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61. 发明专利

JPS6476745A LEAD FRAME 失效
公开(公告)号：JPS6476745A
公开(公告)日：1989-03-22
申请号：JP23465387
申请日：1987-09-17
申请人： HITACHI LTD , HITACHI MICROCUMPUTER ENG
发明人： HAGIWARA YASUHISA , MURAKAMI HAJIME , SUZUKI HIROMICHI , KOIKE SHUNJI
IPC分类号： H01L23/50
摘要： PURPOSE:To prevent the deformation of a lead frame due to thermal contraction of a tape, by a method wherein, in a lead frame of a system fixing an inner lead and a tab hanging lead, the central part of the tab hanging lead is made wide, and the end-portion of an insulating tape for lead fixing is fixed to the wide part. CONSTITUTION:A tab hanging lead 3 is provided with a wide width part 3A at the central part, in which a hole 3B is arranged to form a forked structure. The end-portions 5A of insulating tapes 5 for lead fixing are fixed on the respective parts of the forked structure. In the heating process such as a pellet fixing process, and a bonding process, the insulating tape 5 for lead fixing generates thermal contraction. However, since the end-portion of the insulating tape 5 for lead fixing is fixed to the tab hanging lead 3, it is pulled from both sides and hard to be deformed. Therefore, the deformation of the inner lead 4 can be prevented.

62. 发明专利

JPS6222456B2 失效
公开(公告)号：JPS6222456B2
公开(公告)日：1987-05-18
申请号：JP13765979
申请日：1979-10-26
申请人： HITACHI LTD
发明人： SUZUKI HIROMICHI , OKIKAWA SUSUMU
IPC分类号： H01L23/08 , H01L23/495 , H01L23/50

63. 发明专利

JPS6220858A BONDING WIRE, ITS PRODUCTION AND SEMICONDUCTOR DEVICE USING SAID WIRE 失效
公开(公告)号：JPS6220858A
公开(公告)日：1987-01-29
申请号：JP15814185
申请日：1985-07-19
申请人： HITACHI LTD
发明人： OKIKAWA SUSUMU , SUZUKI HIROMICHI , MIKINO HIROSHI
IPC分类号： C22F1/08 , C22F1/00 , H01L21/60 , H01L23/48
摘要： PURPOSE:To connect highly strong bonding wires to a semiconductor pellet and a develop a semiconductor device having excellent reliability by using high-purity copper as stock and subjecting the stock to plural passes of drawing including intermediate annealing thereby producing the bonding wires to be used for the semiconductor device. CONSTITUTION:The copper strand which has high purity of >=99.999% and is adjusted by unidirectional solidification in the longitudinal direction is drawn by passing the same through plural dies. The wire is subjected to an annealing treatment consisting of heating for 30min at 250-300 deg.C in the mid-way of the drawing and is drawn to a prescribed diameter. The copper bonding wires 7 produced by the above-mentioned method contribute to the improvement of the wire strength at bonding necks 7a in the part right above the molten balls in the stage of bonding after ball bonding. A silicone gel 8 is coated atop the semiconductor pellet 4 to improve the moisture resistance of the bonding pads 5. The semiconductor device having excellent reliability is thus produced.

64. 发明专利

JPS61111553A Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：JPS61111553A
公开(公告)日：1986-05-29
申请号：JP21249985
申请日：1985-09-27
申请人： Hitachi Ltd
发明人： OKIKAWA SUSUMU , SATO HAJIME , SUZUKI HIROMICHI , MIKINO HIROSHI
IPC分类号： H01L21/52 , H01L21/58 , H01L21/60 , H01L23/50
CPC分类号： H01L24/29 , H01L2224/32245 , H01L2224/45 , H01L2224/45144 , H01L2224/48 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/4851 , H01L2224/48599 , H01L2224/48644 , H01L2224/73265 , H01L2224/83385 , H01L2224/83805 , H01L2224/85 , H01L2224/85399 , H01L2224/85444 , H01L2224/92 , H01L2224/92247 , H01L2924/00014 , H01L2924/01014 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2224/78 , H01L2924/00 , H01L2924/3512 , H01L2924/00012
摘要： PURPOSE:To contrive the reduction in cost of the title device by reducing the used amount of Au by a method wherein the Au-plating thickness of the inner lead part is made smaller than that of the tab. CONSTITUTION:The thickness of Au plating 1 on the tab 2 of a lead frame is 1.5mum or more, while the thickness of Au plating 1 at the inner lead part 3 is smaller 0.3-1.0mum. Such a manner produces no possibility of pellet cracks caused by the leakage failure of an Au-Si eutectic crystal 5 and makes no problem in stripping of Au wires 6 of the inner lead part 3 from contact bonding parts 7. Besides, when the Au plating thickness is 1.5mum or more only at a pellet adhesion part 1a, and the plating 1 thickness of the tab part 1b and the inner lead part 3 is 0.3-1.0mum, then similarly no problem generates. Such a manner enables the large reduction in cost of the title device by reducing the used amount of Au plating.
摘要翻译：目的：通过使内部引线部的镀覆厚度小于凸片的镀层厚度的方法，通过减少Au的使用量来减少标题装置的成本降低。构成：引线框架的突片2上的镀金层1的厚度为1.5μm以上，内引线部3的镀Au层1的厚度为0.3〜1.0μm。这种方式不会导致由Au-Si共晶晶体5的泄漏故障引起的颗粒裂纹的可能性，并且不会从接触接合部7剥离内引线部3的Au线6。此外，当Au镀层厚度为1.5μm以上，而且片状部1b和内部引线部3的镀层1的厚度为0.3〜1.0μm，因此也不会产生问题。通过减少Au镀层的使用量，能够大幅降低标题装置的成本。

