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    • 6. 发明专利
    • CONNECTING METHOD OF TERMINAL TRAIN
    • JPH0428289A
    • 1992-01-30
    • JP13303890
    • 1990-05-23
    • MITSUBISHI ELECTRIC CORP
    • ENKAWA TOORUOTSUKI HIDEAKINIKI KENICHIADACHI KOHEITAKASAGO HAYATO
    • G09F9/00H01R43/00H05K3/32H05K3/36
    • PURPOSE:To enable a bonding operation to be carried out collectively with ease and accuracy by a method wherein a terminal train provided to a flexible board is thermally expanded by heating and bonded by thermocompression to a terminal train formed on a circuit board coinciding with them. CONSTITUTION:Electrode terminals 1a are formed on a circuit board which serves as a liquid crystal panel 1, and electrode terminals 21a are provided onto a flexible board 21, where the terminals 21a are provided short in space between them. At this point, an anisotropic conductive film 3 is provided to either of the terminals 1a and 21a through thermocompression bonding, and the liquid crystal panel 1 and the flexible board 21 are arranged and aligned with each other so as to enable the terminals 1a and 21a to come into light contact with each other on the panel 1. Hot air fed from a hot air generator 7 provided with a temperature regulator is made to blow against the terminals 21a to thermally expand them by heating. Then, the terminals 21a are elongated in space between them with the rise of temperature, and the terminal trains of the panel 1 and the board 21 are made to coincide with each other. At this point, a bonding tool 6 is quickly moved above the joint of the board 21, and the terminals 1a and 21a are joined together through thermocompression bonding. By this setup, a bonding process can be collectively executed with ease and accuracy.