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51. 发明专利

JP2008001793A Polyimide film and its manufacturing process 审中-公开
标题翻译：聚酰亚胺薄膜及其制造工艺
公开(公告)号：JP2008001793A
公开(公告)日：2008-01-10
申请号：JP2006172400
申请日：2006-06-22
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： SAWAZAKI KOICHI , TESHIBA TOSHIHIRO
IPC分类号： C08J5/18 , B29C59/00
摘要： PROBLEM TO BE SOLVED: To provide a polyimide film having an excellent easy-to-slip characteristic which reduces the adhesion of the films at the hinges in laminating multilayer boards with a heat press and solves the problem of "squeaking" noises made by the films rubbed with each other and its manufacturing process.
SOLUTION: The polyimide film has streaky ruggedness the distances between the tops and the bottoms of which are in the range of 0.05-10 μm on the surface. The maximum distance Ry between the tops and the bottoms of the streaky ruggedness is in the range of 4-10 μm. The surface roughness Rz of the film is 0.7-8 μm.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有优异的易滑动特性的聚酰亚胺膜，其在热压机的层压多层板中降低了铰链处的膜的粘附性，并且解决了产生“吱吱”的噪音的问题由电影相互摩擦及其制造过程。
解决方案：聚酰亚胺薄膜的表面上的顶部和底部之间的距离在0.05-10μm的范围内具有条纹粗糙度。条纹坚固性的顶部和底部之间的最大距离Ry在4-10μm的范围内。膜的表面粗糙度Rz为0.7〜8μm。版权所有（C）2008，JPO＆INPIT

52. 发明专利

JP2007201442A Chip-on film 审中-公开
标题翻译：芯片电影
公开(公告)号：JP2007201442A
公开(公告)日：2007-08-09
申请号：JP2006345629
申请日：2006-12-22
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： SAWAZAKI KOICHI , KOKUNI MASAHIRO , MAEDA SHU
IPC分类号： H01L21/60 , B32B15/08 , B32B15/088
摘要： PROBLEM TO BE SOLVED: To provide a chip-on film, having improved bending properties manufactured by using a polyimide film, having high dimensional stability and appropriate modulus of elasticity.
SOLUTION: In the chip-on film where wiring is formed on at least one side of the polyimide film so that an IC chip can be mounted, the polyimide film mainly uses paraphenylenediamine and 4,4'-diaminophenylether as diamine components, and a pyromellitic acid dianhydride component as acid dianhydride components. The wiring is formed on at least one surface of the polyimide film, via or without going through the intermediary of an adhesive.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供具有高尺寸稳定性和适当的弹性模量的具有通过使用聚酰亚胺膜制造的改进的弯曲性能的贴片膜。解决方案：在聚酰亚胺膜的至少一侧形成布线的贴片膜中，可以安装IC芯片，聚酰亚胺膜主要使用对苯二胺和4,4'-二氨基苯基醚作为二胺成分，和均苯四酸酸二酐组分作为酸二酐组分。在聚酰亚胺膜的至少一个表面上，经由或不经过粘合剂的介质形成布线。版权所有（C）2007，JPO＆INPIT

53. 发明专利

JP2007194603A Flexible printed wiring board, and manufacturing method thereof 审中-公开
标题翻译：柔性印刷接线板及其制造方法
公开(公告)号：JP2007194603A
公开(公告)日：2007-08-02
申请号：JP2006338352
申请日：2006-12-15
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： KOKUNI MASAHIRO , MAEDA SHU , SAWAZAKI KOICHI
IPC分类号： H05K1/03 , B32B15/088
摘要： PROBLEM TO BE SOLVED: To provide a flexible printed wiring board in which a minute wiring can be formed and is not deformed even if a lead-free solder is used.
SOLUTION: In the flexible printed wiring board; a polyimide film mainly containing p-phenylendiamine and 4,4'-diaminodiphenyl ether as a diamine component, and pyromellitic acid dianhydride and 3,3',4,4'-biphenyltetracarboxylic acid dianhydride as an acid dianhydride component is used, and wiring is performed with an adhesive or without an adhesive on a single surface or both surfaces of the polyimide film.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种柔性印刷线路板，其中即使使用无铅焊料也可以形成微小的布线并且不变形。
解决方案：在柔性印刷电路板中; 使用主要含有对苯二胺和4,4'-二氨基二苯醚作为二胺组分的聚酰亚胺膜，并且使用均苯四甲酸二酐和作为酸二酐组分的3,3'，4,4'-联苯四羧酸二酐，并且布线为在聚酰亚胺膜的单个表面或两个表面上用粘合剂或无粘合剂进行。版权所有（C）2007，JPO＆INPIT

