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    • 61. 发明专利
    • PHOTORESIST COMPOSITION
    • JPH0299954A
    • 1990-04-11
    • JP25250288
    • 1988-10-06
    • FUJITSU LTD
    • SHIBA SHOJISAITO KAZUMASAWATABE KEIJI
    • G03F7/039C08L83/04G03F7/075H01L21/027
    • PURPOSE:To obtain the positive type resist having excellent sensitivity and definition by using a resist consisting of a specific silicone compd. and a photosensitive agent which generates an acid by irradiation of UV rays as the upper layer resist of a two-layered structure. CONSTITUTION:The resist consisting of the silicone compd. which has a silyl ether bond and is expressed by the formula I and the photosensitive agent which generate the acid by irradiation of UV rays is used as the upper layer resist of the two-layered structure. The ether bond of the silicone compd. having the silyl ether bond is cut and the main chain thereof is decomposed if the acid exists therein and the silicone compd. exhibits high O2 plasma resistance even in such a case. In the formula I, R1 to R4 denote 1 to 4C alkyl group; R5 to R6 denote a hydrogen atom, 1 to 4C alkyl group, trimethyl group; n denotes 10 to 10000 positive integer. The resist patterns having the excellent oxygen plasma resistance, the high sensitivity and the high definition are formed in this way.