having dence texture and high volume fraction of superconducting phase, by preparing BaCuO2, SrCuO2 and Y2Cu2O5 beforehand and sintering the mixture of the compounds. CONSTITUTION:AY(Ba.Sr)2Cu3O7-delta-type high-temperature superconducting substance (Tc>=90K) is produced by preparing BaCuO2, SrCuO2 and Y2Cu2O5 beforehand from BaCO3 and CuO, SrCO3 and CuO and Y2O3 and CuO, mixing the BaCuO2 with SrCuO2 at a Ba/Sr ratio of 4/0-2/2, mixing the mixed powder with Y2Cu2O5 at a (Ba or Sr)/Y ratio of 2:1 and heating, sintering and reacting the mixed powder in O2 at 950-1020 deg.C.

72. 发明专利

JPS62268148A COOLING DEVICE FOR IC CHIP 失效
公开(公告)号：JPS62268148A
公开(公告)日：1987-11-20
申请号：JP11073386
申请日：1986-05-16
申请人： HITACHI LTD
发明人： ISADA NAOYA , FUJITA TAKESHI , KASUKABE SUSUMU
IPC分类号： H01L23/36 , H01L23/433
摘要： PURPOSE:To reduce the fatigue failure of solder by jointing an IC chip side thermal conduction part with an IC chip through a thermal conduction substance while a cooling body side thermal conduction part is conjugated with a cooling body. CONSTITUTION:An IC chip 3 face down-bonded with a printed circuit board 5 is positioned on the upper side while a cooling body side thermal conduction part 7 joined with a cooling body 6 and an IC chip side thermal conduction part 1 under the state in which the part 1 is fitted to the part 7 are positioned on the lower side, and the wiring substrate 5 and the cooling body 6 are conjugated, thus forming a sealed structure. The sealed structure is turned upside down, the fitted IC chip side thermal conduction part 1 is dropped, and the IC chip 3 and the IC chip side thermal conduction part 1 are fast stuck and cemented through a thermal conduction substance 8. According to such assembly, the undulations of solder bumps 4 and the printed circuit board 5 are absorbed by the fitting sections of the IC chip side and the thermal conduction parts 1, 2 on the cooling body side, and the structure is packaged so that stress is not applied to the solder bumps 4. Consequently, the fatigue failure of solder is reduced, the efficiency of thermal conduction is improved largely, and the chips can further be arrayed with high density.

73. 发明专利

JPS6252170A METHOD OF BURNING MULLITE SINTERED BODY 失效
公开(公告)号：JPS6252170A
公开(公告)日：1987-03-06
申请号：JP18955385
申请日：1985-08-30
申请人： HITACHI LTD
发明人： ISHIHARA SHOSAKU , FUJITA TAKESHI , KUROKI TAKASHI , TODA AKIZO , ISADA NAOYA , MURAYAMA NOBUYASU
IPC分类号： C04B35/18 , H01B3/12 , H05K1/03

74. 发明专利

JPS61117444A Gas detecting element 失效
标题翻译：气体检测元件
公开(公告)号：JPS61117444A
公开(公告)日：1986-06-04
申请号：JP23834284
申请日：1984-11-14
申请人： Hitachi Ltd
发明人： ARIMA HIDEO , KANEYASU MASAMI , YOKONO ATARU , SHIYOUJI REIJI , ISADA NAOYA
IPC分类号： G01N27/12
CPC分类号： G01N27/12
摘要： PURPOSE:To detect a gas such as methane to be detected without receiving the influence of an org. solvent which acts as a disturbing gas and without malfunction by coating a polyimide film or polyimide isoindoloquinazolinedion film having a prescribed film thickness on the surface of an oxide semiconductor which is a detecting element. CONSTITUTION:The polyimide and polyimide isoindoloquinazolinedion film allows the transmission of gases such as hydrogen, carbon monoxide, methane and propane when the film thickness is
摘要翻译：目的：检测待检测的甲烷等气体，不受机构的影响。通过在作为检测元件的氧化物半导体的表面上涂布具有规定膜厚的聚酰亚胺膜或聚酰亚胺异吲哚喹啉酮化合物作为干扰气体而不发生故障的溶剂。构成：当膜厚度<=200μm时，聚酰亚胺和聚酰亚胺异吲哚喹啉酮膜允许气体如氢气，一氧化碳，甲烷和丙烷的传输。关闭组织的效果当膜厚<0.2μm时，乙醇的溶剂气体等显着降低。随后将下电极2，用于检测气体的氧化物半导体层3和上电极4依次层叠在绝缘基板1上，并且其表面涂覆有具有0.2-200μm膜厚度的聚酰亚胺膜或聚酰亚胺异吲哚喹啉酮膜5。关闭机构的检测元件乙醇的溶剂气体等，允许氢气等的传输，因此具有优异的气体选择性。

