专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

51. 发明专利

JP2004146630A Optical module 审中-公开
公开(公告)号：JP2004146630A
公开(公告)日：2004-05-20
申请号：JP2002310614
申请日：2002-10-25
申请人： Hitachi Ltd , Opnext Japan Inc , 日本オプネクスト株式会社 , 株式会社日立製作所
发明人： YOSHIDA ISAMU , KAWAMOTO KAZUTAMI , MATSUSHIMA NAOKI , KUWANO HIDEYUKI , NIWA YOSHIAKI
IPC分类号： G02B6/42 , H01S5/022 , H01S5/024 , H01S5/026
摘要： PROBLEM TO BE SOLVED: To provide an optical module capable of preventing cracks from occurring by reducing stress concentration resulting from a difference in each member's thermal expansion generated in a bottom face of a groove through temperature change occurring when a cooler or a package and an Si substrate are soldered together in the optical module.
SOLUTION: There is provided the optical module comprising a semiconductor laser element, a lens for converting light emitted from the semiconductor laser element, the substrate mounting these parts, the cooler mounting the Si substrate, and the package for housing the cooler. The optical module includes the groove having any one of shapes among V, trapezoidal and rectangular shapes. The shape of a metalized film in the backside of the Si substrate connected to the package can be formed in a location by avoiding a location corresponding to the bottom face of the groove and further avoiding at least one side of a lateral face in an optical axial direction of a location corresponding to the bottom face of the groove.
COPYRIGHT: (C)2004,JPO

52. 发明专利

JP2004128291A Semiconductor laser module and optical transmission receptacle 有权
公开(公告)号：JP2004128291A
公开(公告)日：2004-04-22
申请号：JP2002291806
申请日：2002-10-04
申请人： Hitachi Ltd , Opnext Japan Inc , 日本オプネクスト株式会社 , 株式会社日立製作所
发明人： MORIYA HIROSHI , ASHIDA YOSHIAKI , OZAKI TOSHIAKI
IPC分类号： G02B6/42 , H01S5/022
CPC分类号： H01S5/02216 , H01S5/02284
摘要： PROBLEM TO BE SOLVED: To prevent an optical axis from being deviated by a temperature cycle in a semiconductor laser module and an optical transmitter using the same.
SOLUTION: The semiconductor laser module has a semiconductor laser element, a frame for housing the semiconductor laser element, an optical fiber fixing part linked to the frame, and a flange which is communicated to the frame and equipped with a fixing part for fixing the frame on a substrate. The flange has a narrow area narrower than a fixed area which includes the fixing part with the substrate between the fixed area and the frame.
COPYRIGHT: (C)2004,JPO

53. 发明专利

JP2004119459A Optical module and semiconductor optical device 审中-公开
公开(公告)号：JP2004119459A
公开(公告)日：2004-04-15
申请号：JP2002277323
申请日：2002-09-24
申请人： Hitachi Ltd , Opnext Japan Inc , 日本オプネクスト株式会社 , 株式会社日立製作所
发明人： NAKATSUKA SHINICHI , AOKI MASAHIRO
IPC分类号： G02F1/017 , G02F1/295 , H01S5/026 , H01S5/343
摘要： PROBLEM TO BE SOLVED: To increase an extinction ratio of a light modulation intensity by adding a function of modulating an emitting position or direction of a light to an optical waveguide having a function of modulating the intensity of a guided light signal. SOLUTION: A semiconductor optical device includes at least a laser oscillator and a light modulator in such a manner that a core of the optical waveguide of the modulator is controllable, so that its complex refractive index becomes asymmetrical in a plane perpendicular to an optical axial direction. An optical module includes the semiconductor optical device. Thus, since a light propagating in the waveguide is modulated at its emitting position in addition to an intensity modulation, the extinction ratio of the light modulation intensity can be increased by providing a photodetecting opening at a position for photodetecting much specifically deflected light. COPYRIGHT: (C)2004,JPO

