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    • 35. 发明专利
    • FLEXIBLE WIRING BOARD
    • JPH02251435A
    • 1990-10-09
    • JP7296289
    • 1989-03-25
    • TOYO BOSEKI
    • UNO KEIICHIKURITA TOMOHARUWADA TORU
    • B32B15/08B32B15/088C09D179/08H05K1/03
    • PURPOSE:To obtain a flexible wiring board excellent in heat resistance, adhesiveness and curl resistance by using a resin based on at least one kind of a resin selected from polyimide, polyamide and polyamideimide having a special structural unit as an insulating substrate. CONSTITUTION:A flexible wiring board is processed using a metal laminated sheet obtained by forming at least one kind of resin selected from polyimide, polyamide and polyamideimide containing an amine residue component represented by structural formula (I) forming an imide bond or/and an amide bond in an amount of 60mol% with respect to a total amine residue on a metal foil. In the formula (I), R1 and R2 are hydrogen or a 1-4C alkyl group and may be same. When the unit represented by the formula (I) is below 60mol% of a total amine redidue, the curl of the metal laminated sheet or etched processed product thereof is large and it is not practically pref. from the aspect of precessability and functionalily as a flexible printed wiring board.
    • 38. 发明专利
    • METAL FOIL LAMINATE
    • JPH11240107A
    • 1999-09-07
    • JP34541998
    • 1998-12-04
    • TOYO BOSEKI
    • UNO KEIICHIWATANABE OSAMUKURITA TOMOHARUWADA TORU
    • B32B15/08B32B15/088H05K1/03
    • PROBLEM TO BE SOLVED: To provide a metal foil laminate enhanced in heat resistance. SOLUTION: A metal foil laminate has a metal foil and the resin film layer formed on at least one surface of the metal foil. The resin film layer is formed from a compsn. wherein 1-30 wt.% of an epoxy resin is compounded with a polyamideimide resin and/or a polyimide resin on a solid basis. This metal foil laminate is produced by a method wherein a soln. of a resin based on an org. solvent soluble polyimide resin and/or a polyamideimide resin and compounded with a predetermined amt. of an epoxy resin in an org. solvent is applied to at least one surface of the metal foil to be dried to form a resin layer and a plurality of the metal foils each having the resin layer formed thereon are superposed one upon another so that the resin layers are opposed mutually or other metal foil or heat-resistant film is superposed on the resin layers of the metal foils and the whole is taken up in a roll shape and the metal foil laminate taken up in the roll shape is heated to 150-250 deg.C to remove the org. solvent in the resin layers.