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61. 发明专利

JP2010062530A Printed wiring board and printed circuit board 有权
标题翻译：印刷线路板和印刷电路板
公开(公告)号：JP2010062530A
公开(公告)日：2010-03-18
申请号：JP2009145453
申请日：2009-06-18
申请人： Canon Inc , キヤノン株式会社
发明人： HAYASHI YASUJI
IPC分类号： H05K3/46
CPC分类号： H05K1/116 , H01L23/49827 , H01L23/50 , H01L2924/0002 , H05K1/0265 , H05K2201/0969 , H05K2201/09727 , H05K2201/09745 , H05K2201/0979 , H05K2201/10734 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To prevent a current from being concentrated on a via at the farthest end, in a connection part for connecting power supply wires in different layers of a printed wiring board to each other through a via.
SOLUTION: In this multilayer printed wiring board 1, a plurality of vias 4-7 that connect a power supply wire 2 in a first wiring layer with a power supply wire 3 in a second wiring layer are arranged in parallel to a direction along which a current flows. In order to prevent the current from being concentrated on the via 4 connected to the farthest end of the power supply wire 2 among the vias 4-7, a wiring part 8 between the via 4 and the via 5 is narrowed to increase resistance. A wiring part 9 that is narrowed is disposed similarly at the farthest end of the power supply wire 3 of the second wiring layer.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了防止电流集中在最远端的通孔上，在用于通过通孔将印刷电路板的不同层中的电源线连接的连接部分中。解决方案：在该多层印刷电路板1中，将第一布线层中的电源线2与第二布线层中的电源线3连接的多个通孔4-7平行于方向电流流过。为了防止电流集中在通孔4-7中连接到电源线2的最远端的通孔4之间，通孔4和通路5之间的布线部分8变窄以增加电阻。在第二布线层的电源线3的最远端处类似地配置变窄的配线部9。版权所有（C）2010，JPO＆INPIT

63. 发明专利

JP2009513970A Probe card and a method of manufacturing the same 审中-公开
公开(公告)号：JP2009513970A
公开(公告)日：2009-04-02
申请号：JP2008537587
申请日：2006-10-19
申请人：パイコムコーポレイションPhicom Corporation
发明人：フーンジョン，セオン , ヒュンシン，キュー , キリー，オー
IPC分类号： G01R1/073 , B23K35/26 , H01L21/66
CPC分类号： H05K3/3473 , G01R1/07342 , G01R3/00 , H05K3/243 , H05K3/341 , H05K2201/09745 , H05K2203/167 , Y02P70/613 , Y10T29/49147 , Y10T29/49149 , Y10T29/49156 , Y10T29/49162
摘要：【解決手段】プローブカード及びその製造方法を提供する。前記方法は、複数の導電パターンが形成された基板上に、導電パターンに電気的に接続するソルダーバンプを形成し、ソルダーバンプにより支持されながら導電パターンに接続するプローブを形成した後、ソルダーバンプを溶融することでプローブを基板に固定するステップを含む。このとき、ソルダーバンプを形成するステップは、所定のフォト及びエッチング工程を用いてソルダーバンプを同一な大きさ及びパターンに形成するステップを含む。

64. 发明专利

JP2008288325A Method of connecting wiring board, and wiring board 有权
标题翻译：连接接线板和接线板的方法
公开(公告)号：JP2008288325A
公开(公告)日：2008-11-27
申请号：JP2007130744
申请日：2007-05-16
申请人： Panasonic Corp , パナソニック株式会社
发明人： KOYAMA MASAYOSHI , SHIRAISHI TSUKASA
IPC分类号： H05K1/11 , H01L21/60 , H05K3/32
CPC分类号： H05K3/361 , H01L24/11 , H01L2924/00014 , H05K1/117 , H05K3/323 , H05K2201/0373 , H05K2201/09663 , H05K2201/0969 , H05K2201/09745 , H05K2203/087 , H05K2203/166 , Y10T29/4913 , Y10T29/49144 , H01L2224/05599
摘要： PROBLEM TO BE SOLVED: To ensure proper connection of connection terminals. SOLUTION: The method of connecting wiring boards interconnects wiring boards 31a and 31b having band-like connection terminals 34a and 34b for connection with the other board. The method includes a step of positioning the wiring boards so that the connection terminals face each other while fluid 14 is inserted in between, and a step of heating fluid 14, cooling it and fixing the connection terminals. Fluid 14 is a material where air bubbles occur by heating. A plurality of connection terminals 34a and 34b are installed in the respective wiring boards 31a and 31b. A groove 20a crossing the band-like connection terminal is formed in at least one connection terminal of at least one wiring board. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：确保连接端子的正确连接。解决方案：连接布线板的方法将具有带状连接端子34a和34b的布线板31a和31b互连，以与另一个板连接。该方法包括将流体14插入其间的连接端子彼此面对的步骤，以及加热流体14，冷却并固定连接端子的步骤。流体14是通过加热发生气泡的材料。多个连接端子34a和34b安装在各个布线板31a和31b中。在至少一个布线板的至少一个连接端子中形成有与带状连接端子交叉的槽20a。版权所有（C）2009，JPO＆INPIT

