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41. 发明专利

JP2006173409A Module 有权
标题翻译： MODULE
公开(公告)号：JP2006173409A
公开(公告)日：2006-06-29
申请号：JP2004365004
申请日：2004-12-16
申请人： Elpida Memory Inc , Hitachi Ltd , エルピーダメモリ株式会社 , 株式会社日立製作所
发明人： UEMATSU YUTAKA , OSAKA HIDEKI , NISHIO YOJI , SENBA SEIJI
IPC分类号： H01L21/8238 , G06F3/00 , G11C11/401 , H01L27/092
CPC分类号： H05K1/023 , H01L23/50 , H01L23/66 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2224/32145 , H01L2224/48091 , H01L2224/48145 , H01L2224/48195 , H01L2224/48472 , H01L2224/49 , H01L2225/0651 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/15311 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H05K1/0227 , H05K1/0231 , H05K1/0233 , H05K1/025 , H05K1/181 , H05K2201/093 , H05K2201/09663 , H05K2201/10022 , H05K2201/1003 , H05K2201/10159 , H05K2201/10522 , H05K2201/10545 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a module wiring method by which both auto-noise and propagation noise can be effectively reduced. SOLUTION: In a memory module, a plurality of memories 2 are mounted on a module substrate 1, Vref-Vss impedance near the memories 2 is coupled with Vss by a decoupling capacitor 5 and Vref planes 4 to reduce impedance, the Vref plane 4 is individually provided for each memory 2, and the Vref planes 4 are connected by high-impedance wiring or high-impedance chip components 3-1, 3-2. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供可以有效降低自噪声和传播噪声的模块布线方法。解决方案：在存储器模块中，多个存储器2安装在模块基板1上，存储器2附近的Vref-Vss阻抗通过去耦电容器5和Vref平面4与Vss耦合以减小阻抗，Vref 每个存储器2分别提供平面4，并且Vref平面4通过高阻抗布线或高阻抗芯片组件3-1,3-2连接。版权所有（C）2006，JPO＆NCIPI

42. 发明专利

JP2005286057A Circuit device and its manufacturing method 审中-公开
标题翻译：电路设备及其制造方法
公开(公告)号：JP2005286057A
公开(公告)日：2005-10-13
申请号：JP2004096959
申请日：2004-03-29
申请人： Sanyo Electric Co Ltd , 三洋電機株式会社
发明人： KATO ATSUSHI
IPC分类号： H01L25/00 , H01C1/14 , H01L21/48 , H01L21/52 , H01L23/02 , H01L23/12 , H01L23/31 , H01L23/48 , H01L23/488 , H01L23/538 , H01L25/16 , H05K1/02 , H05K1/18 , H05K3/06 , H05K3/28 , H05K3/32
CPC分类号： H05K1/0231 , H01L21/4832 , H01L23/3107 , H01L23/3128 , H01L23/5387 , H01L24/45 , H01L24/48 , H01L25/16 , H01L25/165 , H01L2224/05554 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48195 , H01L2224/48247 , H01L2224/48265 , H01L2224/73265 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/07802 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19104 , H01L2924/19105 , H01L2924/30107 , H05K1/185 , H05K3/06 , H05K3/284 , H05K3/328 , H05K2201/10636 , H05K2203/0369 , H05K2203/049 , H05K2203/1476 , Y02P70/611 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a circuit device by which a wiring density is especially improved, and to provide its manufacturing method with regard to the circuit device including a passive element and its manufacturing method. SOLUTION: The electrode 7 of the passive element 6 is plated with gold plating, and a bonding wire 8 is directly stuck to the electrode 7 by which a packaging density is improved. Moreover, an increase in thickness of a package is suppressed even in such constitution as the bonding wire 8 is stuck by bonding the passive element 6 to an isolation trench employing a package structure with no support substrate used. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种特别提高布线密度的电路装置，并提供其关于包括无源元件的电路装置及其制造方法的制造方法。解决方案：无源元件6的电极7镀金，并且接合线8直接粘附到电极7上，由此提高了封装密度。此外，即使在通过使用不使用支撑衬底的封装结构将无源元件6接合到隔离沟槽的情况下，也可以抑制接合线8被粘合的结构，从而抑制封装的厚度增加。版权所有（C）2006，JPO＆NCIPI

