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51. 发明专利

JPH111791A TIN AND ALLOY PLATING BATH, METHOD FOR CONTROLLING SAME AND ITS PREPARATION 失效
公开(公告)号：JPH111791A
公开(公告)日：1999-01-06
申请号：JP16532297
申请日：1997-06-06
申请人： ISHIHARA CHEMICAL CO LTD , DAIWA KASEI KENKYUSHO
发明人： TSUJI SEIKI , HARA HIROKI , UCHIDA KYOKO , TAKEUCHI TAKAO , YOSHIMOTO MASAKAZU , KITAMURA SHINGO
IPC分类号： C25D3/32 , C25D3/60 , C25D21/14 , C25D21/18
摘要： PROBLEM TO BE SOLVED: To smoothly capture stannic oxide particles even if the particles are generated in a tin or tin alloy plating bath after use over a long period of time and to stabilize the transparency of the bath with the lapse of time by incorporating an org. or inorg. acid and a phosphorus compd. as a flocculation accelerator besides a soluble stannous salt or a mixture of the stannous salt with soluble salts of eight kinds of metals such as Pb. SOLUTION: The tin or tin alloy plating bath contains a soluble stannous salt or a mixture of the stannous salt with soluble salts of metals selected from among Pb, Ag, Zn, Bi, In, Ni, Co and Cu, at least one of org. acids such as alkanesulfonic acids, alkanolsulfonic acids and aliphatic carboxylic acids or inorg. acids such as hydrochloric acid, sulfuric acid and hydroborofluoric acid and an inorg. phosphorus compd. such as orthophosphoric acid or its salt or an org. phosphorus compd. such as methylenephosphonic acid or its salt as a flocculation accelerator.

52. 发明专利

JPH10317183A NON-CYAN GOLD ELECTROPLATING BATH 失效
公开(公告)号：JPH10317183A
公开(公告)日：1998-12-02
申请号：JP14108097
申请日：1997-05-16
申请人： DAIWA KASEI KENKYUSHO
发明人： MASAKI SEIJI , TAKEUCHI TAKAO , HIRANO KAZUHIKO , KOBASHI YASUTO , OBATA KEIGO
IPC分类号： C25D3/48 , C25D3/56
摘要： PROBLEM TO BE SOLVED: To obtain a mercaptocarboxylic acid gold plating bath excellent in bath stability as a non-cyan electroplating bath by using acetyl cysteine, which is one kind of the mercaptocarboxylic acid, as a complexing agent. SOLUTION: This mercaptocarboxylic acid gold plating bath contains one or more kinds of an alkali metal salt or ammonium salt of an acetyl cysteine gold complex, a cysteine gold complex, a mercaptosuccinic acid gold complex, gold chloride and a sulfurous acid gold complex and 1-100 g/l acetyl cysteine as the complexing agent. Though clear limiting point is not present in the suitable quantity of the complexing agent, an object to obtain a bath excellent in the stability with time is not attained if the quantity is too small and on the other hand, the rate of deposition is lowered and the cost of the bath is increased if the quantity is excess. In such a case, as an auxiliary complexing agent, cysteine or mercaptosuccinic acid can be added and as the result, the rate of plating is increased. Further a metal element in addition to gold can be added to increase the hardness of the film or to change the color tone.

53. 发明专利

JPH10168592A TIN-ZINC ALLOY PLATING BATH 失效
公开(公告)号：JPH10168592A
公开(公告)日：1998-06-23
申请号：JP34237696
申请日：1996-12-09
申请人： DAIWA KASEI KENKYUSHO , ISHIHARA CHEMICAL CO LTD
发明人： TAKEUCHI TAKAO , KATO YUJI , OBATA KEIGO , MASAKI SEIJI , AOKI KAZUHIRO , NAWAFUNE HIDEMI
IPC分类号： C25D3/56
摘要： PROBLEM TO BE SOLVED: To obtain a smooth and dense tin-zinc alloy plating film by adding sulfo(hydroxy)carboxylic acid and monohydroxycarboxylic acid as complexing agents into a plating bath contg. bivalent tin ions and bivalent zinc ions and adjusting the pH of this bath. SOLUTION: One or >=2 kinds of the complexing agents selected from the aliphat. sulfo(hydroxy)carboxylic acid expressed by formula I and/or its salt, the arom. sulfo(hydroxy)carboxylic acid expressed by formula II and/or its salt and the aliphat. monohydroxycarboxylic acid expressed by formula III and/or its salt are incorporated as essential components into the plating bath contg. the bivalent tin ions and the bivalent zinc ions. The pH is adjusted to 2 to 6. In the formula I, R is 1 to 6C alkylene group or 2 to 6C alkenylene group. In the formula II, X is hydrogen, hydroxyl group or carboxyl group. In the formula III, R is hydrogen or 1 to 2C alkyl group. The complexing agents are used at about 2 to 20 times the tin ions and zinc ions in molar ratio.