65. 发明专利

JP2008537325A Apparatus and method for measuring temperature of the heat sink 审中-公开
公开(公告)号：JP2008537325A
公开(公告)日：2008-09-11
申请号：JP2008502271
申请日：2006-03-04
申请人：エスエーヴェー−オイロドライブゲゼルシャフトミットベシュレンクテルハフツングウントコムパニーコマンディトゲゼルシャフト
发明人：ハラルトプラウツッシュ
IPC分类号： H01L23/34 , G01K1/14 , G01K1/18 , G01K7/00 , H01L23/40 , H05K3/46
CPC分类号： H05K1/0203 , H01L23/34 , H01L23/3735 , H01L23/4006 , H01L23/62 , H01L2924/0002 , H05K1/0206 , H05K1/0207 , H05K3/0061 , H05K2201/09745 , H05K2201/10409 , H05K2201/1056 , H01L2924/00
摘要：本発明は、熱源と、センサおよび吸熱器を実装したプリント回路基板を含む電子デバイスとの温度測定方法に関する。前記センサおよび吸熱器は熱伝導するように連結される。
【選択図】図１

66. 发明专利

JP2008118129A Substrate for flip chip bonding and manufacturing method thereof 审中-公开
标题翻译：用于片芯接合的基板及其制造方法
公开(公告)号：JP2008118129A
公开(公告)日：2008-05-22
申请号：JP2007271069
申请日：2007-10-18
申请人： Samsung Electro-Mechanics Co Ltd , サムソンエレクトロ−メカニックスカンパニーリミテッド.
发明人： KANG MYUNG-SAM , PARK JUNG-HYUN , KIM SANG-DUCK , KIM JI-EUN , CHOI JONG-GYU
IPC分类号： H01L23/12 , H01L21/60 , H05K3/06 , H05K3/24 , H05K3/34
CPC分类号： H01L23/13 , H01L21/4853 , H01L23/3114 , H01L23/49816 , H01L2924/00013 , H01L2924/0002 , H05K1/111 , H05K3/107 , H05K3/4007 , H05K2201/0367 , H05K2201/09745 , H05K2201/10674 , Y02P70/611 , Y10T29/49147 , H01L2224/29099 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a substrate for flip chip bonding capable of preventing a solder bump from flowing into an insulating layer part and capable of reducing the pitch between the bumps, and a manufacturing method thereof. SOLUTION: In a manufacturing method of a substrate equipped with a bump pad, this manufacturing method of a substrate for flip chip bonding comprises: a step for forming an insulating layer in which a circuit pattern is caved; and a step for etching a circuit pattern at a region at which a bump pad is formed to form the bump pad, wherein the bump pad is formed by removing a part of the circuit pattern caved in the insulating layer in a groove form. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决的问题：提供一种能够防止焊料凸块流入绝缘层部分并能够减小凸块之间的间距的用于倒装芯片接合的基板及其制造方法。解决方案：在具有凸块焊盘的基板的制造方法中，用于倒装芯片接合的基板的制造方法包括：形成电路图案凹陷的绝缘层的工序; 以及在形成凸点焊盘的区域处蚀刻电路图案以形成凸块焊盘的步骤，其中通过以凹槽形式去除在绝缘层中凹陷的电路图案的一部分而形成凸块焊盘。版权所有（C）2008，JPO＆INPIT

