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41. 发明专利

JP2001096668A METHOD FOR MANUFACTURING LAMINATE 失效
公开(公告)号：JP2001096668A
公开(公告)日：2001-04-10
申请号：JP30052999
申请日：1999-10-22
申请人： MATSUSHITA ELECTRIC WORKS LTD
发明人： HIRATA ISAO , OKADA SHIGEHIRO , NOZUE AKIYOSHI , ITO NOBUYUKI
IPC分类号： H05K1/03 , B32B17/04 , C08J5/24
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a laminate plate which does not cause warpage and shows good solder heat resistance. SOLUTION: A method for manufacturing a composite type laminate plate comprises a step of continuously laminating glass fabrics impregnated with a thermosetting resin on both surfaces of a non-woven glass fabric while the continuously fed glass fabric is impregnated with the thermosetting resin composition containing a filler and a step of pressing and heating the laminate with a roll wherein the thermosetting resin composition further contains 0.05 to 5 wt.% of a wet dispersing agent based on the filler, the amount of the filler being 100 to 250 pts.wt. based on the 100 pts.wt. of the thermosetting resin. Another method for manufacturing a composite type laminate plate comprises a step of continuously laminating glass fabrics impregnated with a thermosetting resin on both surfaces of a non-woven glass fabric while the continuously fed glass fabric is impregnated with the thermosetting resin composition containing a filler and a step of pressing and heating the laminate with a roll wherein the thermosetting resin composition further contains 0.05 to 5 wt.% of the wet dispersing agent based on the filler, the amount of the filler being 10 to 100 pts.wt. based on the 100 pts.wt. of the thermosetting resin.

42. 发明专利

JP2000286531A MANUFACTURE OF PRINTED WIRING BOARD 失效
公开(公告)号：JP2000286531A
公开(公告)日：2000-10-13
申请号：JP9111999
申请日：1999-03-31
申请人： MATSUSHITA ELECTRIC WORKS LTD
发明人： MORIOKA KAZUNOBU , OGAWA SATORU , TAKAGI KOJI , HIRATA ISAO , KANETANI DAISUKE , IHARA KIYOAKI
IPC分类号： H05K3/06 , C23F1/16 , H05K3/18
摘要： PROBLEM TO BE SOLVED: To manufacturing a printed wiring board with an improve circuit shape by the semi-additive method by setting etching liquid for eliminating a first metal covering by etching to chemical reaction speed-control type etching liquid. SOLUTION: A plating catalyst 2 is given to the surface of an insulation substrate 1. Then, electroless plating is made with the plating catalyst 2 as a nucleus, and a thin, first metal covering 3 is formed on the entire surface of the insulation substrate 1. Then, a resist covering 4 is formed at a part excluding a part where a circuit is scheduled to be formed out of the surfaces of the first metal covering 3, then the first metal covering 3 is energized for performing electrical plating, and then a second metal covering 5 is formed on the surface of a part where the first metal covering 3 is exposed. Then, after the resist covering 4 is eliminated, the first metal covering 3 is eliminated by etching. In that case, by using chemical reaction speed-control type etching liquid, the surface of the second metal covering 5 can be etched nearly uniformly even if etching is made to the extent that the first metal covering 3 is eliminated.

