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61. 发明专利

JP2003063857A Porcelain composition which has low dielectric constant and method for manufacturing it 有权
标题翻译：具有低介电常数的PORCELAIN组合物及其制造方法
公开(公告)号：JP2003063857A
公开(公告)日：2003-03-05
申请号：JP2001254877
申请日：2001-08-24
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： YAMAMOTO HISAFUMI , TSUKIYAMA YOSHIO
IPC分类号： C04B35/453 , H01B3/12
摘要： PROBLEM TO BE SOLVED: To provide a porcelain composition which can be sintered at a low temperature, which has a low dielectric constant and small loss in the high frequency wave zone, and whose temperature dependency is small, and a method for manufacturing the composition. SOLUTION: The porcelain composition which has a low dielectric constant contains, in terms of oxides in mass %, SiO2 of 18.0-40.0%, ZnO of 30.0-54.0%, Bi2 O3 of 1.0-6.0%, MgO of 1.0-6.0%, TiO2 of 4.0-12.4%, Li2 O of 0.2-1.1%, K2 O of 3.0-7.4% and CuO of 0.5-3.7%. The method for manufacturing the porcelain composition comprises carrying out the wet blending with a ball mill of powder raw materials consisting of prescribed quantities of the oxides, drying and calcining at 700-900 deg.C the blended raw materials, and thereafter pulverizing and sizing the calcined materials, and then kneading and forming the sized materials on adding a binder, and printing electric conductors or the like and carrying out the lamination or the like, and finally carrying out the sintering at 800-950 deg.C.
摘要翻译：要解决的问题：提供一种能够在高频波段具有低介电常数和低损耗并且温度依赖性小的低温烧结的瓷组合物，以及该组合物的制造方法。解决方案：具有低介电常数的瓷组合物以氧化物的质量％计含有18.0-40.0％的SiO 2，30.0-54.0％的ZnO，1.0-6.0％的Bi 2 O 3，1.0-6.0％的MgO， TiO2为4.0-12.4％，Li2 O为0.2-1.1％，K2 O为3.0-7.4％，CuO为0.5-3.7％。陶瓷组合物的制造方法包括：将由规定量的氧化物构成的粉末原料的球磨机进行湿式混合，在700-900℃干燥和煅烧所述混合原料，然后粉碎和定型煅烧材料，然后在添加粘合剂的同时捏合和形成尺寸的材料，并印刷导电体等并进行层压等，最后在800-950℃下进行烧结。

62. 发明专利

JP2003055055A Method for manufacturing low temperature fired ceramic substrate 有权
标题翻译：制造低温发光陶瓷基板的方法
公开(公告)号：JP2003055055A
公开(公告)日：2003-02-26
申请号：JP2001250973
申请日：2001-08-22
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： NAKA KATSUHIKO , KAWAGUCHI MASAAKI
IPC分类号： C04B35/645 , C04B35/64
摘要： PROBLEM TO BE SOLVED: To easily form a projection or a recess with >=30 μm height or depth on the surface of a ceramic substrate fired at low temperature with high dimensional accuracy. SOLUTION: When a low temperature fired ceramic substrate 10 is fired by a press firing method, a forming part 21 in a projection or recess state is preliminarily formed by a green sheet lamination method or a press forming method on the face of a restricting green sheet 20 (such as an alumina green sheet) to be in contact with the surface of the low temperature fired ceramic green substrate. Then, the green substrate is fired while the restricting green sheet 20 is pressed in contact with the green substrate so that the pattern of the formed part 21 in the restricting green sheet 20 is transferred to the substrate surface.
摘要翻译：要解决的问题：为了容易地在陶瓷基板的表面上以高于或等于30μm的高温或高深度在低温下高精度地形成突起或凹部。解决方案：当通过压制焙烧方法烧制低温烧制陶瓷基板10时，通过生片层压方法或压制成型方法在限制生坯片的表面上预先形成突起或凹陷状态的成形部21 20（例如氧化铝生片）与低温烧制陶瓷生坯基板的表面接触。然后，在限制生片20与生坯基板接触的同时烧绿色基板，使得限制生片20中的成形部21的图案被转印到基板表面。