54. 发明专利

JP2004014840A Optical module 审中-公开
公开(公告)号：JP2004014840A
公开(公告)日：2004-01-15
申请号：JP2002166864
申请日：2002-06-07
申请人： Opnext Japan Inc , 日本オプネクスト株式会社
发明人： YOSHIDA ISAMU , KAWAMOTO KAZUTAMI , SASAKI HIROYASU
IPC分类号： G02B6/42 , H01S5/022
摘要： PROBLEM TO BE SOLVED: To provide an optical module for improving cooling performance in the optical module, reducing temperature distribution in an entire package, and restraining deformation in a package and reducing tracking errors.
SOLUTION: The optical module comprises a loading board 5 for mounting a semiconductor laser element 1, a monitor element for monitoring light emitted from the semiconductor laser element 1 for controlling light intensity, a lens for converting light emitted from the semiconductor laser element, and the package for accommodating the loading board 5. A cooler 30 composed of Peltier elements 31 is mounted on an outer wall corresponding to the inner wall of the package where the loading board is installed.
COPYRIGHT: (C)2004,JPO

55. 发明专利

JP2004012854A METHOD FOR MANUFACTURING OPTICAL TRANSMISSION MODULE 审中-公开
公开(公告)号：JP2004012854A
公开(公告)日：2004-01-15
申请号：JP2002166871
申请日：2002-06-07
申请人： OPNEXT JAPAN INC
发明人： DAIROKU NORIYUKI
IPC分类号： G02B6/42
摘要： PROBLEM TO BE SOLVED: To inexpensively provide an optical transmission module having high optical coupling efficiency. SOLUTION: The method for manufacturing the optical transmission module for optically coupling an optical semiconductor element and an optical fiber through a ball lens fixed to a substrate mounted with the optical semiconductor element comprises detecting the difference in the optical characteristics between a metallized portion disposed in part of the ball lens and a glass portion of the lens surface to detect the position of the ball lens, controlling the position of the ball lens in accordance with the result of the detection, mounting the ball lens on a substrate, and fixing the ball lens by soldering. COPYRIGHT: (C)2004,JPO

56. 发明专利

JP2003347644A Light transmission module 审中-公开
标题翻译：光传输模块
公开(公告)号：JP2003347644A
公开(公告)日：2003-12-05
申请号：JP2002149226
申请日：2002-05-23
申请人： Opnext Japan Inc , 日本オプネクスト株式会社
发明人： SASAKI HIROYASU , KANEKO SATOSHI , GOMYO HIROYUKI
IPC分类号： H01S5/022
摘要： PROBLEM TO BE SOLVED: To provide a light transmission module mounting a carrier secured to a test stem without being soldered thereto while mounting a laser diode element and subjected to measurement of various characteristics, screening, and the like.
SOLUTION: The light transmission module comprises the carrier 10 mounting the laser diode element being pressed against a block 20 having a plane of high planarity by means of a springy electrode 23b and secured in place and then tested using a test stem for connecting leads led out from the electrode with an external device electrically.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种光传输模块，其安装固定到测试杆上的载体而不被焊接到其上，同时安装激光二极管元件并进行各种特性，筛选等的测量。解决方案：光传输模块包括载体10，其安装激光二极管元件，该激光二极管元件通过弹性电极23b被压靠在具有高平坦平面的块20上，并固定就位，然后使用测试杆进行连接电极从电极引出的外部电极引线。版权所有（C）2004，JPO

57. 发明专利

JP2003318601A High-frequency transmission line and optical module using the same 审中-公开
标题翻译：高频传输线和使用它的光模块
公开(公告)号：JP2003318601A
公开(公告)日：2003-11-07
申请号：JP2002123620
申请日：2002-04-25
申请人： Opnext Japan Inc , 日本オプネクスト株式会社
发明人： MATSUSHIMA NAOKI , KAWAMOTO KAZUTAMI , KUWANO HIDEYUKI , NIWA YOSHIAKI , KATO TETSUYA
IPC分类号： H01S5/022 , H01P1/02 , H01P3/02 , H01P3/08 , H01S5/026
CPC分类号： H01P1/02
摘要： PROBLEM TO BE SOLVED: To provide a transmission line having a suppressed reflection loss at bends to provide proper high-frequency transmission characteristics, and to provide an optical module having proper high-frequency transmission characteristics, using the same. SOLUTION: The transmission line is either a coplanar line with a bend, a coplanar line with ground or a coplanar split line. It has a chamfer 111 at a bend outer edge of a signal wiring conductor 11 and a triangular conductor 112 added to the inside corner, resulting in a shape satisfying a>b+c×√2, where a is the chamfer length, b is the length of the wiring end face of the triangular conductor and c is the width of the signal wiring conductor. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种在弯曲处具有抑制的反射损耗以提供适当的高频传输特性的传输线，并提供具有适当的高频传输特性的光模块。
解决方案：传输线是具有弯曲的共面线，与地面的共面线或共面分裂线。在信号布线导体11的弯曲外缘具有倒角111，在内角加上三角形导体112，形成满足> b + c×√2的形状，其中a为倒角长度，b为三角形导体的布线端面的长度和c是信号布线导体的宽度。版权所有（C）2004，JPO

