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61. 发明专利

JP2007059371A Lighting fixture using the Led 有权
标题翻译： LUMINAIRE使用LED
公开(公告)号：JP2007059371A
公开(公告)日：2007-03-08
申请号：JP2005371116
申请日：2005-12-22
申请人： Matsushita Electric Works Ltd , 松下電工株式会社
发明人： URANO YOJI , GOTO YOSHIRO , HIDAKA YASUHIRO , NAKATANI TAKUYA
IPC分类号： F21V19/00 , F21S8/04 , F21V5/04 , F21V29/00 , F21Y101/02 , H01L33/32 , H01L33/34 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L33/64
CPC分类号： H01L2224/48091 , H01L2224/73265 , H01L2924/19107 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a luminaire using LEDs which can suppress the temperature rise of LED chips, of enhancing the optical output, and of reducing the cost of a circuit board. SOLUTION: This luminaire using LEDs is provided with a metallic luminaire body 90 formed into a bottomed cylindrical shape with one surface opened; a plurality of LED chip units 1, each having an LED chip and a pair of lead terminals 42 and 43 with respective electrodes, respectively electrically connected thereto and arranged in the luminaire body 90; an insulation layer interlaid between the LED chip units 1 and the bottom wall 90a of the luminaire body 90 for electrically insulating them from each other and making them thermally couple with each other; and a circuit board 20, which is arranged in the luminaire body 90 and on which a circuit pattern 22 for feeding power to the respective LED chip units 1 is formed, and a plurality of window holes 23 for respectively inserting the respective LED chips 1 are formed therein. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够抑制LED芯片的温度上升，提高光输出以及降低电路板成本的LED的照明装置。解决方案：使用LED的该灯具设置有形成为有一个表面打开的有底圆筒形状的金属灯具本体90; 多个LED芯片单元1，每个LED芯片单元1分别具有LED芯片和一对引线端子42和43，所述引线端子42和43分别电连接并配置在照明器体90中; LED芯片单元1和照明器体90的底壁90a之间的绝缘层，用于将它们彼此电绝缘并使它们彼此热耦合; 以及配置在照明装置主体90内的电路基板20，在其上形成有用于向各LED芯片单元1供电的电路图案22以及分别插入各LED芯片1的多个窗孔23 在其中形成。版权所有（C）2007，JPO＆INPIT

62. 发明专利

JP2007043126A Lighting fixture using the Led 有权
标题翻译： LUMINAIRE使用LED
公开(公告)号：JP2007043126A
公开(公告)日：2007-02-15
申请号：JP2006182470
申请日：2006-06-30
申请人： Matsushita Electric Works Ltd , 松下電工株式会社
发明人： URANO YOJI , NAKATANI TAKUYA , HIDAKA YASUHIRO
IPC分类号： H01L33/32 , F21S8/04 , F21V19/00 , F21V29/00 , F21Y101/02 , H01L33/34 , H01L33/62 , H01L33/64
CPC分类号： H01L2224/48091 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a luminaire using an LED capable of suppressing an increase in temperature in an LED chip and increasing light output. SOLUTION: There are provided the LED chip 10 in which anode and cathode electrodes are formed at one surface side and the other, respectively; a chip mounting member 41 made of a metal plate to which the LED chip 10 is mounted; a lead terminal 43 to which the anode electrode of the LED chip 10 is connected electrically; a lead terminal 42 to which the cathode electrode of the LED chip 10 is connected electrically; a metal tool body 90; and an insulating layer 80 that is interposed between the chip mounting member 41 and respective lead terminals 42, 43, and the tool body 90, insulates both of them electrically, and couples both of them thermally. The chip mounting member 41 and the respective lead terminals 42, 43 are formed by using lead frames. An organic green sheet is used as the insulating layer 80 for coupling both the chip mounting member and the respective lead terminals by the organic green sheet. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种使用能够抑制LED芯片中的温度升高并增加光输出的LED的照明器。解决方案：提供了LED芯片10，其中阳极和阴极电极分别在一个表面侧和另一个表面侧形成; 由安装LED芯片10的金属板制成的芯片安装构件41; LED芯片10的阳极与电连接的引线端子43; LED芯片10的阴极电连接的引线端子42; 金属工具主体90; 插入在芯片安装构件41和各个引线端子42,43之间的绝缘层80和工具主体90两者电绝缘，并将它们热耦合。芯片安装部件41和各引线端子42,43由引线框构成。使用有机生片作为用于通过有机绿色片将芯片安装构件和各个引线端子连接的绝缘层80。版权所有（C）2007，JPO＆INPIT