54. 发明专利

JP2007168370A Copper plated board 审中-公开
标题翻译：铜板
公开(公告)号：JP2007168370A
公开(公告)日：2007-07-05
申请号：JP2005372217
申请日：2005-12-26
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： MAEDA SHU , SAWAZAKI KOICHI , KOKUNI MASAHIRO
IPC分类号： B32B15/088 , C08G73/10
摘要： PROBLEM TO BE SOLVED: To provide a copper plated board preferable as a material for a flexible printed circuit board improved in dimensional stability and heat resistance and being able to form fine wiring and also not deformed even if a lead-free solder is used. SOLUTION: The copper plated board having a copper plate through an adhesive or without the adhesive can be obtained on one side or both the sides of a polyimide film made by using a polyimide film comprised of 3,4'-diaminodiphenyl ether and 4,4'-diaminodiphenyl ether as a diamine component and pyromellitic acid dianhydride as an acid dianhydride component. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供优选作为柔性印刷电路板的材料的镀铜板，其改善尺寸稳定性和耐热性，并且能够形成精细布线，并且即使无铅焊料是用过的。解决方案：通过使用由3,4'-二氨基二苯基醚构成的聚酰亚胺膜和聚酰亚胺膜制成的聚酰亚胺膜的一面或两面可以获得通过粘合剂或不具有粘合剂的铜板的铜镀板，作为二胺组分的4,4'-二氨基二苯醚和作为酸二酐组分的1,2,4,5-苯四酸二酐。版权所有（C）2007，JPO＆INPIT

55. 发明专利

JP2005314669A Polyimide film and copper-clad laminate using the same as substrate 审中-公开
标题翻译：聚酰亚胺膜和铜箔层压板，使用其作为基板
公开(公告)号：JP2005314669A
公开(公告)日：2005-11-10
申请号：JP2005088334
申请日：2005-03-25
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： SAWAZAKI KOICHI , KOKUNI MASAHIRO , TESHIBA TOSHIHIRO
IPC分类号： C08J5/18 , B32B15/08 , C08K3/00 , C08L79/08
摘要： PROBLEM TO BE SOLVED: To provide a polyimide film having excellent dimensional stability and suitable for a substrate for a fine pitch circuit board, especially a COF (chip on film) wired at a narrow pitch in the film width direction and to provide a copper-clad laminate using the same film as a substrate.
SOLUTION: The polyimide film is characterized as having 3-10 ppm/°C coefficient of thermal expansion α
MD in the mechanical transporting direction (MD) of the film and 10-20 ppm/°C coefficient of thermal expansion α
TD in the transverse direction (TD). The copper-clad laminate is characterized in that the copper of 1-10 μm thickness is formed on the polyimide film as the substrate.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决问题：提供一种尺寸稳定性优异的聚酰亚胺膜，适用于细间距电路基板，特别是薄膜宽度方向的窄间距配线的COF（膜上胶片）的基板，使用与基板相同的膜的覆铜层压板。解决方案：聚酰亚胺膜的特征在于膜的机械传送方向（MD）为3-10ppm /℃的热膨胀系数α MD ，10-20ppm /° 热膨胀系数α TD 横向（TD）。覆铜层压板的特征在于，在作为基板的聚酰亚胺膜上形成有1-10μm厚度的铜。版权所有（C）2006，JPO＆NCIPI

56. 发明专利

JP2003335874A Polyimide film 有权
标题翻译：聚酰亚胺膜
公开(公告)号：JP2003335874A
公开(公告)日：2003-11-28
申请号：JP2002143319
申请日：2002-05-17
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： SAWAZAKI KOICHI , YOKOYAMA HIROICHI
IPC分类号： C08J5/18 , B29C55/02 , B29K79/00 , B29L7/00 , C08G73/10
摘要： PROBLEM TO BE SOLVED: To provide a polyimide film suffering from small dimensional changes both at ordinary temperature and at a higher temperature and suitable for a fine pitch circuit board.
SOLUTION: The polyimide film has a Young's modulus of at least 4 GPa, a heat shrinkage ratio at 350°C of at most 0.15% and a heat shrinkage ratio at 400°C of at most 0.20%, and preferably has a water absorption of at most 2.5% and a thermal expansion coefficient between 350-400°C of 20-30 ppm/°C. The film is excellent in processability, has high dimensional stability and can reduce dimensional changes in a step at a higher temperature, and therefore is suitably employed for the fine pitch circuit board.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供在常温和较高温度下都具有小的尺寸变化并且适合于细间距电路板的聚酰亚胺膜。解决方案：聚酰亚胺膜的杨氏模量为至少4GPa，350℃下的热收缩率至多为0.15％，在400℃下的热收缩率至多为0.20％，优选具有吸水率最多为2.5％，热膨胀系数在350-400℃之间为20-30ppm /℃。该膜的加工性优异，尺寸稳定性高，能够在较高温度下降低尺寸变化，因此适用于微型间距电路基板。版权所有（C）2004，JPO