65. 发明专利

JPS60258942A IC DEVICE 失效
公开(公告)号：JPS60258942A
公开(公告)日：1985-12-20
申请号：JP9957285
申请日：1985-05-13
申请人： HITACHI LTD
发明人： OKIKAWA SUSUMU , SUZUKI HIROMICHI , MIKINO HIROSHI
IPC分类号： H01L23/28 , H01L21/48 , H01L21/60 , H01L23/495
摘要： PURPOSE:To improve the heat dissipation, and to eliminte the short circuit failure and the like of wires by a method wherein the innr ends of leads are made integral to the under-surface of a tab with an insulating reinforcing substance prior to wire bonding. CONSTITUTION:The tips of leads 6 are integrally joined to a tab 4 with a mounting pellet 5 by means of a reinforcing substance made of resin of good insulation and good thermal conductivity. during assembly, after the pellet 5 is fixed on the tab 4 of a lead frame 1, this lead frame 1 is carried onto a heat sink 13 with a built-in heater. A tape 14 moves over the heat sink 13 intermittently. The above-mentioned lead frame 1 is carried onto the tape 14 which is stationary, and each tab 4 is superposed on each resin 15 adhered to a tape 14; further, tab leads are pressed downward with a pressing part 17. Thus, the integral formation of tabs 4 with leads 6 is contrived by adhering the tabs and the inner ends of leads to the resin 15 which have been softly fused by the heat sink 13.

66. 发明专利

JPS6070751A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS6070751A
公开(公告)日：1985-04-22
申请号：JP17794583
申请日：1983-09-28
申请人： HITACHI LTD
发明人： OKIKAWA SUSUMU , MIKINO HIROSHI , KITAMURA WAHEI , SUZUKI HIROMICHI
IPC分类号： H01L21/60 , H01L21/48
摘要： PURPOSE:To bring the hardness of a bonding wire to a desired value, and to inhibit the height of a wire loop within a standard by thermally treating the bonding wire at a specific temperature. CONSTITUTION:A wire 4 electrically connecting a pellet 3 and a conductive section 9 for the leading-out to the outside is thermally treated within a temperature range of a temperature or lower, which is higher than the recrystallizing start temperature of the wire 4 and where an elongation percentage is maximized. When an aluminum wire containing 1wt% silicon is used as the wire 4, the wire is thermally treated at 400-470 deg.C. When an aluminum wire containing 1.5wt% magnesium is used as the wire, the wire is thermally treated at approximately 300 deg.C. Accordingly, the wire, the height of a wire loop thereof is excellent, can be obtained.

67. 发明专利

JPS59214247A Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：JPS59214247A
公开(公告)日：1984-12-04
申请号：JP8768583
申请日：1983-05-20
申请人： Hitachi Cable Ltd , Hitachi Ltd
发明人： OKIKAWA SUSUMU , SUZUKI HIROMICHI , SATOU HAJIME , YAMAGISHI RIYOUZOU
IPC分类号： H01L21/52 , H01L23/492 , H01L23/495 , H01L23/50 , H01L23/48 , H01L21/58
CPC分类号： H01L23/49582 , H01L23/4924 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/83 , H01L2224/32245 , H01L2224/48 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83101 , H01L2224/83193 , H01L2224/83455 , H01L2224/83801 , H01L2224/92247 , H01L2924/01029 , H01L2924/0105 , H01L2924/01082 , H01L2924/014 , H01L2924/15747 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： PURPOSE:To enhance reliability of pellet bonding through the reduction of cost thereof by forming a tin plated layer through a lower plated layer to the upper part of pellet fitting part of substrate. CONSTITUTION:A nickel-plated layer 17 which prevents diffusion of copper material of frame 11 to the direction of pellet is provided at a lower plated layer on a tab 16 which is a pellet fitting area of lead frame 11. A tin layer 18 which is well wetable with solder is formed on the plated layer 17. When a semiconductor pellet 12 is placed on a fusible tin layer 18 through a soluble solder foil 19 and is then caused to make scribe motion, the pellet 12 is securely welded on the tab 16.
摘要翻译：目的：通过将下镀层形成镀锡层到基板的芯片安装部的上部，通过降低成本来提高芯片接合的可靠性。构成：防止框架11的铜材料向颗粒方向扩散的镀镍层17设置在作为引线框11的芯片嵌合区域的突片16的下镀层上。锡层18是在电镀层17上形成可焊接的良好的润湿剂。当将半导体颗粒12通过可溶性焊锡箔19放置在易熔锡层18上，然后使其进行划线时，将颗粒12牢固地焊接在突片16上。