63. 发明专利

JP2007035427A Light emitting device 审中-公开
标题翻译：发光装置
公开(公告)号：JP2007035427A
公开(公告)日：2007-02-08
申请号：JP2005216509
申请日：2005-07-26
申请人： Matsushita Electric Works Ltd , 松下電工株式会社
发明人： NAKATANI TAKUYA , URANO YOJI , GOTO YOSHIRO
IPC分类号： F21V5/04 , F21S8/04 , F21V19/00 , F21V29/00 , F21Y101/02 , H01L33/58
摘要： PROBLEM TO BE SOLVED: To provide a light emitting device usable in common for a plurality of types of luminaires having luminaire bodies different in shape and capable of reducing the cost of each luminaire. SOLUTION: This light emitting device 1 is provided with: a light emitting element 10; a board 20 with the light emitting element 10 mounted thereon; and a light distribution lens 30 for distributing light emitted from the light emitting element 10. The light distribution lens 30 is integrated with the board 20. The light distribution lens 30 is formed with a columnar body having the same circumferential shape as that of the board 20. The circumferential shape of the board 20 is rectangular, and the light distribution lens 30 is formed into a quadrangular prism-like shape and integrated with the board 20. In this case, the refractive index of the light distribution lens 30 is so adjusted as to provide a desired light-distribution lens characteristic. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种可用于具有不同形状并且能够降低每个照明器的成本的灯具体的多种类型的灯具的共同的发光装置。解决方案：该发光器件1具有：发光元件10; 安装有发光元件10的板20; 以及用于分配从发光元件10发射的光的配光透镜30.配光透镜30与基板20一体化。配光透镜30形成有与板的周向形状相同的圆柱形状的柱状体板20的圆周形状是矩形的，并且配光透镜30形成为四边形棱镜形状并与板20集成。在这种情况下，配光透镜30的折射率如此调节以提供期望的配光透镜特性。版权所有（C）2007，JPO＆INPIT

64. 发明专利

JP2006278567A Led unit 审中-公开
标题翻译： LED单元
公开(公告)号：JP2006278567A
公开(公告)日：2006-10-12
申请号：JP2005093127
申请日：2005-03-28
申请人： Matsushita Electric Works Ltd , 松下電工株式会社
发明人： URANO YOJI , TANAKA KENICHIRO , KAMATA SAKUO , NAKATANI TAKUYA
IPC分类号： H01L33/12 , H01L33/32 , H01L33/42 , H01L33/50 , H01L33/54 , H01L33/56 , H01L33/64
CPC分类号： H01L2224/16225
摘要： PROBLEM TO BE SOLVED: To provide an LED unit capable of improving efficiency of taking out light and suppressing a rise in temperature of an LED chip. SOLUTION: The LED unit includes an electrically conductive heat-conductive part 1; a heat-conductive and electrically conductive substrate 2 heat-transmittingly and electrically connected to one surface of the heat-conductive part 1; the LED chip 3 consisting of an n-type semiconductor layer 30 joined to a surface of a substrate 2 opposite to the heat-conductive part 1, a light emitting layer 31 provided on the surface of the semiconductor layer 30 opposite to the substrate 2, and a p-type semiconductor layer 32 provided on a surface of the light emitting layer 31 opposite to the n-type semiconductor layer; a transparent electrode 4 joined to the surface of the p-type semiconductor layer 32 opposite to the light emitting layer 31; and a light diffusion part 5 joined to the surface of the transparent electrode 4 opposite to the p-type semiconductor layer 32 for diffusing the light from the LED chip 3. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够提高取出光的效率并抑制LED芯片的温度上升的LED单元。解决方案：LED单元包括导电导热部分1; 与导热部1的一个表面热传导电连接的导热性导电性基板2; 由连接到与导热部1相反的基板2的表面的n型半导体层30构成的LED芯片3，设置在与基板2相对的半导体层30的表面上的发光层31，以及设置在与n型半导体层相反的发光层31的表面上的p型半导体层32。接合到与发光层31相对的p型半导体层32的表面的透明电极4; 以及与透明电极4的与p型半导体层32相对的表面接合的光扩散部分5，用于漫射来自LED芯片3的光。版权所有（C）2007，JPO＆INPIT