63. 发明专利

JP2003046027A Heat-radiating type bga package and manufacturing method therefor 审中-公开
标题翻译：散热型BGA封装及其制造方法
公开(公告)号：JP2003046027A
公开(公告)日：2003-02-14
申请号：JP2001227310
申请日：2001-07-27
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： TOMABECHI SHIGENAO
IPC分类号： H05K7/20 , H01L23/12 , H01L23/34 , H01L23/40
CPC分类号： H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a radiation-type BGA package with improved bond strength of a heat sink and a plastic circuit board, the moisture adsorption of a bonding face is suppressed and airtight reliability of a semiconductor chip is not impaired, and to provide the manufacturing method. SOLUTION: In the radiation-type BGA package 10, the metallic heat sink 13 is jointed to one face of the plastic circuit board 11 where a center part is made to be a notch space 12. The plastic circuit board 11 and the heat sink 13 are jointed by a clamping member 15 and an end part in the bonding face of the plastic circuit board 11, and the heat sink 13 is covered by bonding resin 16.
摘要翻译：要解决的问题：为了提供具有改善的散热器和塑料电路板的接合强度的辐射型BGA封装，抑制了接合面的水分吸附，并且不损害半导体芯片的气密可靠性，并且提供制造方法。解决方案：在辐射型BGA封装10中，金属散热器13连接到塑料电路板11的一个面，其中心部分被制成凹口空间12.塑料电路板11和散热片13 由塑料电路板11的接合面中的夹持构件15和端部接合，并且散热器13被接合树脂16覆盖。

64. 发明专利

JP2003040681A Method of manufacturing low temperature fired ceramic board 有权
标题翻译：制造低温烧制陶瓷板的方法
公开(公告)号：JP2003040681A
公开(公告)日：2003-02-13
申请号：JP2001229047
申请日：2001-07-30
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： ITO TAKUJI , NAKAI TOSHIHIRO
IPC分类号： C04B35/64 , B28B11/00 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To improve in relative positional accuracy of surface and back surface patterns for low temperature fired ceramic board fired with restrained firing. SOLUTION: A green ceramic board 12 having perpendicular throughholes 15 is formed, and on a back surface of a 1st restricting green sheet 13a a surface conductor pattern 17 to be transferred to surface of the green ceramic board 12 and positioning marks 14 which are exposing through the thorughholes are simultaneously printed. The 1st restricting green sheet 13a is laminated on the surface of the green ceramic board 12, while recognizing the positioning marks 14 exposing in the throughholes 15 by a camera from back surface, and referring to the position mark 14, a pad 19, etc., are printed on the back surface. Thereafter a 2nd restricting green sheet 13b is laminated on the back surface. The green ceramic board 12 is fired with restricting green sheets, after that the restricting green sheets 13a and 13b are removed from both surface fired ceramic board.
摘要翻译：要解决的问题：提高用限制烧制烧制的低温烧制陶瓷板的表面和背面图案的相对位置精度。解决方案：形成具有垂直通孔15的绿色陶瓷板12，并且在第一限制生片13a的背面上具有表面导体图案17，以转印到生陶瓷板12的表面上，并且定位标记14暴露于同时打印thor坑。第一限制生片13a被层叠在绿色陶瓷板12的表面上，同时通过相机从背面识别出在通孔15中的定位标记14，并且参考位置标记14，垫19等。，印在背面。此后，在背面层叠有第二限制生片13b。绿色陶瓷板12用限制生片进行烧制，之后将限制生片13a和13b从表面烧制陶瓷板上取下。