68. 发明专利

JPS59182547A Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：JPS59182547A
公开(公告)日：1984-10-17
申请号：JP5508483
申请日：1983-04-01
申请人： Hitachi Ltd
发明人： SUZUKI HIROMICHI , OKIKAWA SUSUMU , MIKINO HIROSHI , KITAMURA WAHEI
IPC分类号： H01L23/50 , H01L21/60 , H01L23/13
CPC分类号： H01L23/13 , H01L2224/05554 , H01L2224/32225 , H01L2224/32245 , H01L2224/45 , H01L2224/45124 , H01L2224/45147 , H01L2224/48 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48724 , H01L2224/48747 , H01L2224/48824 , H01L2224/48847 , H01L2224/49 , H01L2224/49171 , H01L2224/73265 , H01L2224/85 , H01L2224/85205 , H01L2224/85424 , H01L2224/85447 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01078 , H01L2924/01082 , H01L2924/15153 , H01L2924/15165 , H01L2924/181 , H01L2224/78 , H01L2924/00 , H01L2924/00012
摘要： PURPOSE:To prevent a semiconductor device from invasion of moisture when the device is resin sealed by a method wherein a semiconductor element accommodating recess part is provided on the surface of an element mounting substrate, an element is fixed therein, and when the element thereof is to be connected to wiring parts adhered on the surface of the substrate using wires, the wiring parts and the wires are made of the same material, and moreover bonding parts are left without performing plating. CONSTITUTION:A recess part is provided on the surface of an element mounting substrate 3, a semiconductor element 1 is fixed therein using epoxy adhesives 11, the element 1 thereof is connected to wiring parts 14 adhered on the surface of the substrate 3 using wires 13, and the element 1 is sealed including the wires 13 using resin 12. At this construction, the ball bonding parts of the element 1 are left without performing plating, and when the wires 13 are Cu, the wiring parts 14 are also made of Cu, and moreover, when the wires 13 are Al, the wiring parts 14 are also made of Al. Accordingly, invasion of moisture from the sealing part is checked, adhesion of bonding is improved, and supersonic bonding at a low temperature is enabled.
摘要翻译：目的：为了防止半导体装置在通过在元件安装基板的表面上设置有半导体元件容纳凹部的方法树脂密封时侵入湿气，元件固定在其中，并且当其元件为使用电线将粘接在基板表面上的布线部分连接，布线部分和电线由相同的材料制成，而且不进行电镀就留下粘合部分。构成：在元件安装基板3的表面上设置有凹部，利用环氧树脂粘合剂11将半导体元件1固定在其中，其元件1使用导线13连接在基板3的表面上附着的布线部14 并且元件1被密封，包括使用树脂12的电线13.在这种结构中，元件1的球形接合部分没有进行电镀，而当导线13是Cu时，布线部分14也由Cu 而且，当导线13为Al时，配线部14也由Al构成。因此，检查了密封部件的水分侵入性，提高了接合粘合性，能够实现低温下的超音速接合。