75. 发明专利

JPS6131344A Manufacture of green sheet 失效
公开(公告)号：JPS6131344A
公开(公告)日：1986-02-13
申请号：JP15292684
申请日：1984-07-25
申请人： Hitachi Ltd
发明人： ISHIHARA SHOSAKU , FUJITA TAKESHI , KUROKI TAKASHI , ISADA NAOYA , TODA AKIZO
IPC分类号： H05K1/03 , C04B35/622 , H01B3/00 , H05K1/02
CPC分类号： H05K1/02 , H05K1/0306

76. 发明专利

JP2012032931A Rfid tag and method for manufacturing rfid tag 审中-公开
标题翻译： RFID标签和制造RFID标签的方法
公开(公告)号：JP2012032931A
公开(公告)日：2012-02-16
申请号：JP2010170578
申请日：2010-07-29
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： MINAGAWA MADOKA , ISADA NAOYA , SAKAMA ISAO , SAGAWA SHIGERU , SHIBATA DAISUKE
IPC分类号： G06K19/077 , G06K19/07
CPC分类号： H01Q1/2208 , G06K19/0772 , G06K19/07722 , G06K19/07754 , H01L2224/16225 , H01L2224/16227 , H01L2224/81191 , H01L2924/00014 , H01L2224/0401
摘要： PROBLEM TO BE SOLVED: To eliminate a printing impossible area due to irregularities on a surface or a back surface of an RFID tag on whose surface or back surface which printing is performed.SOLUTION: An RFID tag includes a base film, an antenna pattern formed on the base film, an IC chip solder-connected to the antenna pattern, an insulating film layer formed on the antenna pattern, an underfill material filled in a gap between the IC chip and the antenna pattern/the base film and a gap between the IC chip and the insulating film layer, a forming layer which is bonded to the insulating film layer and has a window at a part corresponding to an upper surface of the IC chip so that a height of a surface of the forming layer is substantially equal to a height of a surface of the IC chip, a shock-absorbing layer filled in a gap between the forming layer and the base film/the IC chip, and a printing layer covering the surface of the forming layer and the IC chip.
摘要翻译：要解决的问题：为了消除由于执行打印的表面或背面的RFID标签的表面或背面上的不规则性而导致的打印不可能区域。解决方案：RFID标签包括基膜，形成在基膜上的天线图案，与天线图案焊接的IC芯片，形成在天线图案上的绝缘膜层，填充有间隙的底部填充材料在IC芯片和天线图案/基底膜之间以及IC芯片和绝缘膜层之间的间隙，形成层与绝缘膜层接合并且在与上述绝缘膜层的上表面对应的部分具有窗口 IC芯片，使得形成层的表面的高度基本上等于IC芯片的表面的高度，填充在形成层和基底膜/ IC芯片之间的间隙中的减震层，以及覆盖形成层的表面的印刷层和IC芯片。版权所有（C）2012，JPO＆INPIT

