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61. 发明专利

JP2013168431A Solder junction structure, power module, substrate for power module with heat sink, and manufacturing methods of solder junction structure, power module, and substrate for power module with heat sink 有权
标题翻译：焊接结构，功率模块，带有散热功率模块的基板，以及具有散热功率模块的焊接结构，功率模块和基板的制造方法
公开(公告)号：JP2013168431A
公开(公告)日：2013-08-29
申请号：JP2012029646
申请日：2012-02-14
申请人： Mitsubishi Materials Corp , 三菱マテリアル株式会社
发明人： NISHIMOTO SHUJI , NISHIKAWA MASAHITO , NAGATOMO YOSHIYUKI
IPC分类号： H01L23/40 , B23K1/00 , B23K1/19 , B23K1/20 , B23K35/14 , B23K35/22 , B23K35/30 , B23K101/40 , C22C5/06 , H01L25/07 , H01L25/18
CPC分类号： H01L24/32 , H01L2224/32225 , H01L2924/13055 , H01L2924/15787 , H01L2924/351 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a solder junction structure which inhibits the occurence of swelling and wrinkles on a surface of an aluminum member and improves the reliability of juncture with a joined member even when being subject to power cycles and heat cycles, a power module using the solder junction structure, and a substrate for the power module with a heat sink, and to provide manufacturing methods of the solder junction structure, the power module, and the substrate for the power module with the heat sink.SOLUTION: In a solder junction structure 40, an aluminum member 13 made of aluminum or an aluminum alloy is joined with a joined member 21 by a solder material. The solder junction structure 40 includes: a glass layer 41 formed on a surface of the aluminum member 13; an Ag layer 42 laminated on the glass layer 41; and a solder layer 43 laminated on the Ag layer 42. Crystalline oxide particles 44 are dispersed in the Ag layer 42.
摘要翻译：要解决的问题：为了提供抑制铝构件表面上的膨胀和皱褶的发生的焊接结构，即使在进行动力循环和热循环的情况下也能够提高与接合构件的接合的可靠性，功率模块使用焊接结构，以及具有散热器的功率模块的基板，并且提供用于具有散热器的功率模块的焊接结构，功率模块和基板的制造方法。解决方案：在焊料由铝或铝合金制成的铝构件13通过焊料与接合构件21接合。焊接结构40包括：形成在铝构件13的表面上的玻璃层41; 叠层在玻璃层41上的Ag层42; 和层叠在Ag层42上的焊料层43.结晶氧化物粒子44分散在Ag层42中。

62. 发明专利

JP2013149653A Soldering method, soldering device, and printed wiring board 审中-公开
标题翻译：焊接方法，焊接装置和印刷电路板
公开(公告)号：JP2013149653A
公开(公告)日：2013-08-01
申请号：JP2012006948
申请日：2012-01-17
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： TANABE TAKESHI , IWATA NORIYA , IDETA GORO , ARAI HITOSHI
IPC分类号： H05K3/34 , B23K1/00 , B23K1/08 , B23K1/20 , B23K3/00 , B23K3/06 , B23K101/42
摘要： PROBLEM TO BE SOLVED: To provide a soldering method capable of suppressing a non-soldering defect in an easy method, a soldering device, and a printed wiring board soldered by the soldering method.SOLUTION: In a soldering method, a printed wiring board 1 having a soldering object part 1a is dipped in molten solder 2, the soldering method including a process of sticking flux 8 and metal powder 9 on the soldering object part 1a of the printed wiring board 1 and its peripheral part, and a process of melting the metal powder 9 by dipping the soldering object part 1a of the printed wiring board 1 having the flux 8 and metal powder 9 stuck and its periphery in the molten solder 2.
摘要翻译：要解决的问题：提供一种能够通过焊接方法焊接的容易的方法，焊接装置和印刷线路板来抑制非焊接缺陷的焊接方法。解决方案：在焊接方法中，印刷线路板1 将焊接对象部分1a浸渍在熔融焊料2中，焊接方法包括将焊剂8和金属粉末9粘附在印刷线路板1的焊接对象部分1a及其周边部分上的工艺，通过将具有助焊剂8和金属粉末9的印刷电路板1的焊接对象部分1a浸渍在熔融焊料2中而将其周边浸渍在金属粉末9中。

