专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

51. 发明专利

JPH05212852A CREAM SOLDER SUPPLYING MECHANISM 失效
公开(公告)号：JPH05212852A
公开(公告)日：1993-08-24
申请号：JP1975892
申请日：1992-02-05
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： FURUSAWA AKIO , ONISHI HIROAKI
IPC分类号： B41F15/08 , B41F15/34 , B41F15/40 , H05K3/12 , H05K3/34
摘要： PURPOSE:To supply an arbitrary amount of cream solder per a unit area. CONSTITUTION:The supply of cream solder is divided into two processes using two metal masks 19, 23 different in thickness. At this time, since the metal masks are different in thickness, the supply volume of the cream solder per a unit area can be changed in the first and second processes. By providing a recessed part to the rear of the metal mask used in the second process, the interference of the cream solder supplied on a substrate in the first process with the metal mask is avoided and the cream solder can be applied with high accuracy.

52. 发明专利

JP2005222964A Reflow soldering apparatus and method 有权
标题翻译： REFLOW焊接设备和方法
公开(公告)号：JP2005222964A
公开(公告)日：2005-08-18
申请号：JP2004026161
申请日：2004-02-03
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： NAGAI KOICHI , FURUSAWA AKIO
IPC分类号： B23K1/008 , B23K3/04 , B23K31/02 , B23K101/42 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To attain stabilized reflow soldering quality by sustaining desired temperature rise conditions in the vicinity of a solder joint while suppressing the temperature rise of a component below its specification limit even for a printed board mounting a component of low heat resistance.
SOLUTION: A reflow soldering apparatus for performing soldering by heating a printed board 1 mounting component 1a and 1b is provided with a heating object, e.g. a heating plate 3, capable of electromagnetic induction heating when the heating object part of the printed board 1 is arranged in contact therewith, a coil 6 disposed in proximity to the heating plate 3 in order to introduce electromagnetic induction heat to the heating plate 3 when an AC current is supplied, a temperature detecting means, e.g. a thermocouple 9, for detecting the temperature of the printed board 1 or the heating plate 3, and a temperature control unit 8 for controlling the heating amount of the heating plate 3 by regulating an AC current being fed to the coil 6 depending on the detected temperature of the thermocouple 9. Since heat is generated directly from the heating plate 3 by electromagnetic induction heating, the printed board 1 can be heated steeply resulting in high efficiency, high response soldering.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了通过在焊接附近保持期望的温度升高条件来获得稳定的回流焊接质量，同时将部件的温度升高抑制在低于其规格极限的情况下，即使对于安装低热成分的印刷电路板抵抗性。解决方案：通过加热印刷电路板1安装部件1a和1b来进行焊接的回流焊接装置设置有加热对象，例如，加热板3，当印刷电路板1的加热对象部分布置成接触时能够进行电磁感应加热，设置在加热板3附近的线圈6，以便在加热板3上引入电磁感应加热时，提供交流电流，温度检测装置，例如，用于检测印刷电路板1或加热板3的温度的热电偶9和温度控制单元8，用于通过调节根据检测到的馈送到线圈6的交流电流来控制加热板3的加热量由于通过电磁感应加热直接从加热板3产生热量，印刷板1可以被急剧加热，从而产生高效率，高响应性的焊接。版权所有（C）2005，JPO＆NCIPI

53. 发明专利

JP2005129692A Device and method for treating electronic component 有权
标题翻译：用于处理电子元件的装置和方法
公开(公告)号：JP2005129692A
公开(公告)日：2005-05-19
申请号：JP2003363081
申请日：2003-10-23
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： OKUMURA TOMOHIRO , SUETSUGU KENICHIRO , FURUSAWA AKIO , KAWAZOE KEIJI , SAITO MITSUHISA
IPC分类号： H01F41/10 , B23K10/00 , H05K3/28 , H05K3/34
CPC分类号： H05K3/3489 , H05K3/288 , H05K3/3447 , H05K2201/10287 , H05K2203/095
摘要： PROBLEM TO BE SOLVED: To provide a device and a method for treating an electronic component by which the terminal of an electronic part is plated with a lead-free solder and the electronic component is adapted to a lead-free solder mounting step.
SOLUTION: A coil 1 is comprised of a coil bobbin 2, a coil wire 3, and a part 4 that is made as a terminal through a following step. The coil wire 3 is a coated wire wherein a wire material made mainly of copper is covered with a resin, which is called an enameled wire in general. A handler 5 handling the coil 1 as an electronic component comprises a movable structure shown by an arrow in a diagram, and it can elevate while it holds the coil 1. A micro plasma source 6 is connected with a gas supply unit 7 and a power source 8, and it can locally generate a plasma and the enamel coating of the part 4 as a terminal can be removed.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：解决的问题：提供一种用于处理电子部件的装置和方法，电子部件的端子通过该电子部件被镀有无铅焊料，并且电子部件适用于无铅焊料安装步骤。解决方案：线圈1由线圈架2，线圈线3和通过后续步骤制成端子的部分4组成。线圈线3是一种涂覆线，其中主要由铜制成的线材通常用树脂覆盖，该树脂通常被称为漆包线。处理线圈1作为电子部件的处理机构5包括由图中箭头所示的可移动结构，并且可以在保持线圈1的同时升高。微等离子体源6与气体供给单元7连接，源8，并且其可以局部产生等离子体，并且可以去除作为端子的部分4的搪瓷涂层。版权所有（C）2005，JPO＆NCIPI