77. 发明专利

JP2010087066A Semiconductor chip, mounting board and method for manufacturing semiconductor device 审中-公开
标题翻译：半导体芯片，安装板及制造半导体器件的方法
公开(公告)号：JP2010087066A
公开(公告)日：2010-04-15
申请号：JP2008252089
申请日：2008-09-30
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： HASEBE TAKEHIKO , MINAGAWA MADOKA , YAMAGUCHI YOSHIHIDE , ISADA NAOYA
IPC分类号： H01L21/60 , H01L23/12
CPC分类号： H01L24/95 , H01L2224/95134
摘要： PROBLEM TO BE SOLVED: To provide a method for autonomously controlling the position and posture of a small-sized semiconductor chip on a mounting board.
SOLUTION: A semiconductor chip carrying and alignment method for carrying the semiconductor chip formed into a chip to the electrode of a board in a desired position and posture comprises processes of separately providing a layer comprising a hydrophilic material and a layer comprising a hydrophobic material in a region excluding the electrode on the surface of the semiconductor chip including the semiconductor chip in a droplet, carrying it to the electrode of the mounting board and connecting the semiconductor chip to the electrode of the mounting board. In the processes, the semiconductor chip autonomously controls the alignment of the relative position and posture with the mounting board by the action of the hydrophilic material and the hydrophobic material of the semiconductor chip and a droplet.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于自主控制安装板上的小型半导体芯片的位置和姿势的方法。解决方案：用于将形成在芯片中的半导体芯片的半导体芯片承载和对准方法以期望的位置和姿态载持到板的电极，包括分别提供包含亲水材料的层和包含疏水性的层的工艺在包括液滴中的包含半导体芯片的半导体芯片的表面上的电极之外的区域中的材料，将其传送到安装板的电极并将半导体芯片连接到安装板的电极。在该过程中，半导体芯片通过亲水材料和半导体芯片的疏水材料和液滴的作用自主地控制相对位置和姿势与安装板的对准。版权所有（C）2010，JPO＆INPIT

78. 发明专利

JP2009075687A Rfid tag 审中-公开
标题翻译： RFID标签
公开(公告)号：JP2009075687A
公开(公告)日：2009-04-09
申请号：JP2007241732
申请日：2007-09-19
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： DAIROKU NORIYUKI , ISADA NAOYA , SHINDO HIDEHIKO , KAMISAKA KOICHI
IPC分类号： G06K19/077 , G06K19/07
CPC分类号： G06K19/07749
摘要： PROBLEM TO BE SOLVED: To provide an RFID tag for allowing heightening of communication accuracy between a circuit chip and its external circuit through an antenna while keeping the circuit chip and the antenna of a tag sheet in a non-contact state, and allowing sticking even to any object. SOLUTION: In this RFID tag, the circuit chip formed with a loop-like antenna coil on its principal face and the tag sheet formed with an antenna pattern on its principal face are prepared, and the circuit chip is mounted on the principal face of the tag sheet such that the circuit chip does not overlap the antenna pattern. The circuit chip is disposed close to the antenna pattern, and preferably, at least a half round of the principal face thereof is made to face to the antenna pattern. Thereby, because transfer of a signal or power between the circuit chip (the antenna coil) and the antenna pattern is certainly performed, the high-performance and strong RFID tag can be obtained by only roughly aligning the circuit chip and the tag sheet. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种RFID标签，用于通过天线提高电路芯片和其外部电路之间的通信精度，同时保持电路芯片和标签片的天线处于非接触状态，以及允许粘贴甚至任何物体。解决方案：在该RFID标签中，准备在其主面上形成有环状天线线圈的电路芯片和在其主面上形成有天线图案的标签片，并且将电路芯片安装在主体上使得电路芯片不与天线图案重叠。电路芯片靠近天线图案设置，并且优选地，其主面的至少半个圆形面对天线图案。因此，由于可靠地进行电路芯片（天线线圈）和天线方向图之间的信号或电力的传递，所以只要将电路芯片和标签片材大致对准即可得到高性能，强大的RFID标签。版权所有（C）2009，JPO＆INPIT