69. 发明专利

JPS5974640A Bonder for wire 失效
标题翻译： BONDER FOR WIRE
公开(公告)号：JPS5974640A
公开(公告)日：1984-04-27
申请号：JP18457882
申请日：1982-10-22
申请人： Hitachi Ltd
发明人： SUZUKI HIROMICHI , MIKINO HIROSHI , OKIKAWA SUSUMU , KITAMURA WAHEI
IPC分类号： H01L21/60
CPC分类号： H01L2224/45 , H01L2224/45124 , H01L2224/78 , H01L2224/78268 , H01L2224/78301 , H01L2224/85 , H01L2224/85045 , H01L2224/85075 , H01L2924/00014 , H01L2924/01013 , H01L2924/3025 , H01L2224/48 , H01L2924/00012 , H01L2924/00
摘要： PURPOSE:To prevent the mixing of air into a necessary gas by the curtain action of an inert-gas flow, to form a ball of the high degree of vacuum and to improve bondability by forming a section on the capillary intruding side of a shield cylinder in double structure and flowing an inert gas to the inside. CONSTITUTION:A bonding head 11 is loaded on an XY table 10, one end of a bonding arm 12 is supported to the head 11 in a vertically vibratory shape, and a capillary 13 is fixed at the nose of the arm 12. An approximately L-shaped electrode 19 is arranged where adjacent to the capillary 13, and the discharge section 20 of a lower side is vibrated as a nose. The electrode 19 is formed to a hollow-pipe shape, a tube 21 communicated with a gas source is connected at an end section on the axial support 18 side, the electrode 19 is supplied with the necessary gas. A nozzle 23 is formed at the nose of the discharge section 20, a shield inner cylinder 24 is set up tightly so as to cover the discharge section 20 of the electrode 19, and the cylinder 24 is covered with a shield outer cylinder 25. The inert gas is flowed through the inner cylinder 24, and the mixing of air into the necessary gas is prevented.
摘要翻译：目的：为了防止气体通过惰性气体流动的窗帘作用将空气混入必要的气体中，以形成高真空度的球，并通过在屏蔽筒的毛细管入侵侧形成截面来提高粘合性在双重结构中并将惰性气体流向内部。结构：粘合头11装载在XY工作台10上，接合臂12的一端以垂直振动的形式被支撑在头部11上，毛细管13固定在臂12的鼻部。大约L 形状的电极19布置在与毛细管13相邻的位置，下侧的排出部20作为鼻子振动。电极19形成为中空管状，与气体源连通的管21在轴向支撑体18侧的端部连接，电极19被供给所需的气体。喷嘴23形成在排出部20的鼻部处，屏蔽内筒24紧密地安装以覆盖电极19的排出部20，并且气缸24被屏蔽外筒25覆盖。惰性气体流过内筒24，并且防止空气混入所需气体中。

70. 发明专利

JPS5966136A Wire bonder 失效
标题翻译： WIRE BONDER
公开(公告)号：JPS5966136A
公开(公告)日：1984-04-14
申请号：JP17616782
申请日：1982-10-08
申请人： Hitachi Ltd
发明人： MIKINO HIROSHI , SUZUKI HIROMICHI , OKIKAWA SUSUMU , KITAMURA WAHEI
IPC分类号： H01L21/603 , H01L21/60
CPC分类号： H01L2224/45 , H01L2224/45124 , H01L2224/78 , H01L2224/78268 , H01L2224/78301 , H01L2224/85 , H01L2224/85045 , H01L2224/85065 , H01L2224/85075 , H01L2924/00014 , H01L2924/01013 , H01L2924/3025 , H01L2924/01001 , H01L2224/48 , H01L2924/00012 , H01L2924/00
摘要： PURPOSE:To improve the bondability of a wire bonder by forming a cover for blocking a hole for inserting a capillary formed in a shield cylinder integrally with the capillary, thereby maintaining the gas atmosphere at the end of an aluminum wire in the cylinder in a stable state, thereby forming a ball having a highly accurate spherical shape. CONSTITUTION:A shield cylinder 21 is formed with a hole 23 of substantially square shape by cutting off the 1/4 circumferential part from the top opposed to a capillary 13 to one side. A cover 24 of substantially the same shape as the hole 23 of the cylinder 21 is integrally formed at part of the capillary 13. The capillary 13 is inserted from side of the hole 23, and when an electrode 19 is rocked at the position directly under it, the capillary and the wire 14 are opposed to a discharger 20 of the electrode 19, while the cover 24 is disposed in the hole 23 to block the hole 23 or to becomes the state near the blocking state. In this manner, since the cylinder 21 is maintained in stable H2 gas state, the degree of the accurate spherical shape of the formed ball can be extremely improved, thereby improving the bondability.
摘要翻译：目的：通过形成用于阻挡形成在与毛细管一体形成的屏蔽筒中的毛细管的孔，形成用于插入毛细管内的毛细管的毛细管的盖，以提高引线接合器的粘合性，从而将气缸中的铝线末端的气体气氛保持在稳定的状态从而形成具有高精度球形的球。构成：通过从与毛细管13相对的顶部的一侧切断1/4周向部分，形成有大致正方形的孔23的屏蔽筒21。在毛细管13的一部分上整体地形成有与圆筒21的孔23大致相同形状的盖24.毛细管13从孔23的侧面插入，当电极19在直接位置毛细管和导线14与电极19的放电器20相对，而盖24设置在孔23中以阻挡孔23或成为接近阻塞状态的状态。以这种方式，由于气缸21保持在稳定的H2气体状态，所以可以极大地提高所形成的球的精确球形度，从而提高了粘合性。

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