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61. 发明专利

JP2010034599A Method of mounting electronic component 有权
标题翻译：安装电子元件的方法
公开(公告)号：JP2010034599A
公开(公告)日：2010-02-12
申请号：JP2009259239
申请日：2009-11-12
申请人： Fujitsu Ltd , 富士通株式会社
发明人： KOYAE KENJI , KIRA HIDEHIKO , KAINUMA NORIO , MATSUMURA TAKAYOSHI
IPC分类号： H01L21/60 , H01L21/607
CPC分类号： H01L24/81 , H01L2224/14 , H01L2224/16225 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To accurately mount electronic components onto a circuit board by preventing positional deviation of a semiconductor chip, when flip-chip bonding the semiconductor chip to the circuit board through the application of ultrasonic oscillation.
SOLUTION: A method of mounting electronic components is adapted to mount a semiconductor chip 10 onto a circuit board 20 by means of flip-chip bonding, in which bumps 12 and a positioning bump 13 having a larger size and a higher protrusion than those of the bumps 12 are formed on the semiconductor chip 10 and the circuit board 20 is provided with electrode terminals 22 to which the bumps 12 are bonded and a pad 23 to which the positioning bump 13 is bonded. The positioning bump 13 and the pad 23 are bonded while applying ultrasonic oscillation to the semiconductor chip 10, and subsequently, the bumps 12 and the electrode terminals 22 are bonded while applying ultrasonic oscillation to the semiconductor chip 10.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了通过防止半导体芯片的位置偏移将电子元件精确地安装到电路板上，当通过施加超声波振荡将半导体芯片接合到电路板时。解决方案：安装电子部件的方法适于通过倒装芯片接合将半导体芯片10安装到电路板20上，其中凸块12和具有较大尺寸和较高突起的定位凸块13 凸块12的那些形成在半导体芯片10上，并且电路板20设置有与凸块12接合的电极端子22和与定位凸块13接合的焊盘23。定位突起13和焊盘23在向半导体芯片10施加超声波振动的同时被接合，随后，在向半导体芯片10施加超声波振动的同时，接合凸块12和电极端子22。）2010，JPO＆INPIT

62. 发明专利

JP2009224754A Semiconductor light emitting device, lighting apparatus, and image display device 审中-公开
标题翻译：半导体发光装置，照明装置和图像显示装置
公开(公告)号：JP2009224754A
公开(公告)日：2009-10-01
申请号：JP2008212445
申请日：2008-08-21
申请人： Mitsubishi Chemicals Corp , 三菱化学株式会社
发明人： KATO HANAKO , MORI HIROSHI , IMURA HIROYUKI
IPC分类号： H01L33/48 , H01L33/50 , H01L33/56
CPC分类号： H01L2224/14 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49107 , H01L2224/73265 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a new semiconductor light emitting device having resistance against occurrence of cracking and releasing under a long period of usage, especially having excellent brightness (reflectivity), durability, heat resistance, light resistance and adhesiveness or the like, even used for a power device. SOLUTION: The semiconductor light emitting device includes: a package (A); a semiconductor element (B); and a sealing material (C). The surface material of the package (A) and/or the semiconductor element (B) contains at least one or more among Si, Al and Ag, and the sealing material (C) satisfies a predetermined condition and is directly brought into contact with the surface material of the package (A) and/or the semiconductor element (B). COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决问题的方案为了提供一种具有耐久性，耐久性，耐热性，耐光性，粘合性，特别是具有优异的亮度（反射率），耐久性，耐热性，耐光性和粘接性的长时间使用中具有抗裂纹和脱模性的新型半导体发光元件喜欢，甚至用于电源设备。解决方案：半导体发光器件包括：封装（A）; 半导体元件（B）; 和密封材料（C）。封装（A）和/或半导体元件（B）的表面材料含有Si，Al和Ag中的至少一种或多种，密封材料（C）满足预定条件并直接与封装（A）和/或半导体元件（B）的表面材料。版权所有（C）2010，JPO＆INPIT