65. 发明专利

JP2002373955A Power module substrate 审中-公开
标题翻译：电源模块基板
公开(公告)号：JP2002373955A
公开(公告)日：2002-12-26
申请号：JP2001179114
申请日：2001-06-13
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： MINO KATSUJI , HIDAKA AKIHIRO , NAGAHIRO MASANORI
IPC分类号： C04B37/02 , H01L23/12 , H01L23/36 , H05K1/02
摘要： PROBLEM TO BE SOLVED: To provide a power module substrate in which a ceramic basic material is not cracked even if a metallic brazing material is employed for bonding the ceramic basic material and a copper plate and for bonding the ceramic basic material and a heat sink plate.
SOLUTION: In a power module substrate 10 where a heat sink plate 12 is formed on one surface and a circuit is formed on the other surface through metallization pattern layers 14 and 15 formed on the opposite sides of a ceramic basic material 11 or a copper plate 13 to be formed is bonded using metallic brazing materials 16 and 16a, the ceramic basic material 11 has non-bonded regions A18 and 18a extending from the outer circumferential end part 17 of the ceramic basic material 11 to the inside of the opposite surfaces.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：即使使用金属钎焊材料来接合陶瓷基体材料和铜板并且用于粘结陶瓷基体材料和散热片的陶瓷基体材料也不会破裂的功率模块基板。解决方案：在功率模块基板10中，其中在一个表面上形成散热板12，并且通过形成在陶瓷基材11或铜板的相对侧上的金属化图案层14和15在另一个表面上形成电路 13使用金属钎焊材料16和16a粘合，陶瓷基材11具有从陶瓷基材11的外周端部17延伸到相对面的内侧的非接合区域A18和18a。

66. 发明专利

JP2000077583A Package for electronic component and manufacture thereof 审中-公开
标题翻译：电子元器件及其制造包装
公开(公告)号：JP2000077583A
公开(公告)日：2000-03-14
申请号：JP24895698
申请日：1998-09-03
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： KOSAKATA AKIYOSHI
IPC分类号： H01L23/12 , H01L23/36 , H01L23/373
CPC分类号： H01L2224/48091 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a package for electronic component in which adhesion between a heat dissipating metal plate and a heat dissipating fin is enhanced, and thermal resistance between a semiconductor element and the heat dissipating fin is reduced. SOLUTION: Copper plating films 12, 13 are formed on the opposite sides of a copper-molybdenum plate 11 of a heat dissipating metal plate 10. A package body 20 is bonded to the upper surface of the heat dissipating metal plate 10, while surrounding the entire circumference of a semiconductor element mounting part 31. A polished face 61 is formed on the lower surface of the heat dissipating metal plate 10. Adhesion between the heat dissipating metal plate 10 and a heat dissipating fin 60 is enhanced by fixing a heat dissipating fin 60 to the polished face 61. According to this structure, heat resistance between a semiconductor element 30 and the heat dissipating fin 60 can be decreased, when the semiconductor element 30 is mounted on the semiconductor element mounting part 31. Consequently, heat is dissipated satisfactorily to the outside during operation of the semiconductor element 30 and the semiconductor element 30 can be operated normally and stably over a long term.
摘要翻译：要解决的问题：提供一种电子部件的包装，其中散热金属板和散热片之间的粘附性增强，半导体元件和散热片之间的热阻降低。解决方案：在散热金属板10的铜 - 钼板11的相对两侧形成有镀铜膜12,13。封装主体20与散热金属板10的上表面接合，半导体元件安装部分31的整个周边。抛光面61形成在散热金属板10的下表面上。散热金属板10和散热片60之间的粘附通过固定散热片根据该结构，当将半导体元件30安装在半导体元件安装部31上时，可以减小半导体元件30与散热片60之间的耐热性。结果，散热良好在半导体元件30的工作期间向外部延伸，并且半导体元件30能够长期正常且稳定地工作。