44. 发明专利

JP2004095633A Surface-mount electronic component module and method for manufacturing same 有权
标题翻译：表面安装电子元件模块及其制造方法
公开(公告)号：JP2004095633A
公开(公告)日：2004-03-25
申请号：JP2002251257
申请日：2002-08-29
申请人： Fujitsu Media Device Kk , 富士通メディアデバイス株式会社
发明人： FURUKAWA OSAMU , MURATA TOSHIHIKO , IGATA OSAMU
IPC分类号： H01L25/18 , H01L21/98 , H01L25/04 , H01L25/065 , H01L25/16 , H03H3/08 , H03H9/64
CPC分类号： H01L25/50 , H01L24/45 , H01L24/97 , H01L25/0655 , H01L25/165 , H01L2224/05554 , H01L2224/16 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48195 , H01L2224/73265 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/07802 , H01L2924/10329 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/20753 , H01L2924/30107 , H01L2924/3011 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/0401
摘要： PROBLEM TO BE SOLVED: To provide a surface-mount electronic component module which is equipped with a necessary inductance element, can be made small, short, and lightweight, and is increased in the degree of freedom of mounting position of electronic component elements on a wiring board. SOLUTION: The surface-mount electronic component module includes a wiring board having wiring patterns formed on one side and external connection terminals formed on the other side, and the wiring patterns and the external connection terminals connected with each other by via holes or through holes; a plurality of electronic component elements mounted on the one side of the wiring board; and an exterior resin layer formed on the wiring board which covers the plurality of electronic component elements, wherein at least one of the plurality of electronic component devices is fastened with its face up on the one side of the wiring board, the connection terminal of the electronic component device fastened face up, and the wiring pattern or the connection terminal of another electronic component element connected with each other with a wire. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：为了提供一种配备有必要的电感元件的表面安装电子部件模块，可以制造成小，短且重量轻，并且电子部件的安装位置的自由度增加元件在接线板上。解决方案：表面安装电子部件模块包括布线板，其布线图案形成在一侧，形成在另一侧的外部连接端子，布线图案和外部连接端子通过通孔连接，通孔; 安装在所述布线板一侧的多个电子元件元件; 以及形成在覆盖所述多个电子元件的所述布线基板上的外部树脂层，所述多个电子部件装置中的至少一个在所述布线基板的一侧面朝上地被固定，所述连接端子电子部件装置正面朝上，另一个电子元件的连接端子与导线连接。版权所有（C）2004，JPO

45. 发明专利

JP2004056082A Wiring board and its manufacturing method 审中-公开
标题翻译：接线板及其制造方法
公开(公告)号：JP2004056082A
公开(公告)日：2004-02-19
申请号：JP2003053107
申请日：2003-02-28
申请人： Ngk Spark Plug Co Ltd , 日本特殊陶業株式会社
发明人： WASHINO JUNICHI
IPC分类号： H01L23/12 , H01L23/36 , H01L23/40
CPC分类号： H01L24/29 , H01L24/32 , H01L24/73 , H01L2224/29186 , H01L2224/32245 , H01L2224/48 , H01L2224/48195 , H01L2224/73265 , H01L2924/1306 , H01L2924/14 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a wiring board and its manufacturing method by which electronic components can be reliably mounted on a heatsink by brazing the board on the surface of the heatsink and making the bottom of cavities positioned in the inside of the board flat. SOLUTION: The wiring board is provided with the heatsink 2 having a surface 3 and a reverse surface 4, a brazing material layer 25 which is formed on the surface 3 of the heatsink 2 with a uniform thickness and the board 6 which is fixed onto the surface of the brazing material layer 25 and has the cavity 10 from the inside of which the brazing material layer 25 is exposed. The board 6 constitutes the wiring board 1 which includes a plurality of insulating layers 8 and wiring layers 12 and 14 formed therebetween. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：为了提供一种布线板及其制造方法，通过使电子部件能够可靠地安装在散热器上，将基板钎焊在散热器的表面上，并使空腔的底部位于平板解决方案：布线板设置有具有表面3和反面4的散热器2，在散热器2的表面3上形成均匀厚度的钎料层25，并且板6是固定在钎焊材料层25的表面上，并且从其内部暴露出钎料层25的腔体10。板6构成布线板1，其包括多个绝缘层8和形成在其间的布线层12和14。版权所有（C）2004，JPO