43. 发明专利

JPH115826A EPOXY RESIN COMPOSITION FOR BUILD-UP 失效
公开(公告)号：JPH115826A
公开(公告)日：1999-01-12
申请号：JP7997498
申请日：1998-03-26
申请人： MATSUSHITA ELECTRIC WORKS LTD
发明人： FUJIWARA HIROAKI , EZAKI YOSHIAKI , TAKAGI KOJI , IKETANI SHINICHI , FUJIMORI SHOICHI , HIRATA ISAO , IHARA KIYOAKI , MAEDA SHUJI , OGAWA SATORU , NAKAGAWA YOSHIHIRO , ISHIHARA MASAYUKI
IPC分类号： C08L21/00 , C08G59/32 , C08G59/50 , C08L63/00 , H05K1/00 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To obtain the subject composition useful as an electric insulating resin for a circuit board such as a multilayer printed wiring board, by including a specific trifunctional epoxy resin, a curing agent, a curing promoter and a leveling agent. SOLUTION: This composition comprises an epoxy resin containing a trifunctional epoxy resin of formula I (R1 to R8 are each independently 1-8C alkyl, H, etc.), a curing agent (especially selected from a polyhydric phenol containing two or more phenolic OHs in one molecule and an aromatic amine compound of formula II containing two or more amine groups in one molecule), a curing promoter (especially an imidazole compound) and a leveling agent (selected from a fluorine-based or a silicone-based surfactants) and optionally 3-30 pts.wt. based on 100 pts.wt. of the epoxy resin solid content of a rubber and 1-300 pts.wt. of an inorganic and/or organic filter and has preferably 10-10,000 cPs viscosity at 25 deg.C.

44. 发明专利

JPH10335785A CIRCUIT FORMATION METHOD 失效
公开(公告)号：JPH10335785A
公开(公告)日：1998-12-18
申请号：JP14043997
申请日：1997-05-29
申请人： MATSUSHITA ELECTRIC WORKS LTD
发明人： IHARA KIYOAKI , TAKAGI KOJI , IKETANI SHINICHI , FUJIMORI SHOICHI , HIRATA ISAO , FUJIWARA HIROAKI , MAEDA SHUJI , OGAWA SATORU , NAKAGAWA YOSHIHIRO , ISHIHARA MASAYUKI
IPC分类号： H05K3/18 , H05K3/24 , H05K3/38
摘要： PROBLEM TO BE SOLVED: To provide a circuit forming method which forms a conductive circuit on a substrate and is hard to generate a residue of plating resist when the plating resist is separated. SOLUTION: As a process when forming a conductive circuit 50 on a substrate 10 having a face 11 which is roughed with resin, there are provided (1) a process of forming a first power supply layer 21 by electroless plating, (2) a process of forming a second power supply layer 30 by electric plating, (3) a process of forming patterns 40 using plating resist, (4) a process of performing electric plating on the power supply layer exposed, (5) a process of separating the plating resist and (6) a process of removing the power supply layer in a portion where the plating resist is separated by etching. Further, a thickness of the second power supply layer 30 is 0.5 to 10 μm.

45. 发明专利

JPH10326964A MANUFACTURE OF MULTILAYERED WIRING BOARD 失效
公开(公告)号：JPH10326964A
公开(公告)日：1998-12-08
申请号：JP13366297
申请日：1997-05-23
申请人： MATSUSHITA ELECTRIC WORKS LTD
发明人： HIRATA ISAO , TAKAGI KOJI , IKETANI SHINICHI , FUJIMORI SHOICHI , FUJIWARA HIROAKI , IHARA KIYOAKI , MAEDA SHUJI , OGAWA SATORU , NAKAGAWA YOSHIHIRO , ISHIHARA MASAYUKI
IPC分类号： B05D5/12 , B05C5/00 , B05D7/00 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a method wherein guide holes of a board can be effectively closed before liquid resin is spread, and objects closing the guide holes can be effectively detached after an insulating resin layer is formed, regarding a manufacturing method of a build-up system of a multilayered wiring board wherein the liquid resin is spread by using a curtain coater on a surface, on which a conducting circuit is formed in the state that the guide holes of the board are closed and the insulating resin layer is formed by curing. SOLUTION: A board holding table 4 has pins 11 capable of engaging with guide holes 3 at positions corresponding to the guide holes 3 of a board 1. After the guide holes 3 are closed by engaging the pins 11 with the guide holes 3 of the board 1, liquid resin 6 is spread by using a curtain coater 5. In another way, after the guide holes of the board are closed by using silicon rubber plugs or clamping tools, the liquid resin is spread by using the curtain coater.