67. 发明专利

JPH11274355A Plastic package with heat sink 失效
标题翻译：塑料包装与散热
公开(公告)号：JPH11274355A
公开(公告)日：1999-10-08
申请号：JP6965798
申请日：1998-03-19
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： TAKAMICHI HIROSHI , HIDAKA AKIHIRO
IPC分类号： H01L23/12 , H01L23/06
CPC分类号： H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To assure heat-radiating performance of a heat sink, while damages to the heat sink and a plastic substrate are suppressed and the occurrence of crack on the surface of an Si chip is surely prevented. SOLUTION: A plastic package with heat sink 10 comprises a plastic substrate 31, where a cavity 31b for housing an Si chip 35 is formed and a heat sink 13 pasted on the plastic substrate 31. Here, the heat sink 13 is formed of material with a Young's modulus of 15,000 kg/mm or higher, and thermal conductivity of 100 W/mk or higher.
摘要翻译：要解决的问题：为了确保散热器的散热性能，同时对散热器和塑料基板的损坏被抑制，并且可靠地防止在Si芯片的表面上产生裂纹。解决方案：具有散热器10的塑料封装包括塑料基板31，其中形成用于容纳Si芯片35的空腔31b和粘贴在塑料基板31上的散热器13.这里，散热器13由具有 15,000kg / mm 2以上的杨氏模量和100W / mk以上的导热率。

68. 发明专利

JPH11274226A Chip mounting method 失效
标题翻译：芯片安装方法
公开(公告)号：JPH11274226A
公开(公告)日：1999-10-08
申请号：JP6965898
申请日：1998-03-19
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： KOSAKATA AKIYOSHI
IPC分类号： H01L23/12 , H01L21/60
CPC分类号： H01L2224/16225
摘要： PROBLEM TO BE SOLVED: To provide a chip mounting method, which can securely prevent generation of voids in a solder ball after reflow.
SOLUTION: In the chip mounting method which mounts a chip 14 having a plurality of connecting solder balls 16 on a plurality of plated flip-chip pads 13 in a package substrate 11, flux 17 is applied on the flip-chip pads 13. Then, a chip 14 is arranged for the package substrate 11 so that the solder balls 16 are in contact with the end part 13d of the flip-chip pad 13. Then, after the solder ball 16 is pushed to the end part 13d of the flip-chip pad and temperarily fixed, reflow processing is performed.
COPYRIGHT: (C)1999,JPO
摘要翻译：要解决的问题：提供一种芯片安装方法，其可以可靠地防止回流之后在焊球中产生空隙。解决方案：在芯片安装方法中，将具有多个连接焊球16的芯片14安装在封装基板11上的多个电镀倒装芯片焊盘13上，将焊剂17施加在倒装芯片焊盘13上。然后，为了使焊锡球16与倒装芯片焊盘13的端部13d接触，芯片14被布置成用于封装基板11，然后，在将焊球16推到触发板13的端部13d之后，芯片焊盘和温度固定，进行回流处理。

