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1. 发明专利

JP2007251214A Light emitting device 有权
标题翻译：发光装置
公开(公告)号：JP2007251214A
公开(公告)日：2007-09-27
申请号：JP2007174218
申请日：2007-07-02
申请人： Matsushita Electric Works Ltd , 松下電工株式会社
发明人： KAMATA SAKUO , NISHIOKA YASUSHI , URANO YOJI
IPC分类号： H01L33/32 , H01L33/50 , H01L33/56 , H01L33/58 , H01L33/62
摘要： PROBLEM TO BE SOLVED: To improve luminous efficiency without up-sizing by mounting a plurality of LED chips on a mounting substrate, which increases a total area where light is emitted and improves luminous efficiency as compared with mounting a single LED chip on the mounting substrate. SOLUTION: The light emitting device includes LED chip 10 which emit blue light; a mounting substrate 20 on which the LED chips 10 are mounted; frame bodies 40 which surrounds the LED chips 10 on the mounting surface side of the LED chips 10 on the mounting substrate 20; elastic sealing portions 50 which seal the LED chips 10 and bonding wires 14 and 14 connected to the LED chips 10 by filling transparent resin material inside the frame bodies 40; and dome shaped protective covers 70 that is a molded product in which yellow phosphor radiating broad yellow light by being excited by the emitted light from the LED chips 10 are formed with transparent material, which cover optical members 60 on the light emission planes 60b side of the optical members 60, and in which air layers 80 are formed between the light emission planes 60b and the frame bodies 40. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：通过将多个LED芯片安装在安装基板上来提高发光效率而不需要通过将多个LED芯片安装在安装基板上，与将单个LED芯片安装在一起时，这增加了发光量的总面积并提高发光效率安装基板。
解决方案：发光器件包括发射蓝光的LED芯片10; 其上安装有LED芯片10的安装基板20; 在安装基板20上的LED芯片10的安装面侧围绕LED芯片10的框体40; 通过将透明树脂材料填充到框体40内部来密封LED芯片10和连接到LED芯片10的接合线14和14的弹性密封部分50; 以及作为模制品的圆顶形保护罩70，其中通过被来自LED芯片10的发射光激发而发出黄色光的黄色荧光体形成有透明材料，透明材料覆盖在发光平面60b侧的光学构件60 光学构件60，并且其中空气层80形成在发光平面60b和框体40之间。版权所有（C）2007，JPO＆INPIT

2. 发明专利

JP2007165937A Light-emitting device 审中-公开
标题翻译：发光装置
公开(公告)号：JP2007165937A
公开(公告)日：2007-06-28
申请号：JP2007062213
申请日：2007-03-12
申请人： Matsushita Electric Works Ltd , 松下電工株式会社
发明人： URANO YOJI , NAKATANI TAKUYA , HIDAKA YASUHIRO
IPC分类号： F21V19/00 , F21V29/00 , F21Y101/02 , H01L33/58 , H01L33/62 , H01L33/64
CPC分类号： H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a light-emitting device capable of suppressing temperature rise of an LED chip and realizing high output of optical output. SOLUTION: The device is provided with an LED chip 10; a chip mounting member 70 having a conductive plate (heat transmitting plate) 71 having the LED chip 10 mounted on one surface side, and conductor patterns 73, 73 provided on the one surface side of the conductive plate 71 via an insulating portion 72 and electrically connected to the LED chip 10; and a sheet-like jointing member 80, arranged on the other surface side of the conductive plate 71 to joint the conductive plate 71 to a tool body 90 as a metal member for holding the chip-mounting member 70. A resin sheet, containing a filling material made of a filler and having low viscosity, when heated as the jointing member 80, and the jointing member 80 has electric insulation and a function of making the conductive plate 71 thermally couple with the tool body 90. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够抑制LED芯片的温度升高并实现高输出光输出的发光装置。
解决方案：该装置设置有LED芯片10; 具有安装在一个表面侧上的LED芯片10的导电板（传热板）71的芯片安装构件70以及经由绝缘部分72设置在导电板71的一个表面侧上的电导体图案73,73 连接到LED芯片10; 以及布置在导电板71的另一个表面侧上的片状接合构件80，以将导电板71接合到作为用于保持芯片安装构件70的金属构件的工具主体90。填充材料由填料制成并且具有低粘度，当作为接合构件80加热时，并且接合构件80具有电绝缘性，并且具有使导电板71与工具主体90热耦合的功能。版权所有（ C）2007，JPO＆INPIT