46. 发明专利

JPH10287981A ELECTROLESS NICKEL PLATING METHOD 失效
公开(公告)号：JPH10287981A
公开(公告)日：1998-10-27
申请号：JP9934297
申请日：1997-04-16
申请人： MATSUSHITA ELECTRIC WORKS LTD
发明人： IHARA KIYOAKI , TAKAGI KOJI , IKETANI SHINICHI , FUJIMORI SHOICHI , HIRATA ISAO , FUJIWARA HIROAKI , MAEDA SHUJI , OGAWA SATORU , NAKAGAWA YOSHIHIRO , ISHIHARA MASAYUKI
IPC分类号： C23C18/31 , C23C18/32 , H05K3/18
摘要： PROBLEM TO BE SOLVED: To provide an eletroless nickel plating method by which the skipping of plating that a plating film is not formed is suppressed in the electroless plating. SOLUTION: When a flat sheet-shaped material 1 to be plated is electroless- plated with nickel, the material 4 is intermittently dipped in the plating soln. 5 in an electroless nickel plating tank 6, and the material 1 is oriented toward the plane crossing the moving path of the air bubble 4 generated from an air bubbling device 3 in the plating tank 6 when dipped in the plating soln. 5. Further, in this electroless nickel plating method, an oscillation parallel to the moving path of the air bubble 4 is applied to the material 1 in the plating soln. 5.

47. 发明专利

JPH07240117A COMPOSITE DIELECTRIC AND ITS MANUFACTURE 失效
公开(公告)号：JPH07240117A
公开(公告)日：1995-09-12
申请号：JP2777494
申请日：1994-02-25
申请人： MATSUSHITA ELECTRIC WORKS LTD
发明人： NOZUE AKIYOSHI , HIRATA ISAO , TSUZAKI MICHIMASA , YAMAKAWA SEISHIRO
IPC分类号： H01B3/00 , H05K1/03
摘要： PURPOSE:To improve the moisture resistance of a composite dielectric consisting of an inorganic powder, a fluororesin and an inorganic fiber base material by covering the inorganic powder with an inorganic film mainly containing silica, and treating its surface with a specified coupling agent. CONSTITUTION:An inorganic powder having a specific dielectric constant of 2.0 or more is covered with an inorganic film mainly containing silica, and its surface is treated with a phenyl silane and/or fluorine silane coupling agent. A composite dielectric consisting of the surface-treated inorganic powder, a fluorine resin and an inorganic fiber base material is improved in the adhesion between the inorganic powder and the fluororesin, and minimized in change of electric characteristic such as dielectric tangent by moisture absorbing treatment.

48. 发明专利

JPH06188529A CIRCUIT BOARD 失效
公开(公告)号：JPH06188529A
公开(公告)日：1994-07-08
申请号：JP33925592
申请日：1992-12-18
申请人： MATSUSHITA ELECTRIC WORKS LTD
发明人： HIRATA ISAO , TSUZAKI MICHIMASA , YAMAKAWA SEISHIRO , KOMORI KIYOTAKA
IPC分类号： H01L23/15 , H05K1/03
摘要： PURPOSE:To facilitate fibrillation while increasing permittivity by employing a specific resin and inorganic dielectric particles while specifying the composition of high permittivity glass fiber in a circuit board reinforced by the high permittivity glass fibers with the inorganic dielectric particles being dispersed into the resin. CONSTITUTION:A high permittivity glass fiber 1 contains 40 to 65mol.% of SiO2, 20 to 45mol.% of at least one of MgO, CaO, SrO, BaO, 5 to 25mol.% of at least one of TiO2, ZrO2, and 0.5 to 15mol.% of NbO5/2. The circuit board is composed of a glass composition having fibrillation fitness where the dielectric constant (1MHz, 25 deg.C) is 9 or above and the total quantity of these oxides is 85mol.% or above. Inorganic dielectric particles 4 subjected to surface treatment with a phenylsilane based coupling agent are also employed. When an appropriate quantity (0.5 to 15mol.%) of AlO3/2 is added simultaneously with NbO5/2, differential control between devitrification temperature and 10 poise temperature is conducted effectively.

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