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41. 发明专利

JP4387010B2 Cutting machine 有权
公开(公告)号：JP4387010B2
公开(公告)日：2009-12-16
申请号：JP31978199
申请日：1999-11-10
申请人：株式会社ディスコ
发明人：圭三関家
IPC分类号： B25H3/02 , H01L21/301 , B23D59/00 , B23D61/02 , B23Q3/155 , B24B7/22 , B24B51/00 , B24D7/02 , H01L21/304
CPC分类号： B23Q3/15546 , B23D59/002 , B23D61/025 , B24B7/228 , B24B51/00 , B24D7/02

42. 发明专利

JP2009255284A Machine to polish dice and method 审中-公开
标题翻译：抛光机和方法
公开(公告)号：JP2009255284A
公开(公告)日：2009-11-05
申请号：JP2009069430
申请日：2009-03-23
申请人： Danobat S Coop , ダノバット、エス. コープ
发明人： ARAMBURU LASA ANDONI
IPC分类号： B24B19/20 , B24B5/48 , B24B41/06 , B24B47/20
CPC分类号： B24B3/60 , B24B19/00 , B24B51/00 , G05B19/4103 , G05B2219/45161 , G05B2219/49118
摘要： PROBLEM TO BE SOLVED: To provide a machine to polish a dice of a complicated shape.
SOLUTION: This machine to polish the dice has four axes (BO axis, CO axis, X axis, Z axis) to move for interpolation, and the working axis (CO axis) of a plate 2.1 having a fixing device 3 to fix the dice 1 is controlled at all points of its angle movement. Consequently, it is possible to move the axis of the rotating plate 2.1 to interpolate the movement of the working axis (CO axis) against the rotating axis (BO axis) and to move a polishing axis (S1 axis) to interpolate the respective axes (X axis, Z axis).
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种抛光复杂形状的骰子的机器。
解决方案：本机抛光骰子具有四个轴（BO轴，CO轴，X轴，Z轴）移动用于插补，并且具有定影装置3的板2.1的工作轴（CO轴）固定骰子1在其角度运动的所有点被控制。因此，可以使旋转板2.1的轴线移动以内插相对于旋转轴线（BO轴）的工作轴线（CO轴）的移动并移动抛光轴线（S1轴）以内插各轴线 X轴，Z轴）。版权所有（C）2010，JPO＆INPIT

43. 发明专利

JP2008277450A Device and method for controlling polishing condition of cmp apparatus 审中-公开
标题翻译：用于控制CMP装置抛光条件的装置和方法
公开(公告)号：JP2008277450A
公开(公告)日：2008-11-13
申请号：JP2007117544
申请日：2007-04-26
申请人： Tokyo Seimitsu Co Ltd , 株式会社東京精密
发明人： YOKOYAMA TOSHIYUKI , FUJITA TAKASHI , TANAKA KATSUNORI
IPC分类号： H01L21/304 , B24B37/07 , B24B49/04
CPC分类号： B24B37/005 , B24B49/12 , B24B51/00
摘要： PROBLEM TO BE SOLVED: To improve polishing efficiency, reducing a running cost, and improve yield, by eliminating variation in residual film thickness of a wafer. SOLUTION: A CMP apparatus 1 consists of a polishing recipe generating means 3 for generating an optimum polishing condition for polishing speed, polishing pressure, abrasives or the like of a wafer, a residual film thickness predicting means 4 which predicts a residual film thickness after polishing of the wafer polished under the polishing condition, a residual film thickness measuring unit 2 for measuring the residual film thickness of the wafer after polishing, and a computer 6 for controlling polishing the condition based on the measuring result of residual film thickness. The computer 6 comprises a calculation part 11 which calculates a difference between the measurement value of the residual film thickness and the predicted value, and a polishing condition correcting/changing part 13 which corrects/changes the polishing condition so that the calculated difference becomes minimum. Thus, correction/change of the polishing condition is performed in real time. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：通过消除晶片的残留膜厚度的变化，提高抛光效率，降低运行成本并提高产量。解决方案：CMP设备1由用于产生晶片的抛光速度，抛光压力，磨料等的最佳抛光条件的抛光配方生成装置3，残留膜厚预测装置4，其预测残留膜研磨抛光后的晶片研磨后的厚度，用于测定研磨后的晶片残留膜厚的残留膜厚测定单元2，以及基于残留膜厚的测定结果来控制抛光状态的计算机6。计算机6包括计算残留膜厚度的测量值与预测值之间的差的计算部分11以及校正/改变抛光条件使得计算的差值变得最小的抛光条件校正/改变部分13。因此，实时地进行研磨条件的校正/变更。版权所有（C）2009，JPO＆INPIT

