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    • 44. 发明专利
    • DEVICE FOR CARRYING GRIT IN GRIT CHAMBER
    • JPH11123342A
    • 1999-05-11
    • JP30786497
    • 1997-10-21
    • ITO SEISAKUSHO
    • ITO HIROSHIITO KYOJI
    • B01D21/18B03B5/68
    • PROBLEM TO BE SOLVED: To provide the titled device which does not need a large-scale mechanical apparatus and has little friction and is easily maintained and can perform classification by carrying the grit to the discharging side while the grit is cleaned. SOLUTION: In a grit chamber in which sand is settled and classified from muddy sludge, etc., a plurality of nozzle parts 24 are arranged in parallel at an interval front and back and left and right on the bottom parts of chevron channels in the grit chamber 1 and are faced forward to the plurality of lines and distribution pipes 23 of a water feeding device 2 are connected with the nozzle parts 24 so as to jet water from each nozzle part 24 and flow adjusting plates 3 crossing at right angles the discharging direction are provided to the distribution pipes 23 arranged in parallel and the grit is carried to the discharging side in the front direction by blowing forward the grit at the position by jetting water in the front direction from each nozzle part 24.
    • 46. 发明专利
    • JET SCRUBBER
    • JPH03139832A
    • 1991-06-14
    • JP27613089
    • 1989-10-25
    • EBARA CORP
    • TAKAO SHOSUKEYOKOI KEIJIMINAMI YOSHIO
    • B08B3/10B03B5/68H01L21/304
    • PURPOSE:To exhibit sufficient cleaning capability regardless of the type of contaminant by watertightly forming a structure for containing a wafer, a chuck and a nozzle, incorporating water inside it, and mounting the wafer, the chuck for hooding the wafer, and the exit of the nozzle for injecting high pressure water under the water level. CONSTITUTION:High pressure water to be injected from the exit O of a nozzle 1 is fed to the surface of a wafer 2 through the wafer W in a structure 7, and cavitation bubbles are generated by friction with static water W therebetween. The bubbles are ruptured when they reach the surface of the wafer 3 separated by a predetermined distance from the exit O of the nozzle 1 to generate a large impact pressure. Various contaminants on the wafer are removed by the impact pressure. In this case, in order to easily generate the bubbles, the water W is degassed, or the water is heated. Thus, the structure 7 is formed with a cover 14 in a sealing construction, the inside is evacuated, or a heater 26 is installed therein.