3. 发明专利

JP2007142280A Light-emitting apparatus and manufacturing method thereof 有权
标题翻译：发光装置及其制造方法
公开(公告)号：JP2007142280A
公开(公告)日：2007-06-07
申请号：JP2005336191
申请日：2005-11-21
申请人： Matsushita Electric Works Ltd , 松下電工株式会社
发明人： MASUI MIKIO , URANO YOJI
IPC分类号： H01L33/32 , H01L33/50 , H01L33/54 , H01L33/56 , H01L33/62
CPC分类号： H01L2224/73265 , H01L2924/19107
摘要： PROBLEM TO BE SOLVED: To provide a light-emitting apparatus capable of improving reliability, improving optical output and suppressing the generation of color unevenness, and a manufacturing method thereof. SOLUTION: The apparatus is provided with an LED chip 10 for radiating a blue light; a frame 40 surrounding the LED chip 10 on the mounting surface side of the LED chip 10 in a mounting substrate 20; a sealing section 50 consisting of a silicone resin sealing the LED chip 10 and bonding wires 14, 14 connected to the LED chip 10 inside the frame 40; and a dome-like color conversion section 70 which is a molded body obtained by molding a yellow phosphor together with the silicone resin, and is fixed on the mounting substrate 20 in a way that the frame 40 is housed between itself and the mounting substrate 20. The frame 40 is made of a molded body of a silicone resin as a transparent resin, and a transparent resin portion 80 made of a silicone resin is interposed between the color conversion member 70 and the external side surface of a combination of the sealing section 50 and the frame 40. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决的问题：提供一种能够提高可靠性，提高光输出，抑制色差的产生的发光装置及其制造方法。解决方案：该装置设有用于发射蓝光的LED芯片10; 在安装基板20上的LED芯片10的安装面侧围绕LED芯片10的框架40; 密封部分50，其由密封LED芯片10的硅树脂和连接到框架40内部的LED芯片10的接合线14,14组成; 以及圆顶状颜色转换部70，其是通过与硅树脂一起模制黄色荧光体而获得的成型体，并且以框架40容纳在其自身与安装基板20之间的方式固定在安装基板20上框架40由作为透明树脂的有机硅树脂的成型体构成，由有机硅树脂构成的透明树脂部80插入在颜色转换部件70和密封部的组合的外侧面之间 50和框架40.版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2007116109A Led lighting equipment 有权
标题翻译： LED照明设备
公开(公告)号：JP2007116109A
公开(公告)日：2007-05-10
申请号：JP2006247228
申请日：2006-09-12
申请人： Matsushita Electric Works Ltd , 松下電工株式会社
发明人： KAMATA SAKUO , NISHIOKA YASUSHI , URANO YOJI
IPC分类号： H01L33/32 , H01L33/50 , H01L33/56 , H01L33/58 , H01L33/62 , H01L33/64
CPC分类号： H01L2224/48091 , H01L2924/19107 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide an LED lighting equipment in which temperature rise of an LED chip is suppressed while ensuring a high optical output power. SOLUTION: A light emitting device 1 held on an apparatus body 100 comprises: an LED chip 10; a heat transfer plate 21 composed of a thermally conductive material and mounting the LED chip 10; a wiring board 22 having conductor patterns 23 and 23 for supplying power to the LED chip 10 on one surface side and provided with a window (exposed part) 24 for exposing the mounting surface of the LED chip 10 in the heat transfer plate 21; a sealing portion 50 for sealing the LED chip 10 on one surface side of the wiring board 22; and a domelike color transformation member 70 formed of a phosphor and a translucent material and arranged on one surface side of the wiring board 22. The light emitting device 1 is bonded to the apparatus body 100 through an electric insulation layer 90 which is interposed between the heat transfer plate 21 and the apparatus body 100 and thermally couples them. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种在确保高光输出功率的同时抑制LED芯片的温度上升的LED照明设备。解决方案：保持在设备主体100上的发光器件1包括：LED芯片10; 由导热材料构成并安装LED芯片10的传热板21; 布线板22，其具有用于在一个表面侧向LED芯片10供电的导体图案23和23，并且设置有用于将LED芯片10的安装表面暴露在传热板21中的窗口（暴露部分）24; 用于将LED芯片10密封在布线板22的一个表面侧上的密封部分50; 以及由布线板22的一个表面侧配置的由荧光体和半透明材料形成的半球状色彩变换构件70.发光装置1通过电绝缘层90接合到装置本体100，电绝缘层90介于传热板21和装置主体100并将它们热耦合。版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2007116108A Light-emitting apparatus 有权