63. 发明专利

JP5242363B2 Lead soldering device for a solar cell 有权
公开(公告)号：JP5242363B2
公开(公告)日：2013-07-24
申请号：JP2008322006
申请日：2008-12-18
申请人：黒田テクノ株式会社
发明人：誠権田
IPC分类号： B23K1/00 , B23K1/20 , B23K3/00 , B23K3/04 , B23K101/36 , H01L31/042 , H05K3/34
CPC分类号： H01L31/05 , H01L31/188 , Y02E10/50

64. 发明专利

JP2013137153A All-aluminum heat exchanger using precoat fin material 有权
标题翻译：全铝热交换器使用PRECOAT FIN材料
公开(公告)号：JP2013137153A
公开(公告)日：2013-07-11
申请号：JP2011288407
申请日：2011-12-28
申请人： Mitsubishi Alum Co Ltd , 三菱アルミニウム株式会社
发明人： KUME YOSHIO , TAKAHASHI MUNEHISA , TODA HONOKA
IPC分类号： F28F13/18 , B23K1/00 , B23K1/20 , B23K3/06 , B23K101/14 , B23K103/10 , C09D1/02 , C09D7/12 , C09D201/00 , F28F1/32 , F28F19/06
摘要： PROBLEM TO BE SOLVED: To provide an all-aluminum heat exchanger applied with a precoat film.SOLUTION: The all-aluminum heat exchanger has a brazing structure in which a tube with a refrigerant flow channel inside thereof and a fin brazed in an external surface of the tube are furnished, the tube and fin are made of aluminium or the aluminium alloy, and the tube having brazing material and the fin having no brazing material are combined. In addition, the all-aluminum heat exchanger consists of the fin material precoated by a coating film mainly based on silicate having hydrophilicity on a surface of base material in which the fin consists of the aluminium or aluminium alloy.
摘要翻译：要解决的问题：提供一种应用预涂膜的全铝热交换器。解决方案：全铝热交换器具有钎焊结构，其中具有内部具有制冷剂流动通道的管和在外表面钎焊的翅片管和翅片由铝或铝合金制成，并且具有钎焊材料的管和不具有钎焊材料的翅片组合在一起。此外，全铝热交换器由主要基于在基材表面上具有亲水性的硅酸盐涂层预涂的翅片材料组成，其中翅片由铝或铝合金构成。

65. 发明专利

JP5225729B2 Bonding method of assembly 有权
公开(公告)号：JP5225729B2
公开(公告)日：2013-07-03
申请号：JP2008093418
申请日：2008-03-31
申请人：独立行政法人産業技術総合研究所 , 住友電気工業株式会社
发明人：公洋尾崎 , 慶三小林 , 秀樹森口 , 友幸石田 , 明彦池ヶ谷
IPC分类号： B23B27/18 , B23K1/00 , B23K1/19 , B23K1/20

66. 发明专利

JP2013119650A Partial plating method 审中-公开
标题翻译：部分镀层法
公开(公告)号：JP2013119650A
公开(公告)日：2013-06-17
申请号：JP2011268106
申请日：2011-12-07
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： TSUMURA SHOKO
IPC分类号： C25D5/48 , B23K1/20 , B23K101/14 , B23K103/22
摘要： PROBLEM TO BE SOLVED: To provide a partial plating method in which partial plating can be performed which controls cyanogen burn, while reducing time required for processing.SOLUTION: In the partial plating method, a part of copper plating performed over an entire hollow machine element part 1 is detached. The copper plating is performed over the entire machine element part 1, and inside the machine element part 1, at least a part of the surface of a plating layer in the boundary division 80 between the portion 31 from which the copper plating is to be detached and the portion 30 from which the copper plating is not to be detached is smoothed. Then, by immersing the portion 31 from which the copper plating is to be detached of the machine element part 1 in an aqueous solution of a cyanogen compound, the cooper plating performed on the portion 31 to be detached is detached.
摘要翻译：要解决的问题：提供部分电镀方法，其中可以进行部分电镀以控制氰燃烧，同时减少加工所需的时间。解决方案：在部分电镀方法中，在整个中空机器元件部件1上执行的部分镀铜被分离。在整个机器元件部1上进行铜电镀，在机器元件部1的内部，在分离部分80之间的镀层的表面的至少一部分之间，在该部分31之间，要排除铜电镀的部分而不会剥离镀铜的部分30被平滑化。然后，通过将机器元件部件1的铜镀层的部分31浸渍在氰化合物的水溶液中，分离在要分离的部分31上进行的铜镀层。版权所有（C）2013，JPO＆INPIT

