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1. 发明专利

JP2001177200A FLEXIBLE PRINTED-WIRING BOARD AND ITS MANUFACTURING METHOD 失效
公开(公告)号：JP2001177200A
公开(公告)日：2001-06-29
申请号：JP36001399
申请日：1999-12-17
申请人： TOYO BOSEKI
发明人： KURITA TOMOHARU , INUKAI TADASHI
IPC分类号： H05K3/28 , C08G73/10 , C08G73/14 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To obtain a flexible printed-wiring board whose heat resistance, break resistance and dimensional stability are superior and whose warping is not generated, by a method wherein a wiring board is coated with a heat-resistant resin solution so as to be dried and to obtain is manufacturing method. SOLUTION: The wiring board in which a conductor circuit is formed on a base material composed of a polyimide, and/or a polyimide film is coated with the heat-resistant resin solution as a polyimide and/or a polyamideimide soluble in an organic solvent and dried. It is wound and heat-treated, and a heat-resistant resin layer is formed.

2. 发明专利

JP2000022290A FLEXIBLE PRINTED BOARD 失效
公开(公告)号：JP2000022290A
公开(公告)日：2000-01-21
申请号：JP19075998
申请日：1998-07-06
申请人： TOYO BOSEKI
发明人： KURITA TOMOHARU
IPC分类号： B32B15/08 , B32B15/088 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To enhance heat resistance, adhesive properties and folding resistance and to enhance dimensional stability or particularly planarity after etching and circuit forming, by forming a second resin layer containing a polyimide resin having a larger thermal expansion coefficient than that of the polyimide resin on an upper layer than a first resin layer. SOLUTION: A polyimide resin for constituting a first resin layer is a heat resistant resin having an imide bond in a main chain of a polyimide, a polyamide, a polyester imide or the like. A polyimide resin for constituting a second resin layer to be laminated on the first layer is, similarly to the polyimide resin of the first layer, the heat resistant resin having the imide bond in the main chain. It is necessary that a thermal expansion coefficient of the polyimide resin of the second layer is larger than that of the polyimide resin of the first layer. In the case that a linear thermal expansion coefficient of the polyimide resin of the second layer is equal to or smaller than that of the polyimide resin of the first layer, planarity after etching and circuit forming is deteriorated.

3. 发明专利

JP2853218B2 失效
公开(公告)号：JP2853218B2
公开(公告)日：1999-02-03
申请号：JP30565089
申请日：1989-11-24
申请人： TOYO BOSEKI KK
发明人： KURITA TOMOHARU , WADA TOORU , UNO KEIICHI
IPC分类号： B32B15/088 , B32B15/08 , H05K1/03

4. 发明专利

JP2844744B2 失效
公开(公告)号：JP2844744B2
公开(公告)日：1999-01-06
申请号：JP29659789
申请日：1989-11-15
申请人： TOYO BOSEKI KK
发明人： KURITA TOMOHARU , WADA TOORU , UNO KEIICHI
IPC分类号： C08G73/14 , C08J5/18

5. 发明专利

JPH10316754A PHOTOSENSITIVE HEAT-RESISTANT RESIN AND VARNISH 失效
公开(公告)号：JPH10316754A
公开(公告)日：1998-12-02
申请号：JP14865497
申请日：1997-05-21
申请人： TOYO BOSEKI
发明人： KURITA TOMOHARU , KOMATSU KAZUNORI , INUKAI TADASHI , YAMAGUCHI HIROKI , UNO KEIICHI
IPC分类号： G03F7/038 , C08G73/14 , C09D179/08
摘要： PROBLEM TO BE SOLVED: To obtain a photosensitive heat-resistant resin comprising a polyamideimide polymer which is heat-resistant, has a low moisture absorption, is soluble in a low-boiling solvent, and has a high light transmission by reacting a polyamideimide polymer formed from trimellitic anhydride and a diamine component with an ethylenically unsatd. epoxy compd. SOLUTION: This resin comprises a polyamideimide polymer mainly comprising repeating units of formula I [wherein R is an org. group of formula II (wherein R and R are each H or 1-4C alkyl), etc.] and groups of formula III or IV (wherein R' is an ethylenically unsatd. org. group; and R is H or a group of formula V) bonded thereto. When this polyamideimide polymer is obtd. by an isocyanate process, a solvent (e.g. dimethylformamide) can be used. The essential acid component is trimellitic anhydride. Isophoronediamine is an example of the diamine component. The photosensitive group of fojmula III or IV is bonded by the reaction with an epoxy compd. having e.g. a (meth) acryloyl group.

