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    • 42. 发明专利
    • SEMICONDUCTOR PRESSURE SENSOR
    • JPS57128074A
    • 1982-08-09
    • JP1292881
    • 1981-02-02
    • HITACHI LTD
    • YAMADA KAZUJINISHIHARA MOTOHISASUZUKI KIYOMITSUSHIMADA SATOSHIKOBORI SHIGEYUKITANABE MASANORISATOU HIDEO
    • H01L29/84
    • PURPOSE:To obtain the sensor having high measuring accuracy by a method wherein when the Si single crystal, on which four diffused resistance layers are provided on the surface and a concaved section to be used for diaphragm formation is provided on the reverse side, is adhered to a fixing base stand, an Si base stand with a through hole bored on the (100) or (110) face in its center part is used. CONSTITUTION:The four diffused resistance layers 2 to be used for the assembling of a bridge are formed on the surface of an Si substrate 1, a concaved section is provided on the reverse side by performing an etching, and the remaining part of the substrate 1 is used as a thin diaphragm section 3. Then, this semiconductor pressure sensor is adhered to an Si base stand 5. At this time, the through hole 6 to be provided in the center part of the base stand 5 is formed in such a manner that the face (100) or (110) will be appearing and at the same time, the hole 6 is formed into contractive shape. Also, a thin film 7 of boron silicate glass is used as the binding material for the adhesion of the sensor and the base stand 5. Through these procedures, the temperature characteristic of the sensor and the base stand are brought almost to the same degree, no deformation is generated on the diaphragm, and there exists no variation of resistance on the resistance layer.
    • 43. 发明专利
    • Semiconductor diaphragm type sensor
    • 空值
    • JPS5736870A
    • 1982-02-27
    • JP11164680
    • 1980-08-15
    • Hitachi Ltd
    • TANABE MASANORISHIMADA SATOSHINISHIHARA MOTOHISAYAMADA KAZUJIMATSUOKA YOSHITAKA
    • G01L9/04G01L9/00H01L29/84
    • H01L29/84
    • PURPOSE:To reduce the influences of temperature, induced noise and static pressure to a semiconductor diaphragm type sensor by specifying the thicknesses of two types of diaphragm supporting members to one another. CONSTITUTION:The outer peripheral thick part 12 of a semiconductor diaphragm having an outer peripheral thick part 12 and a central thick part 11, a thin part 13 at the intermediate between the thick parts 12 and 11, and piezo resistance elements 14-17 formed on the upper surface of the thin part 12 is bonded fixedly to the first supporting member 9. The first member 9 is bonded fixedly to the second supporting member 10 over the overall bottom to be sandwiched with a semiconductor diaphragm 8. Then, the thickness of the fixed part of the first member 9 to the second member 10 is formed more than twice the first member 9.
    • 目的:通过确定两种类型的隔膜支撑构件的厚度,来减少温度,感应噪声和静压对半导体隔膜式传感器的影响。 构成:具有外周厚部12和中央厚部11的半导体膜的外周厚部12,厚部12,11之间的中间的薄部13和形成在 薄部12的上表面固定地固定到第一支撑构件9.第一构件9固定地连接到第二支撑构件10上,整个底部被半导体隔膜8夹持。然后, 第一构件9的固定部分到第二构件10形成为第一构件9的两倍以上。
    • 44. 发明专利
    • Capacitor type pressure difference transmitter
    • 电容型压力差分变送器
    • JPS5730923A
    • 1982-02-19
    • JP10502080
    • 1980-08-01
    • Hitachi Ltd
    • SHIMADA SATOSHITANABE MASANORINISHIHARA MOTOHISA
    • G01L13/06G01D5/24G01L9/00
    • G01L9/0072
    • PURPOSE:To contrive to equalize the tension of a measuring diaphragm by joining the measuring diaphragm and base plates comprising an insulating material by positive electrode joining method. CONSTITUTION:The pressure difference transmitter is constituted by a pressure receiving part 10 and a pressure difference sensor 12. Both sides of the pressure receiving part main body 14 are welded and fixed to the outsides of a high pressure side seal diaphragm 16 and a low pressure side seal diaphragm 18. A high pressure side pressure receiving chamber 20 and a low pressure side pressure receiving chamber 22 are formed between the diaphragms and the pressure receiving part main body 14. At the center of the pressure receiving main body 14, the outside of a center diaphragm 24 is welded, and a high pressure side separating chamber 26 and a low pressure side separating chamber 28 are formed between said diaphragm and the pressure receiving main body 14. A pressure difference sensing element 50 is provided in the pressure difference sensor 12. To both sides of a measuring diaphragm 52, the base plates 54 and 56 comprising the insulating material are joined by positive electrode joining method.
    • 目的:通过正极接合法连接测量膜片和包含绝缘材料的基板来达到均衡测量膜片张力的目的。 构成:压差传感器由受压部10和压差传感器12构成。受压部主体14的两侧被焊接固定在高压侧密封膜16的外侧,低压侧 侧密封隔膜18.在隔膜和受压部主体14之间形成有高压侧压力接收室20和低压侧压力接收室22.在受压主体14的中心处, 焊接中心隔膜24,并且在所述隔膜和受压主体14之间形成有高压侧分离室26和低压侧分离室28.压差检测元件50设置在压力差传感器12中 在测量隔膜52的两侧,通过正极接合连接包括绝缘材料的基板54和56 方法。