65. 发明专利

JP2004233470A Optical device and method for manufacturing the same 有权
标题翻译：光学装置及其制造方法
公开(公告)号：JP2004233470A
公开(公告)日：2004-08-19
申请号：JP2003019548
申请日：2003-01-28
申请人： Matsushita Electric Works Ltd , 松下電工株式会社
发明人： URANO YOJI , KOMAKI KATSUJI
IPC分类号： G02B6/30 , G02B6/13 , G02F1/01 , G02F1/295
摘要： PROBLEM TO BE SOLVED: To provide an optical device equipped with a reinforcing block for connecting the optical fiber to an optical device without damaging the characteristics of the optical device and a method for manufacturing the same. SOLUTION: An optical device 1 is equipped with an optical waveguide 3 formed by using a material having a thermooptic effect and a heater 4 for controlling polarization of guided light on a substrate 2 with a light shielding property, and has reinforcing blocks 5 which are used for connecting the optical fiber thereto and adhered, via an adhesive 51, to the end parts of a substrate surface of the side opposite to the surface where the optical waveguide is formed. After the reinforcing block members are adhered to the rear surface of the optical waveguide plate, the end faces for joining the optical fiber are formed by cutting. Because the reinforcing blocks 5 are adhered to the end parts of the substrate surface, a heat absorbing body is disposed in a space below the surface of the heater 4, and an increase or a decrease in the temperature of the core part necessary for fast switching is realized. COPYRIGHT: (C)2004,JPO&NCIPI
摘要翻译：要解决的问题：提供一种配备有用于将光纤连接到光学装置的加强块的光学装置，而不损害光学装置的特性及其制造方法。解决方案：光学装置1配备有通过使用具有热光效应的材料形成的光波导3和用于控制具有遮光性的基板2上的引导光的偏振的加热器4，并且具有加强块5 用于将光纤连接到其上并通过粘合剂51粘附到与形成光波导的表面相对的一侧的基板表面的端部。在加强块构件粘附到光波导板的后表面之后，通过切割形成用于接合光纤的端面。由于加强块5粘附到基板表面的端部，所以在加热器4的表面下方的空间内设置吸热体，快速切换所需的芯部的温度上升或下降实现了。版权所有（C）2004，JPO＆NCIPI

66. 发明专利

JP2004233467A Optical device and method for manufacturing the same 有权
公开(公告)号：JP2004233467A
公开(公告)日：2004-08-19
申请号：JP2003019461
申请日：2003-01-28
申请人： Matsushita Electric Works Ltd , 松下電工株式会社
发明人： URANO YOJI , KOMAKI KATSUJI
IPC分类号： G02B6/30 , G02B6/12 , G02F1/01
摘要： PROBLEM TO BE SOLVED: To provide an optical device which reduces optical loss and in particular which is suitably applicable to a thermooptic optical switch when a reinforcing block for connection of an optical fiber is mounted in a waveguide type optical device having a heater for controlling a refractive index. SOLUTION: An optical device 1 has a heater 6 which controls the refractive index and is disposed on an optical waveguide layer 2 consisting of a core 4 and a cladding 3. A reinforcing block 5 for connection of the optical fiber is mounted on a surface of the optical waveguide layer 2 where the heater 6 is disposed by adhesion via an adhesive layer 7 which has a refractive index lower than that of the cladding 3 of the optical waveguide layer 2. COPYRIGHT: (C)2004,JPO&NCIPI