63. 发明专利

JP2009194188A Semiconductor device mounting structure 审中-公开
标题翻译：半导体器件安装结构
公开(公告)号：JP2009194188A
公开(公告)日：2009-08-27
申请号：JP2008034063
申请日：2008-02-15
申请人： Denso Corp , 株式会社デンソー
发明人： WATANABE YUJI , SUGIURA TAKAO , TADA SHINGO
IPC分类号： H01L21/60
CPC分类号： H01L24/81 , H01L2224/14
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device mounting structure capable of suppressing break of a first bump 5 disposed on the outer edge portion among bumps 5 and 6 connecting a semiconductor device 1 and a substrate 7 and suppressing misalignment of the semiconductor device 1 to the substrate 7 when a vibration or mechanical external force is applied to the semiconductor device 1. SOLUTION: A first bump 5 made of a material having a fusing point within a working temperature range of a semiconductor device 1 and entering a liquid phase state at least once while the semiconductor device 1 is working is disposed on an outer edge portion to which a great thermal stress by the semiconductor device 1 and the substrate 7 is repeatedly applied among junctions of the semiconductor device 1 and the substrate 7. A second bump 6 made of a material having a higher fusing point than the working temperature range of the semiconductor device 1 and remaining in a solid phase state even when the semiconductor device 1 is working is disposed on the inward side of the outer edge portion, namely, on the inward side of the disposition of the first bump 5. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种半导体装置安装结构，其能够抑制连接半导体装置1和基板7的凸块5和6中设置在外边缘部分上的第一凸块5的断裂并抑制半导体的未对准当半导体器件1施加振动或机械外力时，器件1到基板7.解决方案：由半导体器件1的工作温度范围内具有熔点的材料制成的第一凸点5，在半导体器件1工作时至少一次的液相状态设置在半导体器件1和衬底7的接合部之间由半导体器件1和衬底7重复施加了大的热应力的外边缘部分上由具有比半导体器件1的工作温度范围高的熔点高且保持固相状态的材料制成的第二凸块6 当半导体器件1工作时，en设置在外边缘部分的内侧，即位于第一凸块5的位置的内侧。（C）2009，JPO＆INPIT

64. 发明专利

JP2008288539A Method for pre-processing semiconductor light emitting device before mounting 有权
标题翻译：在安装前预处理半导体发光器件的方法
公开(公告)号：JP2008288539A
公开(公告)日：2008-11-27
申请号：JP2007155746
申请日：2007-05-16
申请人： Philips Lumileds Lightng Co Llc , フィリップスルミレッズライティングカンパニーリミテッドライアビリティカンパニー
发明人： SHCHEKIN OLEG BORISOVICH , SUN XIAOLIN , SUN DECAI
IPC分类号： H01L21/56 , H01L21/60 , H01L33/62
CPC分类号： H01L2224/14
摘要： PROBLEM TO BE SOLVED: To provide a method for pre-processing a semiconductor light emitting device before mounting. SOLUTION: A light emitting device has a mounting surface for mounting on a sub-mount. This method includes a step for processing at least one surface of the light emitting device other than the mounting surface so that surface energy of the at least one surface is deteriorated. Thereby, when the light emitting device is mounted, an under fill material constructed between the mounting surface and the sub-mount does not contaminate at least one surface. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种在安装之前预处理半导体发光器件的方法。解决方案：发光装置具有用于安装在副安装座上的安装表面。该方法包括用于处理除安装表面之外的发光装置的至少一个表面的步骤，使得至少一个表面的表面能量劣化。因此，当安装发光装置时，构造在安装表面和副安装座之间的下填充材料不会污染至少一个表面。版权所有（C）2009，JPO＆INPIT