标题翻译：发光装置
公开(公告)号：JP2007116108A
公开(公告)日：2007-05-10
申请号：JP2006247227
申请日：2006-09-12
申请人： Matsushita Electric Works Ltd , 松下電工株式会社
发明人： URANO YOJI
IPC分类号： H01L33/32 , H01L33/56 , H01L33/58 , H01L33/62 , H01L33/64
CPC分类号： H01L2224/48091 , H01L2224/73265 , H01L2924/19107 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a light-emitting apparatus capable of realizing further higher output or longer service life by improving an effect of suppressing temperature rise in an LED chip, compared to a conventional configuration.
SOLUTION: In the light-emitting apparatus, a mounting substrate 20 is provided with a heat transfer plate 21 composed of a metal plate to be also used as a heat radiating plate. The LED chip 10 is mounted on one surface of the thickness direction of the heat transfer plate 21 via a plate-like submount member 30. The submount member 30 has an area larger than that of the LED chip 10, and the dimension of the submount member 30 is set so that the external circumferential part of the submount member 30 may come to the outside of a conical base in which an inscribed circle of an opposite surface to the submount member 30 in the LED chip 10 is an upper bottom surface and a circumscribed circle of the other surface in a thickness direction of the heat transfer plate 21 is a lower bottom surface.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决的问题：与现有的结构相比，提供一种通过提高抑制LED芯片的温度上升的效果，能够实现更高输出或延长使用寿命的发光装置。解决方案：在发光装置中，安装基板20设置有也用作散热板的由金属板构成的传热板21。 LED芯片10通过板状副安装件30安装在传热板21的厚度方向的一个表面上。副安装座部件30的面积大于LED芯片10的面积，底座的尺寸构件30被设定为使得副安装座构件30的外周部分可以到达与LED芯片10中的基座部件30相反的表面的内接圆为上底面的锥形基座的外侧，在传热板21的厚度方向上的另一个表面的外接圆是下底面。版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2007116075A Light-emitting apparatus 有权
标题翻译：发光装置
公开(公告)号：JP2007116075A
公开(公告)日：2007-05-10
申请号：JP2006018198
申请日：2006-01-26
申请人： Matsushita Electric Works Ltd , 松下電工株式会社
发明人： URANO YOJI , KAMATA SAKUO , NISHIOKA YASUSHI
IPC分类号： H01L33/32 , H01L33/46 , H01L33/50 , H01L33/56 , H01L33/58 , H01L33/62
CPC分类号： H01L2224/48091 , H01L2924/19107 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a light-emitting apparatus which has higher reliability than that of a conventional apparatus and can improve optical output.
SOLUTION: The light-emitting apparatus is provided with an LED chip 10; an insulative substrate 22 provided with a drilled window hole 24 for exposing a sub mount member 30 interposed between a metal plate 21 as a heat transfer plate and stacked on the metal plate 21; a sealing section 50 sealing the LED chip 10 and having elasticity; a lens 60 arranged so as to be stacked on the sealing section 50; and a dome-like color conversion member 70 that is a molded body formed by molding a phosphor emitting a color different from the color of a light emitted from the LED chip 10 together with a transparent material and is arranged on the insulative substrate 22 so as to cover the lens 60. The sub mount member 30 is provided with a reflecting film for reflecting light radiated from the side faces of the LED chip 10 around the joined portion of the LED chip 10. The thickness of the sub mount member 30 is set so that the surface of the reflection film may be positioned separately from the metal plate 21 as a heat transfer plate more than an end edge of the insulative substrate 22 in the color conversion member 70.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有比常规装置更高的可靠性的发光装置，并且可以改善光输出。解决方案：发光装置设置有LED芯片10; 设置有用于暴露介于作为传热板的金属板21并堆叠在金属板21上的副安装构件30的钻孔窗孔24的绝缘基板22; 密封部分50，密封LED芯片10并具有弹性; 布置成堆叠在密封部分50上的透镜60; 以及圆顶状颜色转换部件70，其是通过将与LED芯片10发射的颜色不同的颜色的荧光体与透明材料一起成型而形成的成型体，并且布置在绝缘基板22上，以便副安装构件30设置有反射膜，用于反射从LED芯片10的侧面辐射的光围绕LED芯片10的接合部分。副安装构件30的厚度被设定使得反射膜的表面可以与作为传热板的金属板21分开地位于比颜色转换部件70中的绝缘基板22的端边更多的位置。（C）2007，JPO＆INPIT