67. 发明专利

JP2008084978A Electronic controller 有权
标题翻译：电子控制器
公开(公告)号：JP2008084978A
公开(公告)日：2008-04-10
申请号：JP2006261320
申请日：2006-09-26
申请人： Denso Corp , 株式会社デンソー
发明人： KASHIWAZAKI ATSUSHI
IPC分类号： H01L25/04 , H01L25/18
CPC分类号： H05K1/181 , H01L23/4334 , H01L23/49531 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/16 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49175 , H01L2224/73265 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H05K1/0203 , H05K1/0306 , H05K1/167 , H05K3/0061 , H05K3/284 , H05K2201/09745 , H05K2201/1034 , H05K2201/1056 , H05K2201/10674 , H05K2201/10924 , H05K2203/049 , H05K2203/1572 , Y02P70/611 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide an electronic controller, which enables miniaturization, improves radiation and reliability in connection and which simplifies a mounting process. SOLUTION: The electronic controller 100 is equipped with a circuit substrate 110 with an element 112 mounted thereon, a base member 130 with the circuit substrate 110 adhered thereto and a lead terminal 150 electrically connected to the circuit substrate 110. As the element 112, an electronic component 114 is mounted on the lower surface of the circuit substrate 110 through thick film resistant body 113 and solder 117; an electronic component 115, at least comprising bare chips 115a, 115b, is mounted on the upper surface of the circuit substrate 110 through wiring without solder; a first recess 131 is provided at a portion corresponding to the electronic component 114 in a surface with the circuit substrate 110 of the base member 130 adhered thereto and the circuit substrate 110 is molded by sealing resin 170 so that the base member 130 and the lead terminal 150 are partially exposed to the outside. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供能够实现小型化的电子控制器，提高连接中的辐射和可靠性，并且简化了安装过程。解决方案：电子控制器100配备有安装有元件112的电路基板110，电路基板110粘附到其上的基座构件130和电连接到电路基板110的引线端子150.作为元件如图112所示，电子部件114通过厚膜抵抗体113和焊料117安装在电路基板110的下表面上; 至少包括裸芯片115a，115b的电子部件115通过没有焊料的布线安装在电路基板110的上表面上; 第一凹部131设置在与基底部件130的电路基板110粘接在一起的表面上与电子部件114对应的部分，电路基板110通过密封树脂170成型，使得基部部件130和引线端子150部分地暴露于外部。版权所有（C）2008，JPO＆INPIT

68. 发明专利

JP3948417B2 Light source unit 有权
标题翻译：空值
公开(公告)号：JP3948417B2
公开(公告)日：2007-07-25
申请号：JP2003052629
申请日：2003-02-28
申请人：ノーリツ鋼機株式会社
发明人：浩宮脇 , 良平山下 , 雅之玉井
IPC分类号： G03B27/54 , H04N1/04 , B41J2/44 , F21K7/00 , F21S2/00 , F21S4/00 , F21V1/00 , F21V7/00 , F21V9/00 , F21V19/00 , F21V29/00 , F21Y101/02 , G02B27/00 , H01L25/075 , H01L31/12 , H01L33/58 , H01L33/60 , H01L33/62 , H04N1/028 , H05K1/02 , H05K1/05 , H05K1/18
CPC分类号： H04N1/02815 , F21K9/00 , F21V23/003 , H01L25/0753 , H01L33/60 , H01L2224/48091 , H01L2224/4911 , H01L2224/73265 , H01L2924/19107 , H01L2924/3011 , H04N1/02865 , H04N2201/0404 , H05K1/0274 , H05K1/056 , H05K1/183 , H05K2201/09036 , H05K2201/09745 , H05K2201/10106 , H05K2201/2054 , H01L2924/00014 , H01L2924/00
摘要： A light source unit includes a substrate mounting a plurality of light emitting diodes (LED's) for irradiating beam to an object. The substrate (P) is formed of a material having high heat conductivity and the unit includes a chip resistor mounted on the substrate and heat generation controller (HC) for heating the substrate with heat generated in the chip resistor upon supply of power to the chip resistor. The plural LED's are arranged in the form of an array on the substrate and a plurality of the chip resistors are arranged linearly along the array of LED's.
摘要翻译：光源单元包括安装用于将光束照射到物体的多个发光二极管（LED）的基板。基板（P）由具有高导热性的材料形成，该单元包括安装在基板上的芯片电阻器和用于在向芯片供电时在芯片电阻器中产生的热量加热基板的发热控制器（HC）电阻。多个LED以阵列形式布置在基板上，并且多个芯片电阻器沿LED阵列线性布置。