67. 发明专利

JP2004173866A Quantitative device for non-invasive biocomponent 有权
公开(公告)号：JP2004173866A
公开(公告)日：2004-06-24
申请号：JP2002342958
申请日：2002-11-26
申请人： Matsushita Electric Works Ltd , 松下電工株式会社
发明人： OKUNO KANAME , KITAMURA KEIMEI , HAMADA OSAO , NISHIMURA MAKOTO , URANO YOJI , KIDA YUJI , MARUO KATSUHIKO , CHIN JIYAKUSEI
IPC分类号： A61B5/145 , A61B5/1455 , G01N21/35 , G01N21/359
摘要： PROBLEM TO BE SOLVED: To provide a small-scale and energy-saving quantitative device for non-invasive biocomponents analyzing the concentrations of body fluid components or chemical components in biotissue or body fluid using absorption of light in a near infrared range. SOLUTION: This quantitative device is an optical device non-invasively and quantitatively determining the biocomponents. The device comprises a light source part emitting lights of a plurality of different wavelengths in a near infrared wavelength range from 100 nm to 2500 nm in order, a probe part irradiating the light to a bioorganism and receiving a reflected light from the bioorganism or the transmission light transmitting through the bioorganism, a light receiving part converting the light incident on the probe part into an electronic signal, and an arithmetic part calculating the concentration of the biocomponents by arithmetically processing based on an absorbency for every wavelength obtained in the light receiving part. The light source part, the probe part, the light receiving part and the arithmetic part are formed into a single assembly unit. This device irradiates the light with different wavelengths to a subject in order and is formed as the single assembly unit. COPYRIGHT: (C)2004,JPO

68. 发明专利

JP2008010791A Light-emitting device 有权
标题翻译：发光装置
公开(公告)号：JP2008010791A
公开(公告)日：2008-01-17
申请号：JP2006182471
申请日：2006-06-30
申请人： Matsushita Electric Works Ltd , 松下電工株式会社
发明人： URANO YOJI
IPC分类号： H01L33/32 , H01L33/50 , H01L33/54 , H01L33/60 , H01L33/62 , H01L33/64
摘要： PROBLEM TO BE SOLVED: To provide a light-emitting device enabling higher light output. SOLUTION: The light-emitting device includes an LED chip 10, a mounting board 20 which has conductor patterns 23 and 23 for supplying power to the LED chip 10 and carries the mounted LED chip 10, a domelike optical member 60 which is fixed to the one surface side of the mounting board 20 to house the LED chip 10 between the optical member 60 and the mounting board 20, a sealing portion 50 composed of a transparent sealing resin that fills a space encircled with the optical member 60 and mounting board 20 to seal the LED chip 10, and a domelike color change member 70 which is so disposed as to encircle the optical member 60 on the one surface side of the mounting board 20. The mounting board 20 is provided with a plurality of resin pooling holes 27 between a part of one surface overlapping the mounting board 20 side edge of the optical member 60 and a part of one surface overlapping the mounting board 20 side edge of the color change member 70, where the resin pooling holes 27 pool the sealing resin leaking from the space when the optical member 60 is fixed to the mounting board 20. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供能够实现更高的光输出的发光装置。解决方案：发光器件包括LED芯片10，安装板20，其具有用于向LED芯片10供电并承载安装的LED芯片10的导体图案23和23，一个圆顶形光学元件60，固定到安装板20的一个表面侧以将LED芯片10容纳在光学构件60和安装板20之间，密封部分50由透明密封树脂构成，该透明密封树脂填充由光学构件60包围的空间并安装板20以密封LED芯片10，以及在安装板20的一个表面侧上环绕光学构件60而设置的多米色变色构件70.安装板20设置有多个树脂集合在一个表面的与光学构件60的安装板20侧边缘重叠的部分与与颜色变化构件70的安装板20侧边缘重叠的一个表面的一部分之间的孔27，其中树脂池27聚集在一起当光学构件60固定到安装板20上时，密封树脂从空间泄漏。（C）2008年，JPO和INPIT