67. 发明专利

JP2013063449A Composite material for brazing and manufacturing method thereof 有权
标题翻译：复合材料制造及其制造方法
公开(公告)号：JP2013063449A
公开(公告)日：2013-04-11
申请号：JP2011202533
申请日：2011-09-16
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： HATA SHOHEI , KUROKI KAZUMA , KURODA HIROMITSU , ODA YUICHI
IPC分类号： B23K35/14 , B23K1/20 , B23K35/22 , B23K35/28 , B23K101/40 , B23K103/02 , B23K103/12 , C22C18/02 , C22C18/04 , H01L23/10
摘要： PROBLEM TO BE SOLVED: To provide a composite material for brazing, composed of an inexpensive material not containing Pb, having a melting point equal to or higher than that of a bonding material containing Pb, and being suitable as a bonding material for a hermetic seal etc. of a package.SOLUTION: A composite material 100 for brazing has a structure where a joint material 2 is laminated on a base material 1 formed with a metal, wherein the joint material 2 has a structure where a zinc-containing layer (a zinc layer 3A), an aluminum layer 4, and a copper layer 5 are laminated in this order from the base material 1 side, and the copper layer 5 composes an outermost layer of the joint material 2.
摘要翻译：要解决的问题：提供一种由不含Pb的廉价材料构成的钎焊用复合材料，其熔点等于或高于包含Pb的接合材料的熔点，并且适合作为用于包装的气密密封等。解决方案：用于钎焊的复合材料100具有将接合材料2层压在由金属形成的基材1上的结构，其中接合材料2具有其中含锌层（锌层3A ），铝层4和铜层5从基材1侧依次层叠，铜层5构成接合材料2的最外层。（C）2013，JPO＆INPIT

68. 发明专利

JP2013038418A Method for inhibiting growth of intermetallic compound 有权
标题翻译：抑制络合物生长的方法
公开(公告)号：JP2013038418A
公开(公告)日：2013-02-21
申请号：JP2012163896
申请日：2012-07-24
申请人： National Chiao Tung University , ナショナルチャオツンユニヴァーシティー
发明人： CHI CHEN , KIM NING TSU , HSIAO HSIANG-YAO
IPC分类号： H01L21/60 , B23K1/00 , B23K1/20 , B23K101/40 , B23K103/12
CPC分类号： C23C28/021 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2224/03849 , H01L2224/0401 , H01L2224/05147 , H01L2224/05611 , H01L2224/08503 , H01L2224/11849 , H01L2224/131 , H01L2924/01029 , H01L2924/01322 , H01L2924/01327 , H01L2924/10253 , H01L2924/3651 , H01L2924/00014 , H01L2924/01047 , H01L2924/00012 , H01L2924/00 , H01L2924/014
摘要： PROBLEM TO BE SOLVED: To provide a method for controlling the growth of an intermetallic compound formed by a rapid reaction of a solder and Cu prior to a bonding process and inhibiting the growth of the intermetallic compound after the bonding process.SOLUTION: A method for inhibiting the growth of an intermetallic compound includes: (i) a step of preparing a substrate element including a substrate including at least one layer of metal pad deposited thereon, in which at least one thin layer of solder is deposited onto the layer of a metal pad and then a reflow process is performed; and (ii) a step of further depositing a bump of solder with an appropriate thickness on the substrate element. In the method, a thin intermetallic compound is formed by the reaction of the thin solder layer and the metal in the metal pad after appropriate heat treatment to the thin solder layer. By the formation of a thin intermetallic compound, the growth of the intermetallic compound can be slowed and the transformation of the intermetallic compound can be prevented.
摘要翻译：要解决的问题：提供一种控制在焊接过程之前通过焊料和Cu的快速反应形成的金属间化合物的生长的方法，并且在接合工艺之后抑制金属间化合物的生长。解决方案：用于抑制金属间化合物生长的方法包括：（i）制备包括其上沉积有至少一层金属焊盘的衬底的衬底元件的步骤，其中至少一层焊料薄层沉积在金属焊盘的层上，然后进行回流处理; 和（ii）在衬底元件上进一步沉积具有适当厚度的焊料凸点的步骤。在该方法中，通过在对薄焊料层进行适当的热处理之后，通过薄焊料层和金属焊盘中的金属的反应形成薄的金属间化合物。通过形成薄的金属间化合物，可以减缓金属间化合物的生长，并且可以防止金属间化合物的转变。版权所有（C）2013，JPO＆INPIT