46. 发明专利

JPS6126232A High-frequency power amplifier 失效
标题翻译：高频功率放大器
公开(公告)号：JPS6126232A
公开(公告)日：1986-02-05
申请号：JP14524684
申请日：1984-07-14
申请人： Oki Electric Ind Co Ltd
发明人： OSAWA OSAMU
IPC分类号： H01L21/822 , H01L23/64 , H01L27/01 , H01L27/04
CPC分类号： H01L23/645 , H01L27/013 , H01L2224/48 , H01L2224/48195 , H01L2224/49 , H01L2224/49171 , H01L2224/49175 , H01L2924/30107 , H01L2924/00 , H01L2924/00012
摘要： PURPOSE:To prevent the coupling in the space among wires by a method wherein the titled device is formed by providing a substrate with a slender thick film pattern which folds in zigzag form and has guide grooves for wire bonding at required intervals. CONSTITUTION:The thick film pattern of L4(1) is lengthened over full length by zigzag-folded structure and obtains a large inductance by making the whole area remain as conventional. Thereby, an L4(2) wire can be made as small as possible, and an amplifier which does not generate oscillation with L4 inductance values equal to the conventional case can be enlarged in band. Further, in order to eliminate the variability of wide band characteristic, grooves (d) located at required intervals are provided to the L4(1) pattern and made as the reference point for obtaining a necessary L4 inductance, and L4(1)+L4(2) is adjusted at a desired value by connecting them through arbitrary selection corresponding to characteristics. This construction improves the characteristic of wide band and the power efficiency by removing the oscillation of the high frequency amplifier, then reducing the consumed power.
摘要翻译：目的：为了防止电线之间的耦合，其中通过提供一种以锯齿形折叠的细长厚膜图案并以所需间隔进行引线接合的导槽，形成标题装置。构成：L4（1）的厚膜图案通过Z字形折叠结构在全长上延长，通过使整个区域保持常规，获得大的电感。因此，可以使L4（2）线尽可能小，并且不能产生与常规情况相同的L4电感值不产生振荡的放大器可以被扩大。此外，为了消除宽带特性的变化，以L4（1）图形提供位于所需间隔的槽（d），并作为用于获得必需的L4电感的参考点，并且L4（1）+ L4 （2）通过对应于特性的任意选择将它们连接到期望值。该结构通过去除高频放大器的振荡，从而提高了宽带的特性和功率效率，从而降低了功耗。

49. 发明专利

JP6299857B2 光モジュール及びデジタルコヒーレントレシーバ有权
公开(公告)号：JP6299857B2
公开(公告)日：2018-03-28
申请号：JP2016505024
申请日：2015-02-10
申请人：日本電気株式会社
发明人：金子太郎
IPC分类号： H01L31/02 , H01L31/0232
CPC分类号： G01J1/46 , G02B6/00 , G02B6/32 , G02B6/42 , G02B6/4206 , H01L31/02005 , H01L31/02019 , H01L31/0203 , H01L31/0232 , H01L31/02325 , H01L2224/48091 , H01L2224/48111 , H01L2224/48195 , H01L2924/00014

50. 发明专利

JP2018023043A 電力増幅装置、半導体集積回路および電力増幅装置の制御方法审中-公开
公开(公告)号：JP2018023043A
公开(公告)日：2018-02-08
申请号：JP2016153953
申请日：2016-08-04
申请人：富士通株式会社
发明人：西森理人 , 廣瀬達哉 , 曽我育生 , 細田雅之 , 今田忠紘
IPC分类号： H03F3/24 , H03F1/07
CPC分类号： H03F3/195 , H01L23/66 , H01L2223/6611 , H01L2223/6655 , H01L2223/6666 , H01L2223/6672 , H01L2224/48195 , H01L2224/48247 , H01L2224/49175 , H01L2924/30107 , H01L2924/30111 , H03F1/0288 , H03F1/30 , H03F1/301 , H03F2200/447 , H03F2200/451 , H03F2200/481 , H03G3/3042
摘要：【課題】簡単な構成で主増幅器および補助増幅器の出力を合成するときの合成損失を低減することができる電力増幅装置、半導体集積回路および電力増幅装置の制御方法の提供を図る。【解決手段】入力電力RFinを増幅する主増幅器1と、前記入力電力が所定レベルを超えたときに前記入力電力を増幅する補助増幅器2と、前記主増幅器のソースとグラウンド間に設けられ、前記入力電力が所定の値以上になったとき、前記主増幅器1のソース電位が増加するように制御する制御回路5と、を有する。【選択図】図3

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