69. 发明专利

JP2012138436A Electronic component housing package 审中-公开
标题翻译：电子元件封装
公开(公告)号：JP2012138436A
公开(公告)日：2012-07-19
申请号：JP2010289078
申请日：2010-12-27
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： YAMAMOTO TOMOYASU
IPC分类号： H01L23/06 , H01L23/02 , H01L23/34
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an inexpensive electronic component housing package capable of efficiently radiating heat from electronic components.SOLUTION: An electronic component housing package includes: a rectangular-shaped bottom plate 13 made of clad steel about which each side of a Fe-Ni-Co-based alloy metal plate 11 is bonded with a Cu plate 12; a ring-shaped frame body 14 which is a rectangular window frame form made of Fe-Ni-Co-based alloy joined to the upper surface of the bottom plate 13; a frame body 18 comprising a ceramic sidewall body 16 which comprises a metalized pattern 15 for input and output joined to a pair of facing upper surfaces in the longitudinal direction of the ring-shaped frame body 14, and a metallic sidewall body 17 which is joined and concatenated to the side of the ceramic sidewall body 16, joined to a pair of facing upper surfaces in the shorter-side direction of the ring-shaped frame body 14 and made of Fe-Ni-Co-based alloy or Fe-Ni-based alloy; and a seal ring 20 joined to the upper surface of the frame body 18 and made of Fe-Ni-Co-based alloy. The frame body 18 is sandwiched between the ring-shaped frame body 14 and the seal ring 20 from upper and lower sides.
摘要翻译：要解决的问题：提供能够有效地散发来自电子部件的热量的便宜的电子部件壳体封装。解决方案：一种电子部件壳体包装，包括：由包覆钢制成的矩形底板13，Fe-Ni-Co系合金金属板11的两面与Cu板12接合; 环状框架体14，其是与底板13的上表面接合的由Fe-Ni-Co系合金构成的矩形窗框架体; 框架体18，其包括陶瓷侧壁体16，该陶瓷侧壁体16包括金属化图案15，该金属化图案15用于输入和输出，该金属化图案15与环形框体14的纵向方向上的一对相对的上表面接合;金属侧壁体17，并且连接到陶瓷侧壁体16的一侧，与环形框体14的短边方向的一对相对的上表面接合，并由Fe-Ni-Co系合金或Fe-Ni- 基合金; 以及与框体18的上表面接合并由Fe-Ni-Co系合金构成的密封环20。框体18从上侧和下侧夹在环形框体14和密封环20之间。版权所有（C）2012，JPO＆INPIT

70. 发明专利

JP2011241131A Ceramic sintered body, light-reflecting article, and package for storing light-emitting element 有权
标题翻译：陶瓷烧结体，光反射制品和储存发光元件的包装
公开(公告)号：JP2011241131A
公开(公告)日：2011-12-01
申请号：JP2010116785
申请日：2010-05-20
申请人： Sumitomo Metal Electronics Devices Inc , 株式会社住友金属エレクトロデバイス
发明人： OGAMI AYAFUMI , NAGAHIRO MASANORI
IPC分类号： C04B35/111 , H01L23/12 , H01L23/13
CPC分类号： H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/92247 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a ceramic sintered body having a high mechanical strength, superior heat dissipation, and high reflectivity and causing no reduction in reflectivity due to degradation.SOLUTION: The ceramic sintered body is obtained by shaping and thereafter firing a mixed powder material. The powder material used in production of the ceramic sintered body contains alumina as a main component, zirconia, and a magnesia powder. The upper limit of the content of the zirconia is 30 wt.% with respect to the total weight of the powder material. The content of the magnesia is in the range of 0.05-1.00 wt.% with respect to the total weight of the powder material. When the contents of Fe and Ti being impurities in the zirconia are converted into the contents of Fe and Ti in FeOand TiO, respectively, the respective contents of FeOand TiOare 0.05 wt.% or less. The 97% particle size of the zirconia, determined from a particle size distribution is 1.5 μm or less.
摘要翻译：要解决的问题：提供具有高机械强度，优异的散热性和高反射率的陶瓷烧结体，并且由于劣化而不会降低反射率。解决方案：通过对混合的粉末材料进行成形和烧结来获得陶瓷烧结体。用于制造陶瓷烧结体的粉末材料包含氧化铝作为主要成分，氧化锆和氧化镁粉末。相对于粉末材料的总重量，氧化锆的含量的上限为30重量％。相对于粉末材料的总重量，氧化镁的含量在0.05〜1.00重量％的范围内。当Fe和Ti作为氧化锆中的杂质的含量在Fe 3 O 3 中转化为Fe和Ti的含量时，和TiO 2 的各自的内容分别为Fe 2 O 3 而TiO 2 为0.05重量％以下。由粒度分布确定的氧化锆的97％粒径为1.5μm以下。版权所有（C）2012，JPO＆INPIT

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