6. 发明专利

JPH10316753A PHOTOSENSITIVE HEAT-RESISTANT RESIN AND VARNISH 失效
公开(公告)号：JPH10316753A
公开(公告)日：1998-12-02
申请号：JP14865397
申请日：1997-05-21
申请人： TOYO BOSEKI
发明人： KURITA TOMOHARU , KOMATSU KAZUNORI , INUKAI TADASHI , YAMAGUCHI HIROKI , UNO KEIICHI
IPC分类号： G03F7/038 , C08G73/10 , C09D179/08
摘要： PROBLEM TO BE SOLVED: To obtain a photosensitive heat-resistant resin comprising a polyimide polymer which is heat-resistant, has a low moisture absorption, is soluble in a low-boiling solvent, and has a high light transmission by reacting a polyimide polymer formed from diphenylsulfonetetracarboxylic dianhydride and a diamine component with an ethylenically unsated. epoxy compd. SOLUTION: This resin comprises a polyimide polymer mainly comprising repeating units of formula I [where in R is an org. group of formula II (wherein R and R are each H or a 1-4C alkyl), etc.] and groups of formula III or IV [wherein R is an ethylenically unsatd. org. group (e.g. an acryloyl group); and R is H or a group of formula V] bonded thereto. When this polyimide polymer (or a polyamideimide polymer) is obtd. by an isocyanate process, a solvent (e.g. dimethylformamide) can be used. The joint use of 3,3',4,4'- diphenylsulfonetetracarboxylic dianhydride, as the essential acid component, and trimellitic anhydride in the copolymn. is pref.

7. 发明专利

JPH10302772A NEGATIVE ELECTRODE FOR SECONDARY BATTERY AND SECONDARY BATTERY USING THE SAME 失效
公开(公告)号：JPH10302772A
公开(公告)日：1998-11-13
申请号：JP10482097
申请日：1997-04-22
申请人： TOYO BOSEKI
发明人： INUKAI TADASHI , UNO KEIICHI , KURITA TOMOHARU , YAMAGUCHI HIROKI
IPC分类号： H01M4/62 , H01M4/13 , H01M4/133 , H01M4/1393 , H01M10/05 , H01M4/02 , H01M10/40
摘要： PROBLEM TO BE SOLVED: To allow easy manufacturing, ensure freedom from a crack or a separation during the manufacture of a battery or the use thereof and provide a high charging and discharging characteristics by including at least one of those selected from a diphenyl methane residue, dicyclohexyl methane residue and isophorone residue in a polyamide resin for a negative electrode as an amine residue. SOLUTION: In this negative electrode for a secondary battery a mixed layer having a structure of granular carbonaceous materials bonded to each other with a binder resin is formed on a negative electrode current collector body as a negative electrode active material carrier. The weight ratio of the binder resin to the carbonaceous materials in the mixed layer is preferably in the range of (3:97) to (20:80). The binder resin contains a polyimide resin having a breakage elongation >=50% when formed into a film at a logarithmic viscosity >=0.3 dl/g. In addition, the polyimide resin contains at least one of those selected from a diphenyl methane residue, dicyclohexyl methane residue, and isophorone residue.

