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    • 31. 发明专利
    • SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
    • JPH07311628A
    • 1995-11-28
    • JP13146894
    • 1994-05-19
    • SONY CORP
    • MURAKAMI DAISUKEMOGI TAKAYUKI
    • G05F3/26H01S5/042H01S3/096
    • PURPOSE:To improve the usability for a user by enabling a constant current circuit which is built in to be used as a current setting type or voltage setting type current source only by changing connections with a 1st and a 2nd external terminals. CONSTITUTION:A transistor(TR) Q11 is provided with the dedicated 1st external terminal P12 at its collector and TRs Q11 and Q12 are provided with the common 2nd external terminal P11 at their bases. An external source voltage is applied to the 1st external terminal P12 and a bias voltage for base voltage setting is applied to the 2nd external terminal P11, so that the constant current circuit 11 can be used as the voltage setting type current source. The 1st external terminal P12 and 2nd external terminal P11 are connected through an external wire 12 and a bias current is supplied to the 1st external terminal P12, so that the constant current circuit 11 can be used as the current setting type current source. Thus, the connections with the 1st and 2nd external terminals P12 and P11 are only changed to use the constant current circuit 11 as either of the current and voltage setting type current sources.
    • 32. 发明专利
    • SEMICONDUCTOR DEVICE
    • JPH0457343A
    • 1992-02-25
    • JP16907490
    • 1990-06-27
    • SONY CORP
    • MOGI TAKAYUKI
    • H01L21/82
    • PURPOSE:To standardize master slice, simplify manufacturing process of LSI, and improve area efficiency concerning an element forming region, by forming capacitances in I/O pad parts which are not used as I/O pads out of a plurality of I/O pads. CONSTITUTION:In a semiconductor device A which has a wiring region 1 and an element forming region 2 in the inside and has a plurality of I/O pads in the peripheral part, capacitances C are formed in I/O pads 3b which are not used as actual I/O pads 3a out of a plurality of the I/O pads 3. Hence the pad parts 3b which are not used can be used as large capacitance capacitors, so that it is unnecessitated to form a capacitor block for forming large capacitance capacitors. Thereby the area efficiency of the element forming region 2 is improved, and the LSI manufacturing process using gate array system can be simplified by standardization.
    • 34. 发明专利
    • ROTARY HEAD APPARATUS
    • JP2001023133A
    • 2001-01-26
    • JP19225199
    • 1999-07-06
    • SONY CORP
    • IETOKU TAKASHIMOGI TAKAYUKI
    • G11B5/52
    • PROBLEM TO BE SOLVED: To make the apparatus constitution of a rotary head apparatus small while being capable of fixing a motor or motor coil to a fixed drum with a sufficient strength. SOLUTION: A part on the lower end side of a lower drum is formed in a cylindrical shape to which a stator substrate 22 of a motor 20 can be inserted to the inner circumferential side. An annular groove 26 is formed in the inner circumferential part of the cylindrical part over the whole circumference. The stator substrate 22 is stored in the part at the lower end side of the lower drum 1. A press hold member 25 which is formed of an elastic material in an annular shape with a chipped part at one point and forms a ring of a larger diameter than the ring of the groove 26 in a natural state is compressed in diameter and fitted into the groove 26. The motor 20 is thus mounted to the lower drum 1.
    • 36. 发明专利
    • ROTATOR, METHOD AND APPARATUS FOR ADJUSTING DYNAMIC BALANCE THEREOF
    • JPH1038742A
    • 1998-02-13
    • JP20549196
    • 1996-07-17
    • SONY CORP
    • MOGI TAKAYUKIYOSHITAKA HIROYUKI
    • G01M1/32
    • PROBLEM TO BE SOLVED: To enhance the adjusting accuracy of dynamic imbalance of a rotator, while shortening the adjusting time and reducing the cost, by dripping a fluid material adhering to a matter to be bonded upon hardening onto a rotating rotator. SOLUTION: A fluid material (e.g. UV curing resin) adhering to a matter to be bonded upon hardening is dripped onto a rotating rotator 3. When the dripped material is collected at a position for sustaining dynamic balance, the material is hardened to adhere to the rotator 3. More specifically, when the rotator 3 is unbalanced with respect to a rotary shaft 17, the dripped UV curing resin is moved, by inertia, oppositely to the direction from the center of rotation 19 toward the center of gravity 20, i.e., in the direction for eliminating imbalance. Subsequently, the UV curing resin is irradiated with UV rays and cured t adhere to the rotator 3 at the imbalance eliminating position. According to the arrangement, dynamic imbalance of the rotator 3 is eliminated and adjustment of dynamic imbalance is completed.
    • 37. 发明专利
    • ROTARY MAGNETIC HEAD DEVICE
    • JPH09153208A
    • 1997-06-10
    • JP31335995
    • 1995-11-30
    • SONY CORP
    • MOGI TAKAYUKI
    • G11B5/52G11B5/02
    • PROBLEM TO BE SOLVED: To improve the axial perpendicular change and non-periodic deflection of a revolving shaft and to prevent the deformation of bearing by an adhesive by forming an annular groove in a bearing press-fitting part and evenly admitting the adhesive of the amt. enough for surely fixing the bearing to this part into the bearing. SOLUTION: The rotary drum of a rotary magnetic head device is rotated by the revolving shaft 5 supported at the bearings 6, 7 adhered and fixed by a stationary drum 4 disposed opposite to the rotary drum. The toric groove 11 is formed in the one bearing press-fitting part 8 of the bearing press-fitting parts 8, 9 for fixing the bearings 6, 7. The toric groove 11 is formed in the range where the adhesive 10 of the amt. enough to surely adhere and fix the bearing 7 is admitted and the contact length (x) with the bearing 7 is sufficiently assure, by which the axial perpendicular change, non-periodic deflection, etc., of the revolving shaft 5 are improved. The deformation of the bearings by the solidification of the adhesive is eliminated by the uniform inflow of the adhesive 10.
    • 40. 发明专利
    • CIRCUIT BOARD ATTACHING STRUCTURE AND ROTARY DRUM DEVICE
    • JP2002042316A
    • 2002-02-08
    • JP2000221935
    • 2000-07-24
    • SONY CORP
    • MOGI TAKAYUKIKAMIKUI KEIZO
    • G11B5/53
    • PROBLEM TO BE SOLVED: To surely connect a substrate contact formed on a circuit board, without hindering reduction in the size and weight of a device with a separated contact position away from the circuit board. SOLUTION: This circuit board attaching structure is constructed, in such a manner that a substrate contact 39 formed on a circuit board 32 by attaching the circuit board 32 to a support base (rotary drum) 24, and a separated contact 38 positioned away from the circuit board are connected with each other by a relay contact 1 formed by electrical connections between terminals 3 and 4 positioned in both ends of the base 2 made of an insulator. In this case, the terminal 3 in one end of the relay contact is fixed to the substrate contact, a reinforcing plate 40 for pressing the peripheral edge of the circuit board upward toward the separated contact is superposed on a surface opposite the surface of the circuit board, where the substrate contact is formed, and a pressing force by the reinforcing plate presses the terminal of the other surface of the relay contact into contact with the separated contact.