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    • 50. 发明专利
    • COMPOSITION FOR FIXING METALLIC POWDER MOLDING DURING SINTERING
    • JPS60230913A
    • 1985-11-16
    • JP8696684
    • 1984-04-30
    • NITTO ELECTRIC IND CO
    • SAKURAMOTO TAKAFUMIKOJIMA MAKOTOTOMINAGA TAKASHIASOSHINA HIDESHI
    • B22F7/04B22F7/02
    • PURPOSE:To prevent a metallic powder molding consisting of metallic powder and synthetic resin binder from exfoliating from a base material surface during sintering in the stage of forming a sintered metallic layer on the surface of the metallic base material of said metallic powder molding by using a specifically composed compsn. for fixing. CONSTITUTION:The sheet-shaped metallic molding consisting of wear-resistant metallic powder and acrylic resin binder is adhered to the surface of the metallic base material to 0.5-5mm. thickness and is sintered in a non-oxidizing atmosphere. The polyimide soln. compsn. formed by compounding an epoxy compd. having >=2 epoxy groups on one molecule with an org. solvent soln. of the polyimide precursor consisting of the polyamide acid synthesized of the tetracarboxylic dianhydride consisting of 10-90mol% aliphat. tetracarboxylic dianhydride and 90-10mol% arom. tetracarboxylic dianhydride and org. diamine or the polyamide acid imide formed by partial conversion to amide thereof in such a way that the epoxy groups are incorporated at >=0.3 equiv. by 1 equiv. acid group of the above-mentioned precursor is coated and interposed between the base material and metallic powder powder molding in the above-mentioned stage.