65. 发明专利

JP4171720B2 Flip chip nitride semiconductor light-emitting element 有权
公开(公告)号：JP4171720B2
公开(公告)日：2008-10-29
申请号：JP2004178821
申请日：2004-06-16
申请人：三星電機株式会社
发明人：寧俊鄭 , 容天金 , 顯 ▲火▼ 金
IPC分类号： H01L33/06 , H01L33/10 , H01L33/32 , H01L33/38 , H01L33/46 , H01L33/62
CPC分类号： H01L33/405 , H01L33/32 , H01L33/387 , H01L33/44 , H01L2224/14 , Y10S257/918

66. 发明专利

JP2008227137A Electrostatic countermeasure component and light-emitting diode module using the same 审中-公开
标题翻译：静电计量测量组件和使用其的发光二极管模块
公开(公告)号：JP2008227137A
公开(公告)日：2008-09-25
申请号：JP2007063197
申请日：2007-03-13
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： INOUE TATSUYA , KATSUMURA HIDENORI
IPC分类号： H01L33/62
CPC分类号： H01L2224/14 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a small-sized, highly strong electrostatic countermeasure component having the excellent heat radiation property and a light-emitting diode module using the same. SOLUTION: The electrostatic countermeasure component comprises a ceramic sintered compact having a ceramic substrate 12, a varistor part 10 formed thereon except for a part of a non-formation part 18 and a glass ceramic layer 14 formed further thereon, a pair of terminal electrodes 13a, 13b provided on the ceramic substrate 12 of the ceramic sintered compact with a part thereof exposed on the non-formation part 18, a pair of external electrodes 16a, 16b and a heat conductor part 15 provided through the upper and lower sides of the ceramic substrate 12. The light-emitting diode module comprises a light-emitting diode element mounted on the heat conductor part 15 in the non-formation part 18 of the electrostatic countermeasure component. Since the heat conductor part 15 is provided, the electrostatic countermeasure component and the light-emitting diode module radiate efficiently the heat emitted by the loaded parts. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供具有优异散热性能的小型，高强度的静电对抗组件和使用其的发光二极管模块。解决方案：静电对抗部件包括具有陶瓷基板12的陶瓷烧结体，除了非形成部分18的一部分之外形成的变阻器部分10，以及形成在其上的玻璃陶瓷层14，一对设置在陶瓷烧结体的陶瓷基板12上的端子电极13a，13b，其一部分暴露在非形成部18上，一对外部电极16a，16b和通过上下两侧设置的导热体部15 发光二极管模块包括安装在静电对抗部件的非形成部分18中的导热体部分15上的发光二极管元件。由于设置了导热体部15，所以静电对抗部件和发光二极管模块有效地辐射由负载部件发出的热量。版权所有（C）2008，JPO＆INPIT

67. 发明专利

JP2008523615A Multicolor, adaptive short wavelength led broadband or "white" light-emitting 有权
公开(公告)号：JP2008523615A
公开(公告)日：2008-07-03
申请号：JP2007545453
申请日：2005-10-18
申请人：スリーエムイノベイティブプロパティズカンパニー
发明人：サン，シャオグアン , エル．スミス，テリー , エー．ハッセ，マイケル , ジェイ．ミラー，トーマス
IPC分类号： H01L33/08 , H01L33/50
CPC分类号： H01L33/08 , H01L2224/05001 , H01L2224/05023 , H01L2224/0508 , H01L2224/05568 , H01L2224/14 , H01L2224/05541 , H01L2224/05005
摘要：短波長ＬＥＤおよび再発光半導体構造を備え、再発光半導体構造がｐｎ接合内部に位置していない少なくとも１つの電位井戸を備える適合型ＬＥＤが提供される。電位井戸は一般的に、量子井戸である。適合型ＬＥＤは、白色光ＬＥＤであってもよく、または近白色光ＬＥＤであってもよい。再発光半導体構造は、電位井戸の周囲または近くにまたは直に隣接する吸収層をさらに備えてもよい。さらに、本発明による適合型ＬＥＤを備えるグラフィックディスプレイ装置および照明装置が提供される。