69. 发明专利

JP2013027918A Method of manufacturing aluminum nitride-metal joint substrate 有权
标题翻译：制造氮化钛金属接头基板的方法
公开(公告)号：JP2013027918A
公开(公告)日：2013-02-07
申请号：JP2011167560
申请日：2011-07-29
申请人： Tokuyama Corp , 株式会社トクヤマ , Dowa Metaltech Kk , Dowaメタルテック株式会社
发明人： AOKI HIROTO , KANECHIKA YUKIHIRO , SUGAWARA KEN
IPC分类号： B23K1/20 , C04B37/02 , C04B41/91 , H01L23/12 , H01L23/15 , H05K3/26 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing an aluminum nitride-metal joint substrate exhibiting an improvement effect of joining strength of an aluminum nitride-sinter substrate and a metal substrate and further capable of stably obtaining an aluminum nitride-metal joint substrate having high strength and excellent in thermal cycle characteristics with good reproducibility.SOLUTION: The treating surface of the aluminum nitride-sinter substrate is modified by making abrasive grains collide with the treating surface and thereafter when the metal substrate is joined to the treating surface of an aluminum nitride sintered compact, abrasive grains having higher hardness than that of the aluminum nitride sintered compact are used as the abrasive grains, a liquid containing the abrasive grains in a concentration of 10-30 vol.% is jetted to the treating surface of the aluminum nitride-sinter substrate together with compressed air so that pressure acting on the treating surface becomes 0.10-0.25 MPa, the residual stress value of the aluminum nitride (112) surface of the treating surface obtained in a sinψ method using X-ray diffraction is made equal to or less than -50 MPa and a surface roughness is made equal to or less than 0.2 μm.
摘要翻译：解决的问题：为了提供一种制造氮化铝 - 金属接合基材的方法，其具有改善氮化铝烧结基材和金属基材的接合强度的效果，并且还能够稳定地获得氮化铝 - 金属接合基材具有高强度和优异的热循环特性，具有良好的再现性。解决方案：通过使磨料颗粒与处理表面碰撞来改变氮化铝烧结衬底的处理表面，此后当金属衬底接合到氮化铝烧结体的处理表面时，具有较高硬度的磨粒使用比氮化铝烧结体作为磨粒，含有浓度为10〜30体积％的磨粒的液体与压缩空气一起喷射到氮化铝烧结体的处理面上，使得作用在处理表面上的压力变为0.10-0.25MPa，使用X-射线衍射法获得的处理表面的氮化铝（112）表面的残余应力值在sin 2 使得射线衍射等于或小于-50MPa，并使表面粗糙度等于或小于0.2μm。版权所有（C）2013，JPO＆INPIT

70. 发明专利

JPWO2011027820A1 鉛フリーはんだ合金、接合用部材及びその製造法、並びに電子部品有权
公开(公告)号：JPWO2011027820A1
公开(公告)日：2013-02-04
申请号：JP2011529936
申请日：2010-09-02
申请人：千住金属工業株式会社
发明人：俊策吉川 , 俊策吉川 , 芳恵山中 , 芳恵山中 , 大西　司 , 司大西 , 世子石橋 , 世子石橋 , 光司渡辺 , 光司渡辺 , 広輝石川 , 広輝石川 , 豊千葉 , 豊千葉
IPC分类号： B23K35/26 , B23K1/00 , B23K1/20 , H01L23/373
CPC分类号： H01L23/495 , B23K35/007 , B23K35/0238 , B23K35/26 , C22C28/00 , C23C24/103 , H01L23/3736 , H01L2924/0002 , H01R43/0235 , H01L2924/00
摘要：ボイドの発生を低減することができる鉛フリーはんだ及びそれを用いた密着性、接合強度、加工性に優れた接合用部材の提供。Sn:0.1〜3%、及び/又は、Bi:0.1〜2%、残部Inと不可避不純物からなる組成を有し、はんだ付け時のボイド発生の抑制に効果のある鉛フリーはんだ合金である。この鉛フリーはんだ合金を溶融し、金属基材を浸漬し、溶融した鉛フリーはんだ合金と金属基材とに超音波振動を加えることによって、金属基材の表面に、鉛フリーはんだ合金層を形成して接合用部材とする。この接合用部材を介してヒートシンクとパッケージとをフラックスの存在下でリフロー加熱してはんだ付けする。

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