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61. 发明专利

JPH01315187A BASE MATERIAL FOR CIRCUIT BOARD AND CIRCUIT BOARD 失效
公开(公告)号：JPH01315187A
公开(公告)日：1989-12-20
申请号：JP14772788
申请日：1988-06-14
申请人： MITSUBISHI ELECTRIC CORP
发明人： MIFUKU HIDEFUMI , TAKADA MITSUYUKI , MORIHIRO YOSHIYUKI , TAKASAGO HAYATO
IPC分类号： H05K1/02 , H05K1/03 , H05K1/16 , H05K3/38 , H05K3/46
摘要： PURPOSE:To obtain a base material for a circuit board having high terminal conductivity, low dielectric constant, able to form a thick film resistor being fitted for multilayer formation and high-density mounting by forming an oxide layer on the surface of an aluminum nitride base material. CONSTITUTION:An aluminum nitride board 11 is oxidized by heating in the atmosphere for forming an oxide aluminum layer 12 on the surface of the aluminum nitride board 11 to obtain the substrate 10. That is, the aluminum oxide layer 12 is formed on the surface even in case of the aluminum nitride board 11. Thereby, a ruthenium oxide thick film resistor can be formed easily and with good adhesion, for instance, a wetting property with oxide glass in the ruthenium oxide thick film resistor is improved becoming able to form the thick film resistor while being able to cope with multilayer formation and high density mounting due to high-radiation property possessed by aluminum nitride.

62. 发明专利

JPS6443916A CHARACTERISTIC CONTROL FOR COMPOUND SYSTEM SUPERCONDUCTOR 失效
公开(公告)号：JPS6443916A
公开(公告)日：1989-02-16
申请号：JP19856387
申请日：1987-08-08
申请人： MITSUBISHI ELECTRIC CORP
发明人： MIFUKU HIDEFUMI , TAKADA MITSUYUKI , TAKASAGO HAYATO
IPC分类号： C04B41/80 , C01G1/00 , H01B12/06 , H01B13/00 , H01L39/24
摘要： PURPOSE:To make it possible to control the characteristic of a compound system superconductor, for instance, after the compound system superconductor is baked or a film-state compound system superconductor is formed on a bed substrate by changing chemical structure of the compound system superconductor with a high energy beam irradiated to the compound system superconductor. CONSTITUTION:The characteristic of a compound system superconductor is controlled with a high energy beam irradiated to a compound system superconductor 1 to make chemical structure of the compound system superconductor to be changed, for instance, after the superconductor 1 is baked or the film-state superconductor 1 is formed on a bed substrate 3. Consequently, the strict controlling of a baking consition is not needed. And cracking etc., does not occurs in the bed substrate, furthermore, the diffusion of elements does not occurs in the interface between the film-state superconductor 1 and the substrate 3 because heat treatment after formation is not required when the film-state compound system superconductor is formed on the bed substrate. In addition, interconversion to a normal conductor and a superconductor is made to possible.

63. 发明专利

JPS641078B2 失效
公开(公告)号：JPS641078B2
公开(公告)日：1989-01-10
申请号：JP8606982
申请日：1982-05-19
申请人： MITSUBISHI ELECTRIC CORP
发明人： TAKASAGO HAYATO , TAKADA MITSUYUKI
IPC分类号： H05K3/34

64. 发明专利

JPS63237426A MOUNTING OF SEMICONDUCTOR 失效
公开(公告)号：JPS63237426A
公开(公告)日：1988-10-03
申请号：JP7224587
申请日：1987-03-25
申请人： MITSUBISHI ELECTRIC CORP
发明人： OTSUKI HIDEAKI , TAKADA MITSUYUKI , KOKOGAWA TOORU , TAKASAGO HAYATO
IPC分类号： H01L21/60
摘要： PURPOSE:To enhance the reliability and productivity and to mount a semiconduc tor device on a circuit board by a method wherein, while a contact part between a conductor pattern and an electrode is being pressurized, an insulating resin is hardened and the electrode of the semiconductor device is connected electri cally to the conductor pattern of the circuit board so that this method can be applied to the circuit board which is not thermally resistant at a soldering temperature. CONSTITUTION:Solder bump electrodes 2 of a flip-chip IC 1 and electrodes 4 of a circuit board are arranged after they have been aligned with each other. Then, an insulating resin 5 is supplied to the flip-chip IC 1 from an insulating- resin supply pipe 6 in such a way that the resin comes into contact with a circuit board 3 and can cover one part or the whole of the flip-chip IC 1. This insulating resin 5 is a thermosetting liquid epoxy resin. Then, if this insulating resin 5 is hardened, the flip-chip IC 1 is fixed to the electrodes 4 of the circuit board; the insulating resin 5 shrinks when it is hardened. During this process, a contractile force which is exerted in the direction as shown by an arrow A is generated, and the bump electrodes 2 of the flip-chip IC 1 is pressure- bonded to the electrodes 4 of the circuit board.