54. 发明专利

JPH10102283A ELECTRIC ELECTRONIC CIRCUIT PARTS 失效
公开(公告)号：JPH10102283A
公开(公告)日：1998-04-21
申请号：JP27395496
申请日：1996-09-26
申请人： DAIWA KASEI KENKYUSHO , ISHIHARA CHEMICAL CO LTD
发明人： OBATA KEIGO , KONDO TETSUYA , AOKI KAZUHIRO , NAWAFUNE HIDEMI
IPC分类号： B23K1/20 , C25D3/60 , C25D7/00 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To join tin-silver alloy solder with excellent solderability, at the time of joining electric-electronic circuit parts with pollution-free tin-silver alloy solder, on the joint, by forming tin-silver alloy series electroplating having a specified compsn. to a specified thickness. SOLUTION: At the time of soldering electric-electronic circuit parts with a safe tin-silver alloy series brazing filler metal without using a tin-lead series brazing filler metal contg. harmful lead, as coating for improving the solderability of the part to be soldered, mirror finished glossy tin-silver alloy coating contg. 0.1 to 10% silver is formed to a thickness of 1 to 100μm by electroplating. This tin-silver alloy plating coating is excellent in glossiness, is smooth and is excellent in solderability by the thin-silver alloy brazing filler metal and, since it contains no cyanogen, soldering free from problems of environment, hygiene and pollution similar to the case of solder by a tin-silver alloy brazing filler metal is made possible.

55. 发明专利

JPH08246200A ELECTROLYTIC PRODUCTION OF TIN SULFATE AND BISMUTH SULFATE FOR TIN-BISMUTH ALLOY PLATING 失效
公开(公告)号：JPH08246200A
公开(公告)日：1996-09-24
申请号：JP7466595
申请日：1995-03-08
申请人： DAIWA KASEI KENKYUSHO
发明人： MASAKI SEIJI , TAKEUCHI TAKAO , MATSUDA YOSHIHARU , OKUHAMA YOSHIAKI
IPC分类号： C01G1/10 , C01G19/00 , C01G29/00 , C25B1/00 , C25D3/56 , C25D21/14
摘要： PURPOSE: To provide an electrolytic producing method of tin sulfate and bismuth sulfate for tin-bismuth alloy plating. CONSTITUTION: Tin or bismuth is dissolved in a sulfuric acid electrolyte by using an electrolytic cell having an anode and cathode, which are separated by an anion exchange membrane or the anion exchange membrane and a cation exchange membrane, using a sulfuric acid solution as the electrolyte, using tin or bismuth as an anode and impressing DC voltage between the anode and a cathode. As a result, uranium or thorium of radioisotopes is removed and the count number of a radioactive α-particle in a film plated by using the tin or bismuth is suppressed to .

56. 发明专利

JPH0835088A ELECTROLYTIC PRODUCTION OF LEAD SULFONATE AND TIN SALT FOR SOLDERING 失效
公开(公告)号：JPH0835088A
公开(公告)日：1996-02-06
申请号：JP14005395
申请日：1995-05-16
申请人： DAIWA KASEI KENKYUSHO
发明人： OKUHAMA YOSHIAKI , MASAKI SEIJI , TAKEUCHI TAKAO , MATSUDA YOSHIHARU , YOSHIMOTO MASAKAZU
IPC分类号： C25B3/12 , C25D3/56 , C25D21/14 , H01L23/50
摘要： PURPOSE:To obtain an organic lead sulfonate and tin salt decreased in the count of radioactive alpha-particle by using an electrolytic cell separated into an anodic chamber and a cathodic chamber with a cation and anion exchange membrane and using a solution of a specific aliphatic and aromatic sulfonic acid as an electrolyic solution. CONSTITUTION:The solutions of the aliphatic sulfonic acid expressed by (X1)n-R- SO3H and the aromatic sulfonic acid expressed by a formula are used as the electrolyic solution. In the formulae, R is a 1-5C alkyl, X1 is OH, alkyl, aryl, alkylaryl, carboxyl or sulfo group and can be present in an optional position of the alkyl group and (n) is integers of 0-3. And X2 is OH, alkyl, aryl, alkylaryl, aldehyde, carboxyl, nitro, mercapto, sufo or amino group or two X2 can form naphthalene ring together with benzene ring and (m) is integers of 0-3. Lead or tin is used as the anode and DC voltage is impressed between the anode and the cathode.