44. 发明专利

JP2008173715A Grinding method of disk-shaped substrate and grinding device 有权
标题翻译：盘形基片和研磨装置的研磨方法
公开(公告)号：JP2008173715A
公开(公告)日：2008-07-31
申请号：JP2007008860
申请日：2007-01-18
申请人： Citizen Seimitsu Co Ltd , Showa Denko Kk , シチズンセイミツ株式会社 , 昭和電工株式会社
发明人： HANEDA KAZUYUKI , FUJINAMI SATOSHI
IPC分类号： B24B5/12
CPC分类号： B24B9/065 , B24B1/00 , B24B51/00
摘要： PROBLEM TO BE SOLVED: To provide a grinding method of a disk-shaped substrate, which can enhance the concentricity of an internal periphery and an external periphery in grinding the external periphery and the internal periphery of a disk-shaped substrate, and to provide a grinding device for use in the method.
SOLUTION: The grinding method of the disk-shaped substrate 10 is intended for grinding the disk-shaped substrate 10 having an opening at the center while rotating the same. While an internal peripheral grindstone 31 is fed in an external peripheral direction (C direction), the internal periphery 12 of the disk-shaped substrate 10 is ground, and while an external peripheral grindstone 51 is fed in an internal peripheral direction (A direction), the external periphery 13 of the disk-shape substrate 10 is ground. Then feeding of the internal peripheral grindstone 31 and feeding of the external peripheral grindstone 51 are almost simultaneously stopped.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种盘状基板的研磨方法，其可以提高研磨盘状基板的外周和内周的内周和外周的同心度，以及以提供用于该方法的研磨装置。解决方案：盘状基板10的研磨方法用于在旋转中心的同时研磨具有中心开口的盘形基板10。在沿外周方向（C方向）供给内周磨石31的同时，对盘状基板10的内周12进行研磨，在外周磨石51沿内周方向（A方向）供给的同时，，盘状基板10的外周13被研磨。然后，内周磨石31的供给和外周磨石51的供给几乎同时停止。版权所有（C）2008，JPO＆INPIT

