专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2002160317A METHOD FOR MANUFACTURING METAL FOIL-CLAD LAMINATE AND METAL FOIL-CLAD LAMINATE 失效
公开(公告)号：JP2002160317A
公开(公告)日：2002-06-04
申请号：JP2000360423
申请日：2000-11-28
申请人： MATSUSHITA ELECTRIC WORKS LTD
发明人： HIRATA ISAO , OKADA SHIGEHIRO
IPC分类号： B29B11/16 , B29C43/28 , B29C43/30 , B32B5/28 , B32B15/14 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To provide a metal foil-clad laminate excellent in surface smoothness and free from occurrence of waviness, wherein long-sized woven glass fabrics 2 impregnated with a thermosetting resin composition are overlapped on outsides of long-sized nonwoven glass fabrics 1 impregnated with the thermosetting resin composition, and further, on outsides of the glass fabrics 2, long-sized metal foils on one side of which the thermosetting resin composition is coated are overlapped and continuously integrated, and also to provide a manufacturing method for the metal foil-clad laminate. SOLUTION: As characteristics of this manufacturing method and the metal foil-clad laminate manufactured by this method, viscosity of a second thermosetting resin composition B is made higher than that of a third thermosetting resin composition C. With a curing time of the thermosetting resin composition at a testing temperature of 100 deg.C, a curing time of the thermosetting resin composition B is made longer than that of the thermosetting resin composition C.

2. 发明专利

JP2000188483A PRODUCTION OF MULTILAYER PRINTED WIRING BOARD 失效
公开(公告)号：JP2000188483A
公开(公告)日：2000-07-04
申请号：JP36470598
申请日：1998-12-22
申请人： MATSUSHITA ELECTRIC WORKS LTD
发明人： IHARA KIYOAKI , HIRATA ISAO , KANETANI DAISUKE , TAKAGI KOJI , MORIOKA KAZUNOBU , OGAWA SATORU
IPC分类号： H05K3/00 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a method for producing a multilaler printed wiring board by so-called build-up method in which a multiplayer circuit pattern can be formed with high positional accuracy on all layers by enhancing the accuracy of exposing position in plating resist exposing process. SOLUTION: In a method for producing a multilaler printed wiring board by forming an insulating resin layer 6 and a circuit 7 sequentially on the surface of an innerlayer material 1, a laser marker 4 is formed on the surface of the insulating resin layer 6 after forming the insulating resin layer 6 before forming a circuit pattern. When a plating resist is exposed on the surface of the insulating resin layer 6, a mask pattern 8 is aligned with reference to the laser marker 4.

3. 发明专利

JPH118331A SEMICONDUCTOR DEVICE AND INTEGRATED SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH118331A
公开(公告)日：1999-01-12
申请号：JP15718997
申请日：1997-06-13
申请人： MATSUSHITA ELECTRIC WORKS LTD
发明人： HIRATA ISAO
IPC分类号： H01L23/12 , H01L25/10 , H01L25/11 , H01L25/18
摘要： PROBLEM TO BE SOLVED: To enhance reliability for connection of stacked semiconductor devices. SOLUTION: A through-hole is cut at such point as separated into almost halves, so a plurality of recessed parts 2 whose cross sections are almost semicircular are provided on a side end surface of a substrate 1, while an outer lead 3 is formed at each of the recessed parts 2. A counterbore part 4 is formed on the one side surface of the substrate 1, where an opening part 5 opened to both surfaces of the substrate 1 is provided. A circuit 6 connected to the outer lead 3 is formed on the surface of the substrate 1, on the side opposite to a surface where the counterbore part 4 is provided. A semiconductor element 7 is mounted on the counterbore part 4, and a wire 8 is bonded between the semiconductor element 7 and the circuit 6 through the opening part 5. While are semiconductor element 7 mounted in the counterbore part 4 does not protrude above the surface of the substrate 1, the connection between the outer loads 3 provided on the substrate 1, with the substrate 1 being directly jointed, allows the electrically connection of a semiconductor device which is loaded.