57. 发明专利

JP2017114098A 積層フィルム审中-公开
公开(公告)号：JP2017114098A
公开(公告)日：2017-06-29
申请号：JP2015255386
申请日：2015-12-25
申请人：東レ・デュポン株式会社 , Du Pont-Toray Co Ltd
发明人： TOIDA NORIKO , SAWAZAKI KOICHI
IPC分类号： B32B27/34 , C01B32/205 , C08G73/10
摘要：【課題】厚いグラファイトシートを製造できる、ポリイミドフィルムを提供する。【解決手段】ポリイミドフィルム1とポリイミドフィルム2とで構成された積層ユニットAを少なくとも有する積層フィルムにおいて、積層ユニットAの積層面の算術平均粗さRaの合計を0.15〜1.5μmとし、好ましくは、ポリイミドフィルム1及びポリイミドフィルム2と異なる別のポリイミドフィルムを積層した多層構造を有し、別のポリイミドフィルムの積層面において、算術平均粗さRaの合計が0.15〜1.5μmである積層フィルム。【選択図】図1

58. 发明专利

JP2015021101A ポリイミドフィルム有权
标题翻译：聚酰亚胺膜
公开(公告)号：JP2015021101A
公开(公告)日：2015-02-02
申请号：JP2013152128
申请日：2013-07-22
申请人：東レ・デュポン株式会社 , Du Pont-Toray Co Ltd
发明人： YASUDA MASABUMI , SAWAZAKI KOICHI , YATSUNAMI YUJI
IPC分类号： C08J5/18 , B32B15/08 , B32B15/088 , H05K1/03
摘要：【課題】寸法安定性に優れ、ファインピッチ回路用基板、特にフィルム幅方向に狭ピッチに配線されるCOF(ChiponFilm)用に好適なポリイミドフィルム及びそれを基材とした銅張積層体を提供すること。【解決手段】パラフェニレンジアミンを含む芳香族ジアミン成分と酸無水物成分を用いて得られるポリイミドフィルムであって、島津製作所製TMA−50を使用し、測定温度範囲:50〜200℃、昇温速度:10℃/分の条件で測定したフィルムの機械搬送方向(MD)の熱膨張係数αMDが2.0ppm/℃以上10.0ppm/℃未満の範囲にあり、幅方向(TD)の熱膨張係数αTDが−2.0ppm/℃以上3.5ppm/℃以下の範囲にあり、|αMD|≧|αTD|?2.0の関係を満たすことを特徴とするポリイミドフィルム。【選択図】なし
摘要翻译：要解决的问题：为了提供尺寸稳定性优异并且适用于细间距电路基板，特别是在膜宽度方向上以窄间距布线的COF（膜上芯片）的聚酰亚胺膜，并且提供使用该膜作为基材的覆铜层压板。提供了通过使用包含对苯二胺和酸酐组分的芳族二胺组分获得的聚酰亚胺膜。在聚酰亚胺膜中，使用由岛津制作所制造的TMA-50测定的膜的机器输送方向（MD）的热膨胀系数α，在温度范围为50〜200℃的条件下，上升10℃/分钟，处于2.0ppm /℃以上至小于10.0ppm /℃的范围内，在相同条件下测定的膜的宽度方向（TD）的热膨胀系数α，在-2.0ppm /℃以上〜3.5 /℃以下的范围内，满足|α|≥|α|×2.0的关系。