7. 发明专利

JP2007088097A Light-emitting device 审中-公开
标题翻译：发光装置
公开(公告)号：JP2007088097A
公开(公告)日：2007-04-05
申请号：JP2005272874
申请日：2005-09-20
申请人： Matsushita Electric Works Ltd , 松下電工株式会社
发明人： KAMATA SAKUO , NISHIOKA YASUSHI , URANO YOJI
IPC分类号： H01L33/32 , H01L33/50 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62
CPC分类号： H01L2224/73265 , H01L2924/19107
摘要： PROBLEM TO BE SOLVED: To provide a light-emitting device that combines an LED chip with a phosphor for irradiating light having a color differing from the luminescent color of an LED chip, and further gives directivity to the irradiated light.
SOLUTION: A reflection section 75 is formed in a cylindrical body shape spreading out toward the side of a lens 60. The inner surface is composed of a reflector 75c made of metal, ceramic, or the like. Light irradiated from the side of the LED chip 10 is propagated at a sealing section 50 for reaching the reflector 75c, and is reflected in the direction of the lens 60, and passes through the lens 60 and a color conversion member 70 before being output to the outside.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决的问题：提供一种发光装置，其将LED芯片与用于照射具有与LED芯片的发光颜色不同的颜色的光的荧光体组合，并且还给予照射光的方向性。解决方案：反射部分75形成为朝向透镜60一侧展开的圆柱体形状。内表面由金属，陶瓷等制成的反射器75c组成。从LED芯片10的侧面照射的光在用于到达反射器75c的密封部分50处传播，并且在透镜60的方向上被反射，并且在被输出到之前通过透镜60和颜色转换部件70 外。版权所有（C）2007，JPO＆INPIT

8. 发明专利

JP2007088095A Light-emitting device 审中-公开
标题翻译：发光装置
公开(公告)号：JP2007088095A
公开(公告)日：2007-04-05
申请号：JP2005272872
申请日：2005-09-20
申请人： Matsushita Electric Works Ltd , 松下電工株式会社
发明人： KAMATA SAKUO , NISHIOKA YASUSHI , URANO YOJI
IPC分类号： H01L33/50 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62 , H01L33/64
CPC分类号： H01L2224/73265 , H01L2924/19107
摘要： PROBLEM TO BE SOLVED: To provide a light-emitting device that has high heat radiation properties and reliability, and strong directivity of mixed color light.
SOLUTION: The light-emitting device includes a reflector 40 for surrounding an LED chip 10 and bonding wires 14, 14 at the packaging surface side of the LED chip 10 in a packaging substrate 20. A submount member 30 for relaxing stress operating on the LED chip 10 caused by the difference in the coefficient of thermal expansion between the LED chip 10 and a metal plate 21 and thermally combining both of them is interposed between the LED chip 10 and the metal plate 21. An electrode at the side of the submount member 30 in both the electrodes of the LED chip 10 is connected to one bonding wire 14 via a conductive pattern provided at the submount member, and an electrode at a side opposite to the side of the submount member 30 is directly connected to the other bonding wire 14. A sealing section 50 is formed by a silicone resin, contains a yellow phosphor that is excited by light radiated from the LED chip 10 and radiates yellow-based light, and is formed in the shape of a convex lens.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供具有高散热性和可靠性以及混合色光的强指向性的发光装置。解决方案：发光装置包括用于围绕LED芯片10并在包装基板20中的LED芯片10的封装表面侧接合导线14,14的反射器40.用于放松应力操作的基座部件30 在LED芯片10和金属板21之间由LED芯片10和金属板21之间的热膨胀系数的差异并将它们热组合而引起的LED芯片10插入在LED芯片10和金属板21之间。 LED芯片10的两个电极中的基座部件30经由设置在基座部件上的导电图案与一根接合线14连接，并且与副安装座部件30侧相反一侧的电极直接连接到密封部分50由硅树脂形成，包含由LED芯片10辐射的光激发的黄色荧光体，并且发射黄色光，并形成为凸透镜的形状。版权所有（C）2007，JPO＆INPIT