4. 发明专利

JPH118261A MANUFACTURE OF SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH118261A
公开(公告)日：1999-01-12
申请号：JP15719097
申请日：1997-06-13
申请人： MATSUSHITA ELECTRIC WORKS LTD
发明人： HIRATA ISAO , MORIOKA KAZUNOBU , IKETANI SHINICHI
IPC分类号： H05K3/40 , H01L21/60 , H01L23/12
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device in which the cutting yield of a through-hole is satisfactory, even when the plate thickness of a mother base material is thick, or even when a pitch between through-holes is narrow. SOLUTION: A device is provided with plural through-holes 20 formed by digging elliptical holes on a mother base material 22. A plating processing is conducted to the through-holes 20, and the mother base material 22 is cut along a line crossing the short diameter side of each through-hole 20. Thus, it is possible to obtain a semiconductor device A provided with an outer lead 10, formed when the through-hole 20 is cut at the edge part of a substrate 1. The area of an electrode formed by plating inside the through-hole 20 is increased. Even if the mother base material 22 is distorted at the time of cutting the mother base material 22, tearing off and peeling of the plating of the cut part of the through-hole 20 is made difficult to occur.

5. 发明专利

JPH10298771A ELECTROLESS NICKEL PLATING METHOD 失效
公开(公告)号：JPH10298771A
公开(公告)日：1998-11-10
申请号：JP10502197
申请日：1997-04-22
申请人： MATSUSHITA ELECTRIC WORKS LTD
发明人： IHARA KIYOAKI , TAKAGI KOJI , IKETANI SHINICHI , FUJIMORI SHOICHI , HIRATA ISAO , FUJIWARA HIROAKI , OGAWA SATORU , MAEDA SHUJI , NAKAGAWA YOSHIHIRO , ISHIHARA MASAYUKI
IPC分类号： C23C18/31 , C23C18/32 , H05K3/24
摘要： PROBLEM TO BE SOLVED: To provide an electroless nickel plating method that is a electroless nickel plating method of forming a resist film on the surface of an org. substrate having conductor circuits on the surface on the side having these conductor circuits, then immersing the substrate into an electroless nickel plating liquid to form nickel plating films, and that can avoid the formation of the parts not forming nickel plating films. SOLUTION: In this method for forming nickel plating films on the surfaces of the conductor circuits 11, the conductor circuits 11 are immersed into the first electroless nickel plating liquid 35 to form the first nickel plating film 30 on the surfaces of the conductor circuits 11 and thereafter, the conductor circuits are immersed into the second electroless nickel plating liquid 36 of the deposition rate of nickel higher than that of the first electroless nickel plating liquid 35, by which the second nickel plating films 31 are formed on the surfaces of the first nickel plating films 30.

6. 发明专利

JPH08231848A PRODUCTION OF PREPREG 失效
公开(公告)号：JPH08231848A
公开(公告)日：1996-09-10
申请号：JP3827395
申请日：1995-02-27
申请人： MATSUSHITA ELECTRIC WORKS LTD
发明人： YAMAMOTO HIROSHI , YAMAKAWA SEISHIRO , KOSEKI TAKAYOSHI , HIRATA ISAO
IPC分类号： C08K5/10 , C08F290/00 , C08F299/00 , C08G59/18 , C08G59/40 , C08L9/00 , C08L21/00 , C08L63/00 , C08L71/00 , C08L71/12 , C09J171/00 , C09J171/12 , H05K1/03
摘要： PURPOSE: To obtain a prepreg excellent in dielectric characteristics and used for the production of a laminate by selecting specified heat drying conditions in a process for producing a prepreg by impregnating a base with a polyphenylene ether resin varnish and drying the varnish. CONSTITUTION: A process for producing a prepreg comprising impregnating a base with a varnish comprising a polyphenylene ether resin, a cross-linkable resin (e.g. 1,2-polybutadiene, 1,4-polybutadiene or styrene/butadiene copolymer), a cross-linking aid (e.g. ester acrylate, epoxyacrylate, triallyl cyanurate or divinylbenzene), an initiator, an inorganic filler and a halogen-free solvent, wherein the heat drying conditions are represented by the region surrounded by the square having the four vertices A (80, 1.5), B (80, 5.5), C (140, 4.5) and D (140, 0.5) and shown by the graph of the figure (wherein X-axis represents the temperature ( deg.C), and Y-axis represents the heat drying time (min)).

7. 发明专利

JPH07290638A PRODUCTION OF LAMINATED SHEET 失效
公开(公告)号：JPH07290638A
公开(公告)日：1995-11-07
申请号：JP9025994
申请日：1994-04-27
申请人： MATSUSHITA ELECTRIC WORKS LTD
发明人： TSUZAKI MICHIMASA , HIRATA ISAO , NOZUE AKIYOSHI , YAMAKAWA SEISHIRO
IPC分类号： B32B15/082 , B32B15/08 , B32B17/04 , H05K1/03
摘要： PURPOSE:To produce a laminated sheet reduced in the deterioration of electric characteristics (especially, dielectric loss tangent) after hygroscopic treatment (excellent in moisture resistance) and high in specific dielectric constant. CONSTITUTION:Varnish containing an inorg. powder with a specific dielectric constant of 20 or more and fluoroplastic is infiltrated into glass cloth and the impregnated cloth is baked to form a prepreg and, subsequently, metal foil is arranged on the single surface or both surfaces of the single prepreg. or laminated to a plurality of prepregs and the whole is integrated under heating and pressure to produce a laminate. In this manufacturing method, the main component of fluoroplastic is a tetrafluoroethylene polymer containing a tetrafluoroethylene monomer with a mol.wt. of 1000000 or less in a ratio of 5-80 wt.%. The inorg. powder is one coated with inorg. matter based on silica and subsequently surface-treated with a silane coupling agent.