59. 发明专利

JP2014043511A Polyimide film and method for producing the same 审中-公开
标题翻译：聚酰亚胺膜及其制造方法
公开(公告)号：JP2014043511A
公开(公告)日：2014-03-13
申请号：JP2012186665
申请日：2012-08-27
申请人： Du Pont-Toray Co Ltd , 東レ・デュポン株式会社
发明人： SAKURAGI ERIKA , OKUI MASAKAZU , SAWAZAKI KOICHI
IPC分类号： C08J5/18 , B32B7/02 , B32B15/088 , B32B27/34 , C08G73/10 , C09J7/02 , C09J179/08
摘要： PROBLEM TO BE SOLVED: To provide a polyimide film which can reduce the dimensional change in the film width direction (TD) and reduce the dimensional change during high-temperature processing while keeping a thermal expansion coefficient approximate to metal, and which is suitable for a substrate for a fine pitch circuit such as COF.SOLUTION: The polyimide film is obtained by annealing, at a temperature of 300 to 450°C, a polyimide film which is produced by using one or more aromatic diamine components selected from the group comprising para-phenylenediamine, 4,4'-diaminodiphenyl ether and 3,4'-diaminodiphenyl ether, and one or more aromatic acid anhydride components selected from the group comprising pyromellitic dianhydride and 3,3',4,4'- biphenyltetracarboxylic acid dianhydride. The polyimide film is characterized in that the linear thermal expansion coefficient αin the machine transportation direction (MD) of the film is within the range of 10.0 to 20.0 ppm/°C, as measured under such conditions that the measurement temperature range is 50-200°C and the temperature raising speed is 10°C/min, by using a TMA-50 made by Shimadzu Corporation, the linear thermal expansion coefficient αin the width direction (TD), measured under the conditions mentioned above, is within the range of 3.0 to 7.0 ppm/°C, and when the film is cooled to room temperature after raising the temperature to 300°C by using the TMA-50, the contraction quantity of the length in the width direction (TD) is 0.020% or less to the initial length.
摘要翻译：要解决的问题：提供一种可以减小膜宽度方向（TD）的尺寸变化并降低高温处理过程中的尺寸变化同时保持热膨胀系数接近于金属的聚酰亚胺薄膜，适用于用于诸如COF的细间距电路的基板。解决方案：聚酰亚胺膜通过在300至450℃的温度下退火获得聚酰亚胺膜，其通过使用一种或多种选自以下的芳族二胺组分制备：苯二胺，4,4'-二氨基二苯醚和3,4'-二氨基二苯醚，以及一种或多种选自均苯四酸二酐和3,3'，4,4'-联苯四羧酸二酐的芳族酸酐组分。聚酰亚胺膜的特征在于，在测定温度范围为50〜200℃的条件下，膜的机械输送方向（MD）的线性热膨胀系数α在10.0〜20.0ppm /℃的范围内 ℃，升温速度为10℃/分钟，通过使用岛津制作所制造的TMA-50，在上述条件下测定的宽度方向（TD）的线性热膨胀系数α在 3.0〜7.0ppm /℃，通过使用TMA-50将温度升温至300℃后将膜冷却至室温时，宽度方向（TD）的长度的收缩量为0.020％以下到初始长度。

60. 发明专利

JP2014028966A Polyimide film and copper-clad laminate having the same as substrate 有权
标题翻译：具有相同基底的聚酰亚胺膜和铜箔层压板
公开(公告)号：JP2014028966A
公开(公告)日：2014-02-13
申请号：JP2013190089
申请日：2013-09-13
申请人： Du Pont-Toray Co Ltd , 東レ・デュポン株式会社
发明人： SAWAZAKI KOICHI , KOKUNI MASAHIRO , TESHIBA TOSHIHIRO
IPC分类号： C08J5/18 , B32B15/08 , B32B15/088 , H05K1/03 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To provide a polyimide film that is excellent in dimensional stability, and that is suitable to a substrate of a fine pitch circuit, especially to a COF(Chip on Film) in which wiring is performed in a film width direction by a narrow pitch; and a copper-clad laminate having the same as a substrate.SOLUTION: A polyimide film is characterized in that a coefficient of thermal expansion αMD in a machine transportation direction (MD) of the film is 3-10 ppm/°C, and a coefficient of thermal expansion αTD in a crosswise direction (TD) of the film is 10-20 ppm/°C, and moreover a copper-clad laminate is characterized in that the polyimide film is included as a substrate, and a copper having a thickness of 1-10 μm is formed on the polymide film.
摘要翻译：要解决的问题：为了提供尺寸稳定性优异的聚酰亚胺膜，适用于细间距电路的基板，特别是涉及在膜宽度方向上进行布线的COF（膜上贴片）狭窄的音调以及与基板相同的覆铜层压板。解决方案：聚酰亚胺膜的特征在于，膜的机械输送方向（MD）的热膨胀系数αMD为3-10ppm /℃，膜的横向（TD）的热膨胀系数αTD为10〜20ppm /℃，另外，覆铜层压板的特征在于，作为基板包含聚酰亚胺膜，在聚酰亚胺膜上形成1-10μm。

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