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    • 59. 发明专利
    • COOLING STRUCTURE OF ELECTRONIC COMPONENT
    • JPH0334396A
    • 1991-02-14
    • JP13129890
    • 1990-05-23
    • HITACHI LTD
    • MATSUMOTO SATOSHISATO HIDEAKI
    • H05K7/20
    • PURPOSE:To improve an electronic component in cooling efficiency by a method wherein a convection guide plate which naturally cools the electronic component and a fan which forcibly cools the part of the equipment component of high heat release value and is provided onto the convection guide plate are provided. CONSTITUTION:To cool a printed wiring board 2 in each shelf 1, a guide wiring board 2 whose two ends are tilted upward are provided to a gap formed between the shelves 1 to guide cooling air so as to make it flow along the upside of the guide wiring board 2 toward the base of the shelf 1. To forcibly cool the printed wiring board 2 which locally releases a large quantity of heat, a fan 6 is installed on a convection guide plate 4 facing toward the position of the printed wiring board 2 which releases a large quantity of heat. A wire material 7a from a power source and a wire material 7b from the fan 6 are connected to each other through a connector 8 fitted to the above bent part 5, whereby the fan 6 is improved in workability and easily mounted or dismounted.