8. 发明专利

JP2004009584A ELECTRICAL METALLIC FOIL-PLATED LAMINATED SHEET 审中-公开
公开(公告)号：JP2004009584A
公开(公告)日：2004-01-15
申请号：JP2002167089
申请日：2002-06-07
申请人： MATSUSHITA ELECTRIC WORKS LTD , JAPAN COMPOSITE CO LTD
发明人： NOZUE AKIYOSHI , HIRATA ISAO , UNO YOSHIAKI , TSUJINO YASUNORI
IPC分类号： B32B15/092 , B32B15/08 , B32B15/082 , C08F290/06 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide an electrical metallic foil-plated laminated sheet which keeps heat resistance, impact resistance and tenacity well-balanced at a high level and shows a low coefficient of linear expansion, outstanding adhesiveness properties between a metallic foil and a cured resin layer and superb drill wearing properties. SOLUTION: This electrical metallic foil-plated laminated sheet is formed of the metallic foil and a reinforced fiber layer integrally combined with a cured resin. In order to integrally combine the metallic foil and the reinforced fiber layer, a radical polymerizable resin composition containing a vinyl ester which is obtained by compounding bisphenol and/or bisphenol bromide, a bisphenol epoxy resin and/or a bisphenol bromide epoxy resin and synthesized from (meth)acrylic acid and/or glycidyl (meth)acrylate and contains 30 or more mass% of a vinyl ester with a high molecular weight of 2,000 or more, and a radical polymerizable monomer, are used and cured when the metallic foil and the reinforced fiber layer are combined in one piece. COPYRIGHT: (C)2004,JPO

9. 发明专利

JP2003166162A GLASS NONWOVEN FABRIC AND LAMINATE 审中-公开
公开(公告)号：JP2003166162A
公开(公告)日：2003-06-13
申请号：JP2001361676
申请日：2001-11-27
申请人： MATSUSHITA ELECTRIC WORKS LTD , ORIENTAL ASBEST
发明人： HIRATA ISAO , OKADA SHIGEHIRO , ITO NOBUYUKI , NOZUE AKIYOSHI , OTANI MINORU , YAMAZAKI SHIGEKI , MATOBA MASAHIRO
IPC分类号： C08J5/08 , C08L63/00 , D04H1/4218 , D04H1/587 , H05K1/03 , D04H1/58 , D04H1/42
摘要： PROBLEM TO BE SOLVED: To obtain a glass nonwoven fabric having excellent heat resistance and insulation reliability. SOLUTION: This glass nonwoven fabric is obtained by mutually bonding glass fibers with a binder. A binder comprising a thermosetting resin, at least either of oxazoline group-containing methacrylic and an acrylic-styrene aqueous resins and an epoxysilane coupling agent is used. COPYRIGHT: (C)2003,JPO

10. 发明专利

JP2002284825A RESIN COMPOSITION FOR LAMINATE AND LAMINATE PREPARED BY USING THE SAME 失效
公开(公告)号：JP2002284825A
公开(公告)日：2002-10-03
申请号：JP2001084875
申请日：2001-03-23
申请人： MITSUI TAKEDA CHEMICALS INC , MATSUSHITA ELECTRIC WORKS LTD
发明人： OKUMURA HIROYA , TAKEUCHI HIROSHI , SHIBATA KOJI , HIRATA ISAO , OKADA SHIGEHIRO
IPC分类号： B29B11/16 , B29C70/10 , C08F2/44 , C08F283/01 , C08F290/06
摘要： PROBLEM TO BE SOLVED: To provide a free-radically polymerizable resin composition which, when cured, gives a laminate exhibiting a high toughness and a low thermal expansion and capable of enduring precision working, such as drilling, at a high temperature. SOLUTION: This resin composition contains (a) a free-radically polymerizable resin, (b) a free-radically polymerizable monomer, and (c) fine polymer particles having hydroxyl groups.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式