68. 发明专利

JP4104889B2 Optical semiconductor device 有权
标题翻译：空值
公开(公告)号：JP4104889B2
公开(公告)日：2008-06-18
申请号：JP2002094148
申请日：2002-03-29
申请人：株式会社東芝
发明人：浩山田 , 圭児高岡
IPC分类号： H01S5/022 , H01L21/60 , H01L27/15 , H01L31/0232 , H01L31/12
CPC分类号： H01L2224/14 , H01L2224/1701 , H01L2224/1703 , H01L2924/00012

69. 发明专利

JP2008091611A Semiconductor device, electronic device, and manufacturing method of electronic device 审中-公开
标题翻译：电子设备的半导体器件，电子器件及其制造方法
公开(公告)号：JP2008091611A
公开(公告)日：2008-04-17
申请号：JP2006270568
申请日：2006-10-02
申请人： Seiko Epson Corp , セイコーエプソン株式会社
发明人： TANAKA SHUICHI
IPC分类号： H01L21/60
CPC分类号： H01L2224/11 , H01L2224/14 , H01L2224/14517 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/14 , H01L2924/15787 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device enabling to efficiently manufacture a highly reliable electronic device, to provide the highly reliable electronic device, and to provide a method of efficiently manufacturing the highly reliable electronic device.
SOLUTION: The semiconductor device has a semiconductor substrate 10 having electrodes 12 formed thereon, resin protrusions 20 formed on a surface 15 where electrodes in the semiconductor substrate 10 are formed, wirings 30 each having an electric connection portion 32 disposed on the resin protrusions 20 and electrically connected to the electrode 12, and metal bumps 40 formed on the surface 15.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种半导体器件，能够高效地制造高可靠性的电子器件，提供高可靠性的电子器件，并且提供一种有效地制造高可靠性电子器件的方法。解决方案：半导体器件具有形成有电极12的半导体衬底10，形成在形成有半导体衬底10中的电极的表面15上的树脂突起20，每个布线30具有设置在树脂上的电连接部分32 突起20并电连接到电极12，以及形成在表面15上的金属凸块40.版权所有（C）2008，JPO＆INPIT

70. 发明专利

JP4057261B2 Semiconductor device and a method of manufacturing the same 有权
标题翻译：空值
公开(公告)号：JP4057261B2
公开(公告)日：2008-03-05
申请号：JP2001242301
申请日：2001-08-09
申请人：松下電器産業株式会社
发明人：和之冨田 , 憲一山本 , 和也後川
IPC分类号： H01L21/60
CPC分类号： H01L2224/14 , H01L2224/1403 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/73204 , H01L2924/14 , H01L2924/19105 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device and its manufacturing method that can achieve a stable signal transmission in the connection between a semiconductor element for handling a high-frequency signal and a circuit board. SOLUTION: The semiconductor device comprises a first bump 115a, and a second bump 115b for forming clearance 118 for capacity generation that allows a capacitance component for securing stability in the characteristics of a semiconductor element 111 to be generated, thus stably transmitting signals in the connection between the semiconductor element and a circuit board 112 by the capacitance component even in a semiconductor device requiring high- speed, high-frequency operation especially. Further, a conventional capacitor is not required, thus improving the packaging properties of the semiconductor element to the circuit board, and reducing the cost.
摘要翻译：要解决的问题：提供一种能够在用于处理高频信号的半导体元件与电路板之间的连接中实现稳定的信号传输的半导体器件及其制造方法。解决方案：半导体器件包括第一凸起115a和用于形成容量产生的间隙118的第二凸起115b，其允许用于确保要产生的半导体元件111的特性的稳定性的电容部件，从而稳定地在连接中传输信号即使在需要高速，高频操作的半导体装置中，也可以通过电容成分在半导体元件与电路基板112之间。此外，不需要传统的电容器，从而提高了半导体元件对电路板的封装性能，并降低了成本。

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