45. 发明专利

JP2008087100A Eyeglass lens processing method and eyeglass lens processing system 有权
标题翻译：眼镜镜片加工方法和眼镜镜片加工系统
公开(公告)号：JP2008087100A
公开(公告)日：2008-04-17
申请号：JP2006270120
申请日：2006-09-29
申请人： Nidek Co Ltd , 株式会社ニデック
发明人： TANAKA MOTOJI , SHIBATA RYOJI , YAMAMOTO TAKAYASU
IPC分类号： B24B9/14
CPC分类号： B24B51/00 , B24B9/148
摘要： PROBLEM TO BE SOLVED: To transmit the modification data of a lens shape from an optician shop side to a factory side easily, and to process the eyeglass lens of the modified lens shape appropriately.
SOLUTION: In this eyeglass lens processing method, processing information is transmitted from a transmission terminal device at the optician shop through a network communication, and the periphery of the eyeglass lens is processed based on the transmitted information at the processing side. The transmitted information includes the data on the directions of the modification in vertical and horizontal directions and the modification amount as modification data for modifying the original lens shape of the eyeglass lens attached to a rimless frame, and a frame specifying information specifying the rimless frame. On the processing side, the original lens shape data is called from a database based on the transmitted frame specifying information, and the lens shape after the modification is calculated based on the data on the original lens shape, and the data on the directions of the modification and the modification amount, thereby processing the periphery of the eyeglass lens.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：将透镜形状的修改数据从眼镜商店侧容易地发送到出厂侧，并且适当地处理改型透镜形状的眼镜镜片。解决方案：在该眼镜镜片处理方法中，通过网络通信从眼镜商店的发送终端装置发送处理信息，并且基于处理侧的发送信息来处理眼镜镜片的周边。所发送的信息包括关于垂直和水平方向上的修改的方向的数据和作为修改附接到无框架的眼镜镜的原始镜片形状的修改数据的修改量以及指定无框架的帧指定信息。在处理侧，基于所发送的帧指定信息从数据库调用原始透镜形状数据，并且基于关于原始透镜形状的数据和关于原始透镜形状的数据的数据来计算修改之后的透镜形状修改和修改量，从而处理眼镜镜片的周边。版权所有（C）2008，JPO＆INPIT

46. 发明专利

JP4034848B2 Eyeglass lens grinding apparatus 失效
公开(公告)号：JP4034848B2
公开(公告)日：2008-01-16
申请号：JP12787797
申请日：1997-04-30
申请人：株式会社ニデック
发明人：俊昭水野
IPC分类号： B24B9/14 , B24B47/22 , B24B51/00
CPC分类号： B24B51/00 , B24B9/148 , B24B47/225

47. 发明专利

JP2007531929A Flexible process optimizer 审中-公开
公开(公告)号：JP2007531929A
公开(公告)日：2007-11-08
申请号：JP2006551112
申请日：2005-01-06
申请人：エイエヌアール,エル.ピー.
发明人：バテジャ，チャンダー，ピー． , バテジャ，ラジブ，ケー．
IPC分类号： G05B19/418 , B24B51/00 , G01D18/00 , G05B15/02 , G05B23/02
CPC分类号： B24B51/00 , G05B13/024 , G05B23/0235 , G07C3/005 , G07C3/146
摘要：【課題】
【解決手段】製造プロセスの効率を改善するための様々なパラメータを記録し分析するためのフレキシブルプロセスオプティマイザ。このフレキシブルプロセスオプティマイザは、製造機械に装填されている様々なトランスから信号を得て調整する。質的及び量的なデータ分析にもかかわらず、改良が認識される必要がある製造プロセスの特定の態様が認識される。質的な評価は、センサデータによって取り出される製造サイクルの存在、欠如あるいはある特徴の期間を見ている。データの量的な評価は、あるデータの属性のコンピュータ化を含む。有用なデータの転移とデータ分析ツールを提供することによって、改良された効率を提供するために製造プロセスのパラメータに必要な調整がなされる。変更の結果は、フレキシブルプロセスオプティマイザを用いて、即座に認証できる。
【選択図】図１