9. 发明专利

JP2007088090A Light-emitting device 审中-公开
标题翻译：发光装置
公开(公告)号：JP2007088090A
公开(公告)日：2007-04-05
申请号：JP2005272867
申请日：2005-09-20
申请人： Matsushita Electric Works Ltd , 松下電工株式会社
发明人： KAMATA SAKUO , NISHIOKA YASUSHI , URANO YOJI
IPC分类号： H01L33/58
CPC分类号： H01L2224/48464 , H01L2224/73265 , H01L2924/181 , H01L2924/19107 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a light-emitting device that has a small number of members and has a high light extraction efficiency to the outside.
SOLUTION: The light-emitting device includes an LED chip 10; a packaging substrate 20 where the LED chip 10 is packaged; and a sealing section 50 that is formed by a transparent resin material at the packaging surface side of the LED chip 10 in the packaging substrate, seals the LED chip and a pair of bonding wires 14, 14 electrically connected to the LED chip 10, and is elastic. The sealing section 50 has a convex lens formed in the shape of a projecting curved surface.
COPYRIGHT: (C)2007,JPO&INPIT

10. 发明专利

JP2007088086A Light-emitting device 审中-公开
标题翻译：发光装置
公开(公告)号：JP2007088086A
公开(公告)日：2007-04-05
申请号：JP2005272862
申请日：2005-09-20
申请人： Matsushita Electric Works Ltd , 松下電工株式会社
发明人： KAMATA SAKUO , NISHIOKA YASUSHI , URANO YOJI
IPC分类号： H01L33/50 , H01L33/56 , H01L33/58 , H01L33/62
CPC分类号： H01L2224/73265 , H01L2924/19107
摘要： PROBLEM TO BE SOLVED: To provide a light-emitting device having a small restriction by wiring and a high flexibility in layout. SOLUTION: The light-emitting device includes an LED chip 10; a packaging substrate 20 where the LED chip 10 is packaged; a frame 40 made of a transparent resin material for surrounding the LED chip 10 at the packaging surface side of the LED chip 10 in the packaging substrate 20; and a sealing section 50 that is formed by filling a transparent resin material to the inside of the frame, and seals the LED chip 10 and a bonding wire 14 connected to the LED chip. A lead pattern 23 that is electrically connected to the electrode of the LED chip 10 via the bonding wire 14 and is extended to the edge is formed on the surface of an insulating member 22 for composing the packaging substrate 20, and a junction section 23c for soldering and joining a lead wire 110 is provided at the extended edge of the lead pattern 23. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种布线限制小且布局灵活性高的发光装置。解决方案：发光装置包括LED芯片10; 包装基板20，其中封装有LED芯片10; 由透明树脂材料制成的框架40，用于在封装基板20中的LED芯片10的封装表面侧包围LED芯片10; 以及通过将透明树脂材料填充到框架的内部而形成的密封部50，并且密封LED芯片10和连接到LED芯片的接合线14。在用于构成封装基板20的绝缘构件22的表面上形成有通过接合线14电连接到LED芯片10的电极并且延伸到边缘的引线图案23和用于构成封装基板20的接合部23c 在引线图案23的延伸边缘处设置焊接和接合引线110. 版权所有（C）2007，JPO＆INPIT

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