8. 发明专利

JPH10302771A NEGATIVE ELECTRODE FOR SECONDARY BATTERY AND SECONDARY BATTERY USING THE SAME 失效
公开(公告)号：JPH10302771A
公开(公告)日：1998-11-13
申请号：JP10481897
申请日：1997-04-22
申请人： TOYO BOSEKI
发明人： INUKAI TADASHI , UNO KEIICHI , KURITA TOMOHARU , YAMAGUCHI HIROKI
IPC分类号： H01M4/62 , H01M4/13 , H01M4/133 , H01M4/1393 , H01M10/05 , H01M4/02 , H01M10/40
摘要： PROBLEM TO BE SOLVED: To provide a negative electrode for a secondary battery, easy manufactured, causing no crack or a separation during the manufacture of a battery, and having a high charging and discharging cycle characteristics by using alkylene glycol bis-anhydrotrimellitate as an acid component for a polyimide resin used for a negative electrode active material. SOLUTION: In this negative electrode for a secondary battery, a mixed layer having a structure of granular carbonaceous materials bonded to each other with a binder resin is formed on a negative electrode current collector body as a negative electrode active material carrier. The weight ratio of the binder resin to the carbonaceous materials in the mixed layer is preferably in the range of (3:97) to (20:80). The binder resin contains a polyimide resin having a breakage elongation >=50% when formed into a film at a logarithmic viscosity >=0.3 dl/g. In addition, the polyimide resin uses alkylene glycol bis- anhydrotrimellitate as an acid component.

9. 发明专利

JPH10244628A LAMINATE 失效
公开(公告)号：JPH10244628A
公开(公告)日：1998-09-14
申请号：JP4917697
申请日：1997-03-04
申请人： TOYO BOSEKI
发明人： KURITA TOMOHARU , INUKAI TADASHI , YAMAGUCHI HIROKI , UNO KEIICHI
IPC分类号： B32B15/088 , B32B15/08 , B32B15/092
摘要： PROBLEM TO BE SOLVED: To improve the heat resistance and the wear resistance to high temperature of an insulated electric wire by forming a resin layer which comprises a mixture of polymide-imide resin containing a specific amine residue component as a respecting unit, in a molecular chain and epoxy resin or which is made up of a resin composition bonded with a specific residue, on the surface of metal moldings. SOLUTION: A resin layer of a mixture of polyamide-imide resin containing an amine residue component, as a respecting unit, shown by formula I for the formation of an imide bond and an amine bond, in a molecular chain and epoxy resin, is formed at least, on one of the faces of metal moldings. Alternatively, a resin layer comprising a resin composition of the residue, shown by formula II and/or formula III, bonded with the polyamide-imide resin is formed at least, on one of the faces of the metal moldings. In the formulae, R , R are a 1-4C alkyl group and may be the same or different from each other, and R is hydrogen atom or an epoxy resin residue and R is hydrogen atom or 2- hydroxyethylene group with R bonded at a position 3.

10. 发明专利

JPH1067934A WATER-SOLUBLE POLYIMIDE-IMIDE RESIN COMPOSITION 失效
公开(公告)号：JPH1067934A
公开(公告)日：1998-03-10
申请号：JP22716896
申请日：1996-08-28
申请人： TOYO BOSEKI
发明人： INUKAI TADASHI , UNO KEIICHI , KURITA TOMOHARU , YAMAGUCHI HIROKI
IPC分类号： C08L79/08 , C08G73/14
摘要： PROBLEM TO BE SOLVED: To obtain the subject component useful for a plastic film high in solubility in water free from environmental pollution and low in processing cost, containing a polyimide resin having a specific logarithmic viscosity and a prescribed acid value. SOLUTION: This composition comprises (B) a polyimide resin soluble in a basic aqueous solution. The component B has >=0.1dL/g intrinsic viscosity and >=30 equivalent/10 g acid value. The component B contains a metal inonic group, preferably 5-sulfoisophthaloyl group in the ratio of the group to an acid component or amine component constituting the component B of >=0.1mol%. The component A is at least a kind of aqueous solutions of ammonia and a water-soluble amine having

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