79. 发明专利

JP2008192651A Semiconductor element unit and its complex, semiconductor device and its module, their assembly structure and connection structure of film substrate 审中-公开
标题翻译：半导体元件及其复合器，半导体器件及其模块，其组件结构和电路基板的连接结构
公开(公告)号：JP2008192651A
公开(公告)日：2008-08-21
申请号：JP2007022400
申请日：2007-01-31
申请人： Elpida Memory Inc , Hitachi Ltd , エルピーダメモリ株式会社 , 株式会社日立製作所
发明人： YAMAGUCHI MASAHIRO , ISADA NAOYA , AMANO YASUO , TSUNODA SHIGEHARU
IPC分类号： H01L23/12 , H01L25/10 , H01L25/11 , H01L25/18
CPC分类号： H01L25/0657 , H01L23/49833 , H01L23/538 , H01L24/16 , H01L24/50 , H01L24/86 , H01L25/105 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2225/0652 , H01L2225/06527 , H01L2225/06568 , H01L2225/06572 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/30105 , H01L2924/30107 , H01L2924/351 , H01L2924/00 , H01L2224/05599
摘要： PROBLEM TO BE SOLVED: To provide the structure of a semiconductor device which can be assembled under low temperature while reducing the parasitic inductance by lowering the resistance and avoiding as much as possible unnecessary electromagnetic radiation from the outside.
SOLUTION: In the semiconductor device, a film substrate 2 has a through via 2C formed by filling a through hole penetrating both sides of a film shape substrate body 2A with a conductive material, and wiring or a terminal for connection with the through via. A semiconductor element 1 with a terminal member 1C is fixed onto the film shape substrate body 2A while connecting the terminal member electrically with the wiring or the terminal.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供可以在低温下组装的半导体器件的结构，同时通过降低电阻并尽可能避免来自外部的不必要的电磁辐射来减小寄生电感。解决方案：在半导体器件中，薄膜基片2具有贯通孔2C，其通过用导电材料填充贯穿薄膜状基片本体2A的两侧的通孔而形成，并且布线或用于与通孔通过。具有端子构件1C的半导体元件1在将端子构件与布线或端子电连接的同时固定到膜状基板主体2A上。版权所有（C）2008，JPO＆INPIT

80. 发明专利

JP2007123656A Solder bump formation equipment 审中-公开
标题翻译：焊接成型设备
公开(公告)号：JP2007123656A
公开(公告)日：2007-05-17
申请号：JP2005315622
申请日：2005-10-31
申请人： Elpida Memory Inc , Hitachi Ltd , エルピーダメモリ株式会社 , 株式会社日立製作所
发明人： TENMYO HIROYUKI , ISADA NAOYA , NAKA YASUHIRO , IKEDA HIROAKI , ISHINO MASAKAZU
IPC分类号： H01L21/60
CPC分类号： H01L24/81
摘要： PROBLEM TO BE SOLVED: To provide solder bump formation equipment where electroplating tin does not oxidize. SOLUTION: Following processes are carried out in a series of equipment. (1) In vacuum equipment, oxide on a surface electroplated with tin is removed by argon plasma. (2) The surface is heated in vacuum or inert gas (argon, nitrogen, helium, or a gas obtained by mixing hydrogen in the inert gas for suppressing oxidization). (3) An adhesive is applied on the surface in the inert gas (argon, nitrogen, helium, or a gas obtained by mixing hydrogen in the inert gas for suppressing oxidization). (4) The adhesive is semi-cured in the inert gas (argon, nitrogen, helium, or a gas obtained by mixing hydrogen in the inert gas for suppressing oxidization). COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供电镀锡不氧化的焊料凸块形成设备。
解决方案：以下过程在一系列设备中进行。（1）在真空设备中，通过氩等离子体除去用锡电镀的表面上的氧化物。（2）将表面在真空或惰性气体（氩气，氮气，氦气或通过在惰性气体中混合氢以抑制氧化而获得的气体）加热。（3）在惰性气体（氩，氮，氦或通过在惰性气体中混合氢气以抑制氧化而获得的气体）的表面上施加粘合剂。（4）粘合剂在惰性气体（氩，氮，氦或通过在用于抑制氧化的惰性气体中混合氢气获得的气体）半固化。版权所有（C）2007，JPO＆INPIT

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