54. 发明专利

JP2004214535A Gas-blow-out hole array structure and heater 有权
公开(公告)号：JP2004214535A
公开(公告)日：2004-07-29
申请号：JP2003002110
申请日：2003-01-08
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： FURUSAWA AKIO , TANIGUCHI MASAHIRO , ABE TOSHIHIRO , NONOMURA MASARU
IPC分类号： B23K1/008 , B23K101/42 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a gas-blow-out hole array structure and a heater by which the whole surface of a circuit board can be heated almost equally at the time of soldering the circuit board.
SOLUTION: All opening holes 155 formed in a hot-air blow-out plate 150 are made to be disposed uniformly in the widthwise direction 103a of the plate 150.
COPYRIGHT: (C)2004,JPO&NCIPI

55. 发明专利

JP2002199740A INVERTER UNIT AND PRODUCT USING THE SAME 失效
公开(公告)号：JP2002199740A
公开(公告)日：2002-07-12
申请号：JP2000396337
申请日：2000-12-27
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： FURUSAWA AKIO , TOBIYAMA RYOTA , MARUYAMA YOSHIO , ENCHI KOHEI , SAKAI YOSHINORI
IPC分类号： H05B41/24 , H02M7/48
摘要： PROBLEM TO BE SOLVED: To provide an inverter unit and a product using it, that enables it to turn compact in size and low in cost. SOLUTION: This inverter unit is provided with a main board 13, which is structured by mounting an inverter circuit provided with rectifying/smoothing circuits and switching elements on a board on which wiring circuits are formed by covering and forming circuit patterns of conductive plates with insulating resin, a sub-board 14 on which a control circuit that controls the inverter circuit is mounted, and a baseboard 12 on which other circuits are mounted. The main board 13 and the sub-board 14 are assembled on the baseboard 12 and jointed.

56. 发明专利

JP2002140996A INVERTER AND MAGNETRON INTEGRATED UNIT, AND CIRCUIT BOARD FOR MOUNTING THEM 审中-公开
公开(公告)号：JP2002140996A
公开(公告)日：2002-05-17
申请号：JP2001196061
申请日：2001-06-28
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： ENCHI KOHEI , MARUYAMA YOSHIO , SAKAMOTO KAZUHO , MIHARA MAKOTO , FURUSAWA AKIO , TOBIYAMA RYOTA , NOBORI KAZUHIRO
IPC分类号： H05B41/24 , F24C7/02 , H01G4/18 , H01J23/00 , H01J23/15 , H01J23/34 , H05B6/64 , H05B6/66 , H05B6/80 , H05K1/02
摘要： PROBLEM TO BE SOLVED: To save space, reduce number of component items and wiring cables, improve an insulating property and heat dissipation, and reduce assembling man-hour, in a power circuit board used for a dryer for drying foods with a microwave oven or micro wave, a luminaire for lighting an electrodeless arc tube with the micro wave, an air conditioner, a refrigerator, a rice cooker, or the like. SOLUTION: An inverter 19 and a magnetron 21 are arranged on the circuit board 22 so that the inverter 19 is windward of an axial fan 20 and the magnetron 21 is downwind. A lead frame 28 of the circuit board 22 is coated with resin 29. A choke coil 40 is formed by alternately bending the lead frame 28 like zigzag, a capacitor 41 is formed of an electrode having a partially extended circuit pattern and a dielectric film 46, and a radiator plate 48 is formed by partially extending, bending, and raising the circuit pattern.