69. 发明专利

JP2007141522A Cable connector 有权
标题翻译：电缆连接器
公开(公告)号：JP2007141522A
公开(公告)日：2007-06-07
申请号：JP2005330472
申请日：2005-11-15
申请人： Fujitsu Component Ltd , 富士通コンポーネント株式会社
发明人： KONDO TAKAHIRO , SATO KIYOSHI , KOBAYASHI MITSURU , MORIYAMA SATOSHI
IPC分类号： H01R13/658 , H01R24/00
CPC分类号： H01R24/44 , H01R9/0515 , H01R13/6658 , H01R2103/00 , H05K3/3405 , H05K3/3484 , H05K2201/09745 , H05K2201/099 , H05K2201/09909 , H05K2201/10287 , H05K2201/10356 , H05K2203/0191 , H05K2203/0195 , H05K2203/043 , H05K2203/0545
摘要： PROBLEM TO BE SOLVED: To improve signal transmission characteristics for a cable connector equipped with a relay wiring board through impedance matching of a part of the relay wiring board where signal contacts are soldered and a part where the wires are soldered. SOLUTION: The relay wiring board 120 is provided with a grounding layer 122 and grounding patterns for impedance matching 140, 141. The grounding patterns 140, 141 are fitted between first and second contact connecting pads 123, 133 and the grounding layer 122, and an impedance at a solder connection part (a section 80) to the first and the second contact connecting pads 123, 133 is matched to 100 Ω. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：通过阻抗信号触点焊接的继电器配线板的一部分和电线焊接的部分的阻抗匹配来提高装配有继电器配线板的电缆连接器的信号传输特性。解决方案：中继布线板120设置有接地层122和用于阻抗匹配的接地图案140,141。接地图案140,141装配在第一和第二接触连接焊盘123,133和接地层122之间并且与第一和第二接触连接焊盘123,133的焊接连接部分（部分80）处的阻抗匹配为100Ω。版权所有（C）2007，JPO＆INPIT

70. 发明专利

JP2007103939A Printed circuit board incorporating electronic element and manufacturing method of the same 审中-公开
标题翻译：印刷电路板及其制造方法
公开(公告)号：JP2007103939A
公开(公告)日：2007-04-19
申请号：JP2006270247
申请日：2006-10-02
申请人： Samsung Electro-Mechanics Co Ltd , サムソンエレクトロ−メカニックスカンパニーリミテッド.
发明人： LEE DOO-HWAN , YOO JE-GWANG , KIM SEUNG-GU , LEE JAE-KUL , KIM MOON-IL , KIM HYUNG-TAE
IPC分类号： H05K3/46 , H01L23/12 , H05K1/05
CPC分类号： H05K1/185 , H01L23/13 , H01L23/142 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L2224/04105 , H01L2224/20 , H01L2224/24227 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2224/83192 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/07802 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/181 , H05K1/021 , H05K1/053 , H05K3/4608 , H05K2201/09745 , H05K2201/10477 , H05K2201/10674 , H05K2203/0315 , Y10T29/49156 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a printed circuit board incorporating an electronic element in a core member, improved in rigidity and heat dissipation of the core member, superior in a bonding force between the core member and an insulation layer, and capable of stably incorporating the electronic element, and a manufacturing method of the same. SOLUTION: A method of manufacturing a printed circuit board incorporating an electronic element in a metal board, by using the metal board as a core member, typically comprises the steps of (a) forming an insulation layer by anodizing a surface of the metal board; (b) laminating and forming an internal layer circuit in the insulation layer; (c) etching the metal board correspondingly to a position where the electronic element is incorporated and forming a cavity; (d) incorporating the electronic element interposing a chip bond in the cavity; and (e) laminating and forming an external layer circuit correspondingly to the position where the internal layer circuit is formed and the position of an electrode of the electronic element. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种将电子元件结合在芯部件中的印刷电路板，提高了芯部件的刚性和散热性，在芯部件和绝缘层之间的结合力优越，并且能够稳定地结合电子元件及其制造方法。解决方案：通过使用金属板作为芯构件，将金属板中的电子元件制造的印刷电路板的制造方法通常包括以下步骤：（a）通过阳极氧化表面的方法形成绝缘层金属板; （b）在绝缘层中层压形成内层电路; （c）对应于所述电子元件并入的位置并且形成空腔来蚀刻所述金属板; （d）将插入芯片结合在一起的电子元件; 和（e）对应于形成内层电路的位置和电子元件的电极的位置层压和形成外层电路。版权所有（C）2007，JPO＆INPIT

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