69. 发明专利

JP2007295007A Led lighting equipment 有权
标题翻译： LED照明设备
公开(公告)号：JP2007295007A
公开(公告)日：2007-11-08
申请号：JP2007197856
申请日：2007-07-30
申请人： Matsushita Electric Works Ltd , 松下電工株式会社
发明人： KAMATA SAKUO , NISHIOKA YASUSHI , URANO YOJI
IPC分类号： F21S8/04 , F21V29/00 , F21Y101/02 , H01L33/32 , H01L33/54 , H01L33/56 , H01L33/64
CPC分类号： H01L2224/14 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide an LED lighting equipment in which temperature rise of an LED chip can be suppressed, and an increase in output of optical output power can be achieved. SOLUTION: A light emitting device 1 has an LED chip 10, a heat transfer plate 21 mounted with an LED chip 10; a wiring board 22 having conductor patterns 23 and 23 for power feeding to the LED chip 10 on one surface side, and formed with a window hole (exposed part) 24 that exposes a mounting surface of the LED chip 10 on the heat transfer plate 21; and a circuit board 200 formed with an opening window 204 through which a part of the light emitting device 1 passes, and arranged apart from an equipment body 100. The device is jointed to the equipment body 100 via an insulation layer 90 that has electric non-conductance, and is intervened between the heat transfer plate 21 and the equipment body 100 to joint them and make thermal binding. The insulation layer 90 contains a filling material made up of filler and is formed by epoxy resin sheet that becomes low-viscosity in heating and has high flow property in the heating. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供可以抑制LED芯片的温度升高并且可以实现光输出功率的输出增加的LED照明设备。解决方案：发光器件1具有LED芯片10，安装有LED芯片10的传热板21; 布线板22具有导体图案23和23，用于在一个表面侧向LED芯片10供电，并且形成有将LED芯片10的安装表面暴露在传热板21上的窗孔（暴露部分）24 ; 以及形成有开口窗口204的电路板200，发光装置1的一部分穿过该开口窗口204并且与设备主体100分开布置。该装置经由具有电非绝缘层的绝缘层90连接到设备主体100，并且介于传热板21和设备主体100之间以接合它们并进行热粘合。绝缘层90包含由填料构成的填充材料，并且由加热时变得低粘度且在加热中具有高流动性的环氧树脂片形成。版权所有（C）2008，JPO＆INPIT

70. 发明专利

JP2007266631A Light emitting device 有权
标题翻译：发光装置
公开(公告)号：JP2007266631A
公开(公告)日：2007-10-11
申请号：JP2007174219
申请日：2007-07-02
申请人： Matsushita Electric Works Ltd , 松下電工株式会社
发明人： KAMATA SAKUO , NISHIOKA YASUSHI , URANO YOJI
IPC分类号： H01L33/56 , F21S8/04 , F21Y101/02 , H01L33/62
摘要： PROBLEM TO BE SOLVED: To provide a light emitting device which improves the luminous efficiency without causing a size to be significantly increased.
SOLUTION: The light emitting device has many LED chips 10 including three types for emitting the blue-based, green-based and red-based colors, a mounting substrate 20 where such many LED chips 10 are mounted, a framework 40 for surrounding all the LED chips 10 at the mounting surface side of the LED chips 10 on the mounting substrate 20, a sealing section 50 which is formed with a transparent resin material filled into the inner side of the framework 40 for sealing a bonding wire 14 connected to each of the LED chips 10 and individual LED chips 10 while keeping the elasticity, optical members 60 which are placed in piles on the sealing section 50, and a domy protection cover 70 which covers the optical members 60 at the side of light emission surfaces 60b of the optical members 60 as a molded part formed with a transparent material and which is arranged such that an air layer 80 is formed between the light emission surfaces 60b and framework 40.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决的问题：提供一种提高发光效率的发光装置，而不会使尺寸显着增加。解决方案：发光器件具有许多LED芯片10，其包括用于发射基于蓝色，绿色和红色的颜色的三种类型，安装这种许多LED芯片10的安装基板20，用于围绕安装基板20上的LED芯片10的安装表面侧的所有LED芯片10，密封部分50，其形成有填充到框架40的内侧的透明树脂材料，用于密封连接的接合线14 同时保持弹性的每个LED芯片10和单独的LED芯片10，将放置在桩中的光学构件60放置在密封部分50上，并且在发光表面侧覆盖光学构件60的保护盖70 60B作为形成有透明材料的模制部件，并且被布置成使得在发光表面60b和框架40之间形成空气层80.版权所有（C）2008，JPO＆INPIT

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