57. 发明专利

JP2001111208A METHOD AND SYSTEM FOR DISMANTLING PRINTED CIRCUIT BOARD 失效
公开(公告)号：JP2001111208A
公开(公告)日：2001-04-20
申请号：JP2000030428
申请日：2000-02-08
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： IGARI TAKASHI , FURUSAWA AKIO , NAKAI SHOJI , SUETSUGU KENICHIRO , FUKUSHIMA TETSUO
IPC分类号： B09B5/00 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a method of dismantling printed circuit boards, whereby valuable substances or harmful substances can be recovered at high efficiency. SOLUTION: Dismantling method of a printed circuit board 1 comprises a step of cutting the soldering side of the printed circuit board 1 fixed by embedding electronic components 3, 4 mounted on the component mounting side 2a of the printed circuit board 1 in a board hold medium 32 filled in a board fixing tank 33, a step of shaving off the electronic components 3, 4 from the component mounting side 2a, while heating the printed circuit board 1 after the solder side cutting step, and a step of separately recovering from the board hold medium 32 the electronic components 3, 4 and slivers 59 mixed in the board hold medium 32 in the soldering side cutting step.

58. 发明专利

JP2000200967A METHOD FOR CUTTING SOLDER SURFACE OF PRINTED CIRCUIT BOARD 失效
公开(公告)号：JP2000200967A
公开(公告)日：2000-07-18
申请号：JP193499
申请日：1999-01-07
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： NAKAI SHOJI , FUKUSHIMA TETSUO , FURUSAWA AKIO , SUETSUGU KENICHIRO
IPC分类号： B23C3/00 , G01B11/00 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a method of cutting a solder surface of a printed circuit board, whereby electronic components mounted on the board can be surely and easily removed by accurately cutting the solder surface of each of printed circuit boards having various shapes, using a machining cutter. SOLUTION: A laser position sensor 7 is moved relatively over a solder surface 3a to continuously measure the distance between this sensor 7 and the solder surface 3a, and protrusions 5a on the solder surface 3a and a resin surface of a resin material constituting the board body are separately detected from the variation level of that measured value. The height position of the machining cutter 6 is set, based on this detection result, and the solder surface is cut down to a level exposing the resin surface, using the machining cutter 6.

59. 发明专利

JP2000141600A APPARATUS AND METHOD FOR SCREEN PRINTING 失效
公开(公告)号：JP2000141600A
公开(公告)日：2000-05-23
申请号：JP31361398
申请日：1998-11-04
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： FURUSAWA AKIO , MIMURA TOSHINORI , ONISHI HIROAKI
IPC分类号： B41F15/08 , B41F15/40 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To form a stable print film even when physical properties of paste is changed by detecting the properties of the paste supplied onto a screen mask, calculating squeegee sliding conditions for sliding a squeegee on a screen mask according to a detected value, and driving the squeegee according to it. SOLUTION: A squeegee 3 is held by a squeegee holder 6, and moved on a guide rail 7 according to a command signal from a controller 9 in a direction of an arrow. A base plate support table 8 holds the plate 2 to be printed on its upper surface. A pressure sensor 10 is mounted on the surface of the squeegee 3 to a front side to its moving direction, and disposed so that in the case of moving the squeegee 3 by supplying cream solder to the surface of a screen mask 1, its measuring surface is brought into contact with the supplied solder. When the squeegee 3 is moved while pushing the solder on the mask 1, the viscosity of the solder can be obtained from the pressure of the solder.

60. 发明专利

JP2000124597A DISMANTLING METHOD AND SYSTEM OF PRINTED CIRCUIT BOARD 失效
公开(公告)号：JP2000124597A
公开(公告)日：2000-04-28
申请号：JP28938098
申请日：1998-10-12
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： FUKUSHIMA TETSUO , NAKAI SHOJI , FURUSAWA AKIO , SUETSUGU KENICHIRO
IPC分类号： B09B5/00 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a printed circuit board dismantling method and system, where electronic parts mounted by clinching lead wires or by the use of eyelets are easily, surely dismounted from a printed circuit board, and various types of printed circuit boards can be dismantled through the same simple structure. SOLUTION: An electronic part 12 mounted on a solder surface 7b on a printed circuit board 7 is dismounted by melting solder 54, and then the solder surface 7b is cut off, whereby a joint between an electronic part 11 mounted on a part surface 7a and the solder surface 7b is removed off. Then, solder 54 on the part surface 7a on an opposite side to the solder surface 7b is melted, and the electronic part 11 mounted on the part surface 7a is stripped off. Lastly, the part surface 7a is cut off.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式