58. 发明专利

JP2003264405A HIGH FREQUENCY TRANSMISSION LINE, ELECTRONIC COMPONENT USING THE SAME AND ELECTRONIC EQUIPMENT 审中-公开
公开(公告)号：JP2003264405A
公开(公告)日：2003-09-19
申请号：JP2002063431
申请日：2002-03-08
申请人： OPNEXT JAPAN INC
发明人： TORIGOE MAKOTO , SUGA TAKU , KAMISAKA KOICHI
IPC分类号： H01P3/02 , H01P3/06 , H01P3/08 , H01P5/08 , H01P11/00 , H05K1/02
摘要： PROBLEM TO BE SOLVED: To provide a transmission line with less leakage of an electromagnetic field and to provide electronic components or electronic equipment with satisfactory high frequency characteristics using the transmission line. SOLUTION: The transmission line is realized by digging a groove on a circuit board, forming a conductive film on the surface of the groove, filling the groove with a dielectric, forming a metal conductive body on the dielectric and sandwiching the metal conductive body with the similar one obtained from the groove on which the conductive film is formed and filled with the dielectric from an upper surface. COPYRIGHT: (C)2003,JPO

59. 发明专利

JP2003249711A OPTICAL COMMUNICATION MODULE 审中-公开
公开(公告)号：JP2003249711A
公开(公告)日：2003-09-05
申请号：JP2002049205
申请日：2002-02-26
申请人： OPNEXT JAPAN INC
发明人： MARUYAMA SHIGENOBU , KAWAMOTO KAZUTAMI , FURUICHI HIROO , YOSHIDA TORU , YOSHIDA ISAMU , ONO KATSUYA , YAMADA OSAMU , IBE MASARU , TOKITA SHIGERU , TONOZUKA TAROU
IPC分类号： H01S5/022 , H01L31/02 , H04B10/00 , H04B10/40 , H04B10/50 , H04B10/60 , H04B10/04 , H04B10/06 , H04B10/14 , H04B10/26 , H04B10/28
摘要： PROBLEM TO BE SOLVED: To increase the transmission capacity of a receptacle type optical communication module. SOLUTION: The optical communication module comprises a high-speed signal transmission wiring matched at characteristic impedance to about 50 Ω, solder connectors of a transmission can package and a receiving can package having solder connectors at one end of the wiring, and the solder connector at one end of the wiring on a ceramic board through a can stem, to place a peripheral circuit and a communication control circuit of the module in a structure in which the wiring matched at the impedance to about 50 Ω and a flexible circuit board having solder connectors at both ends of the wiring are connected between the module and the solder connector on the printed board having the connector for connecting to a mother board. COPYRIGHT: (C)2003,JPO

60. 发明专利

JP2003229629A OPTICAL MODULE 审中-公开
公开(公告)号：JP2003229629A
公开(公告)日：2003-08-15
申请号：JP2002026655
申请日：2002-02-04
申请人： OPNEXT JAPAN INC
发明人： IBE MASARU , IWATO TAISUKE , KUROGUCHI KATSUMI , YOSHIDA TORU , FURUICHI HIROO , KAWAMOTO KAZUTAMI , YOSHIDA ISAMU
IPC分类号： H01L23/02 , H01L23/04 , H01L31/02 , H01S5/022
摘要： PROBLEM TO BE SOLVED: To realize a can package type optical module capable of transmitting a high-speed signal in the module having an optical element such as a light emitting element, a photodetector and the like for transmitting and receiving a laser beam, internally mounted in a can. SOLUTION: The optical module comprises a ceramic board 3 passed through a stem 1 of a can package, desired number of wirings 13 including high speed signal wirings 17 to 19 and formed on the board 3, and necessary electronic components except a photodetector and a light emitting element 6 such as a driver LSI 7, an amplifying LSI and the like housed in a can package 11. COPYRIGHT: (C)2003,JPO

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式