65. 发明专利

JPS63186495A MANUFACTURE OF CIRCUIT BOARD 失效
公开(公告)号：JPS63186495A
公开(公告)日：1988-08-02
申请号：JP1907287
申请日：1987-01-29
申请人： MITSUBISHI ELECTRIC CORP
发明人： TAKADA MITSUYUKI , TAKASAGO HAYATO , ONISHI YOICHIRO
IPC分类号： H01B1/16 , H01L21/48 , H05K1/03 , H05K1/09 , H05K3/18 , H05K3/24 , H05K3/46

66. 发明专利

JPS63186492A MANUFACTURE OF CIRCUIT BOARD 失效
公开(公告)号：JPS63186492A
公开(公告)日：1988-08-02
申请号：JP1907487
申请日：1987-01-29
申请人： MITSUBISHI ELECTRIC CORP
发明人： TAKADA MITSUYUKI , MIFUKU HIDEFUMI , TAKASAGO HAYATO
IPC分类号： H05K1/09 , C23C18/52 , H05K1/16 , H05K3/18

67. 发明专利

JPS62179196A SEMICONDUCTOR MOUNTING APPARATUS 失效
公开(公告)号：JPS62179196A
公开(公告)日：1987-08-06
申请号：JP1964886
申请日：1986-01-31
申请人： MITSUBISHI ELECTRIC CORP
发明人： KOKOGAWA TOORU , TAKADA MITSUYUKI , TAKASAGO HAYATO
IPC分类号： H05K1/18 , H01L21/60

68. 发明专利

JPS6235552A MANUFACTURE OF SEMICONDUCTOR PLACING DEVICE 失效
公开(公告)号：JPS6235552A
公开(公告)日：1987-02-16
申请号：JP17446285
申请日：1985-08-08
申请人： MITSUBISHI ELECTRIC CORP
发明人： TAKADA MITSUYUKI , TAKASAGO HAYATO , YOSHIOKA TAKESHI , ONISHI YOICHIRO
IPC分类号： H01L23/12 , H01L27/01 , H05K1/16
摘要： PURPOSE:To delete and to reduce a mounting area by forming a thick film resistor on a ceramic substrate for placing a semiconductor element of simultaneous baking type. CONSTITUTION:A conductor wiring pattern is printed in the prescribed pattern on an unbaked ceramic. Thereafter, a conductor wiring pattern 2 which mainly contains tungsten is formed in the ceramic 1 baked at approx. 1,500 deg.C in reduced atmosphere. Then, the baked pattern 2 is treated with oxidation prevention by electroless plating on the baked wiring 2 by nickel-plating and then gold-plating. Subsequently, a silver-palladium paste is printed in the prescribed pattern. It is further printed in the prescribed pattern so that a thick film conductor 3 thus formed and the end are superposed to form a thick film resistor 4. The resistor 4 and the conductor 3 are preferably conducted. A semiconductor element is placed, for example, on the opposite side of a ceramic leadless chip carrier formed in this manner to provide a semiconductor placing device having the thick film resistor.

69. 发明专利

JPS6233490A CIRCUIT BOARD DEVICE 失效
公开(公告)号：JPS6233490A
公开(公告)日：1987-02-13
申请号：JP17460785
申请日：1985-08-06
申请人： MITSUBISHI ELECTRIC CORP
发明人： OTSUKI HIDEAKI , TAKADA MITSUYUKI , TAKASAGO HAYATO
IPC分类号： H05K1/14

70. 发明专利

JPS6142993A Method of forming conductor layer to resin 失效
标题翻译：形成导体层到树脂的方法
公开(公告)号：JPS6142993A
公开(公告)日：1986-03-01
申请号：JP16541084
申请日：1984-08-07
申请人： Mitsubishi Electric Corp
发明人： TAKADA MITSUYUKI , TAKASAGO HAYATO , MORIHIRO YOSHIYUKI
IPC分类号： H05K3/12 , H05K3/18 , H05K3/38
CPC分类号： C23C18/2006 , C23C18/22 , H05K3/185 , H05K3/387 , H05K2201/0209 , H05K2201/0215 , H05K2203/0773 , H05K2203/107

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