57. 发明专利

JPH06173075A COPPER-NICKEL ALLOY PLATING BATH 失效
公开(公告)号：JPH06173075A
公开(公告)日：1994-06-21
申请号：JP35004992
申请日：1992-12-03
申请人： DAIWA KASEI KENKYUSHO
发明人： MASAKI SEIJI , HIRANO KAZUHIKO , YAMAKAWA KOJI
IPC分类号： C25D3/56 , C25D3/58
摘要： PURPOSE:To obtain uniform Cu-Ni alloy plating having the color of nickel by adding a complexing agent represented by a specified general formula and sodium heptoate to a plating bath consisting of a copper salt and a nickel salt. CONSTITUTION:Sodium heptoate and at least one of complexing agents represented by general formulae (a), (b) (where R'' is straight chain or branched alkylene, X is H, alkyl or CH(R)-COOM, R is H or alkyl, M is H or an alkali metal, (m) is an integer of 1-3 and (n) is an integer of 1-4) are added to a plating bath consisting of a copper salt and a nickel salt. Uniform Cu-Ni alloy plating having the color of nickel can be obtd. over a wide range of current density.

58. 发明专利

JPH0575837B2 失效
公开(公告)号：JPH0575837B2
公开(公告)日：1993-10-21
申请号：JP23309489
申请日：1989-09-11
申请人： DAIWA KASEI KENKYUSHO
发明人： MASAKI SEIJI , KONDO TETSUYA , YAMAKAWA KOJI
IPC分类号： C25D3/46

59. 发明专利

JPH02290993A CYANOGEN-FREE SILVER PLATING BATH 失效
公开(公告)号：JPH02290993A
公开(公告)日：1990-11-30
申请号：JP23309489
申请日：1989-09-11
申请人： DAIWA KASEI KENKYUSHO
发明人： MASAKI SEIJI , KONDO TETSUYA , YAMAKAWA KOJI
IPC分类号： C25D3/46
摘要： PURPOSE:To obtain a superior silver plating soln. contg. no poisonous cyanogen ions and comparable to a cyanide plating bath by adding a sulfanilic acid deriv. to an aq. soln. contg. a specified org. or inorg. silver salt, KI as a complexing agent and KOH as a pH adjusting agent. CONSTITUTION:A sulfanilic acid deriv. represented by formula I, II is added to an Ag plating soln. contg. 5 to 100g/l (expressed in terms of Ag ions) org. or inorg. silver salt, 300 to 450g/l KI as a complexing agent and KOH enough to adjust the plating soln. to pH3 to 6. The amt. of the deriv. added is 3 to 10g/l. The org. silver salt is silver acetate, silver benzoate, silver citrate, silver lactate or the silver salt of org. sulfonic acid represented by formula I or II, e.g. 2-hydroxyethanesulfonic acid or 2-hydroxypropanesulfonic acid and the inorg. silver salt may be silver nitrate, silver sulfate, silver carbonate, silver oxide, silver chloride or silver iodide. A superior Ag plating soln. contg. no poisonous cyanogen ions and comparable to a cyanide plating soln. is obtd. In the formula I, R is 1 to 6C alkyl, R1 is hydroxyl, aryl, alkylaryl, carboxyl or sulfonic acid and may be positioned at an arbitrary position of the alkyl and (n) is an integer of 0 to 3. In the formula II, R2 is hydroxyl, alkyl, aryl, alkylaryl, carboxyl or sulfonic acid and (m) is an integer of 0 to 3. In the formula III, Rb is H, 1 to 4C alkyl or phenyl, Ra is H or 1 to 4C alkyl, Rc is H or hydroxyl and A is a simple bond or phenylene.

60. 发明专利

JPH01119681A PLATING MATERIAL-TREATING AGENT SYSTEM FOR MECHANICAL PLATING 失效
公开(公告)号：JPH01119681A
公开(公告)日：1989-05-11
申请号：JP27666687
申请日：1987-10-30
申请人： DAIWA KASEI KENKYUSHO , MARUI TOKIN KOGYO KK
发明人： IDA YOSHIAKI , MORIKAWA YUKIAKI , OBATA KEIGO , OKUHAMA YOSHIAKI , MASAKI SEIJI , YONEMURA SHUZO
IPC分类号： C23C24/04
摘要： PURPOSE:To obtain a plating material-treating agent system for mechanical Al plating by constituting said system of Al powder contg. an arbitrary ratio of Zn powder as well as water, glass beads, dispersant, flash accelerator and plating accelerator and an activating agent. CONSTITUTION:The Al powder contg. the arbitrary ratio, more preferably about 0-50wt.% Zn powder is used as the metal powder of the plating material- treating agent system which consists of the metal powder, water and glass beads as well as the dispersant, flash accelerator and plating accelerator and is used in mechanical plating treatment. The above-mentioned activating agent is adequately hydrofluoric acid and fluorides such as NaF, NaHF2, KF, KHF2, NH4F, NH4HF2, H2SiF6, Na2SiF6, K2SiF6, (NH4)2SiF6, and HBF4. The amt. of said agent to be used is preferably 3-200wt.% in terms of F by the weight of the Al powder. The mechanical plating of Al having excellent corrosion resistance is executable by using the above-mentioned system.

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