48. 发明专利

JP2007260850A Flattening device of semiconductor substrate and flattening method 有权
标题翻译：半导体衬底的平坦化装置和平坦化方法
公开(公告)号：JP2007260850A
公开(公告)日：2007-10-11
申请号：JP2006090114
申请日：2006-03-29
申请人： Okamoto Machine Tool Works Ltd , 株式会社岡本工作機械製作所
发明人： KASHIWA MORIYUKI , OKONOGI HIROTAKA , KOBAYASHI KAZUO
IPC分类号： B24B7/00 , B24B37/04 , H01L21/304
CPC分类号： B24B37/04 , B24B7/228 , B24B41/005 , B24B51/00
摘要： PROBLEM TO BE SOLVED: To provide a substrate flattening device compact in foot print, which is thins and flattens a substrate by grinding, polishing and working a back surface of the semiconductor substrate in high throughput. SOLUTION: The substrate flattening device 10 is provided with: a grinding work stage 20 furnished with a substrate storage stage 13 indoor and arranging substrate holders 30a, 30b, 30c of a member constituting an articulated type carrier robot 14, a temporary placing base 15 for positioning, a moving carrier pad 16 and three stages of a substrate loading/unloading stage S 1 , rough grinding stage S 2 and, a finishing grinding stage S 3 , on a concentric circle on a first index type rotating table 2 on a base 11 indoor; and a polishing work stage 70 arranging a substrate holder table 70a constituting a substrate loading/unloading finishing polishing stage ps 1 , and a substrate holder table 70b constituting a rough polishing stage ps 2 on a concentric circle on a second index type rotating table 71. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种脚印印刷用基板平整装置，通过以高通量研磨，研磨和加工半导体基板的背面，使基板成形和平坦化。＆lt; P＆gt;解决方案：基板平整装置10设置有：在室内设置有基板收纳台13的研磨工作台20，并且构成构成铰接式托架机器人14的构件的基板保持件30a，30b，30c，临时放置用于定位的基座15，移动的载体垫16和基底装载/卸载台S＆lt; SB＆gt;，粗磨阶段S＆lt; SB＆gt; 2＆gt;的三个阶段， SB> 3 ，在室内的基座11上的第一折射型旋转台2上的同心圆上; 以及布置构成基板装载/卸载精整抛光台ps 1的基板保持台70a的抛光工作台70和构成粗抛光台ps 2 的基板保持台70b >在第二指数型旋转台71上的同心圆上。版权所有：（C）2008，JPO＆INPIT

49. 发明专利

JP3846706B2 Polishing method and polishing apparatus of the wafer outer periphery chamfered portion 有权
公开(公告)号：JP3846706B2
公开(公告)日：2006-11-15
申请号：JP2001561485
申请日：2001-02-21
申请人：信越半導体株式会社
发明人：仲寿三浦 , 和弥冨井 , 一寿水島 , 鈴木　　誠 , 靖弘関根
IPC分类号： B24B9/00 , B24B9/06 , B24B29/00 , B24B37/00 , B24B37/20 , B24B37/24 , B24B51/00 , B24D5/14 , B24D9/04 , H01L21/304
CPC分类号： H01L21/02021 , B24B9/065 , B24B51/00 , B24D5/14 , B24D9/04

50. 发明专利

JP2006167872A Grinding method and grinder 有权
标题翻译：研磨方法和研磨
公开(公告)号：JP2006167872A
公开(公告)日：2006-06-29
申请号：JP2004364546
申请日：2004-12-16
申请人： Jtekt Corp , 株式会社ジェイテクト
发明人： WAKAZONO YOSHIO
IPC分类号： B24B49/16 , B24B5/02 , B24B47/02
CPC分类号： B24B51/00 , B24B1/00
摘要： PROBLEM TO BE SOLVED: To provide an environmental corresponding type energy-saving grinding method reducing consuming energy quantity by shortening the working time until finishing from starting of workpiece grinding work and a grinder.
SOLUTION: An emery wheel is positioned by displacing it at least between first and second grinding regions by setting at least the first and second grinding regions of the workpiece at a grinding step to grind by the emery wheel and power consumed by the grinder at a level larger than a prescribed level for a prescribed period of time by setting the power consumed by the grinder at the prescribed level and moving a movable body for the prescribed period of time specified in accordance with the large level.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种环境相应型节能研磨方法，通过缩短工作时间直到完成工件研磨作业和研磨机的开始，从而降低消耗能量。解决方案：通过在研磨步骤中至少设置工件的第一和第二磨削区域以至少在第一和第二磨削区域之间移动金刚砂轮来定位金刚砂轮，以通过砂轮研磨和研磨机消耗的功率通过将研磨机所消耗的功率设定在规定水平，并将可移动体移动达到规定时间长度规定的规定时间，在规定时间以上的水平达到规定水平。版权所有（C）2006，JPO＆NCIPI

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