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31. 发明专利

JP2010277996A Anisotropic conductive particles 有权
标题翻译：各向异性导电颗粒
公开(公告)号：JP2010277996A
公开(公告)日：2010-12-09
申请号：JP2010099002
申请日：2010-04-22
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： ARIFUKU MASAHIRO , KOBAYASHI KOJI , FUJINAWA MITSUGI
IPC分类号： H01B5/00 , H01R11/01
CPC分类号： H01R4/04 , H01B1/22 , H01B1/24 , H01L24/29 , H01L24/83 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29347 , H01L2224/29355 , H01L2224/29369 , H01L2224/29393 , H01L2224/838 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/07811 , H01L2924/12044 , H05K3/323 , H05K2201/0224 , H05K2201/0323 , H01L2924/00 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： PROBLEM TO BE SOLVED: To provide anisotropic conductive particles capable of making compatible both securing of insulation performance between neighboring circuits and securing of conductivity between opposing circuits, when used for a circuit connecting material. SOLUTION: The anisotropic conductive particles each include: an organic insulating material 3; and conductive particulates 2 which are dispersed in the organic insulating material 3. When the anisotropic conductive particle is 50% flattened from the original particle diameter by applying pressure on it, the resistance becomes 1/100 or less of that of the anisotropic particles before application of the pressure. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供各向异性导电颗粒，当用于电路连接材料时，能够兼容确保相邻电路之间的绝缘性能并确保相对电路之间的导电性。各向异性导电颗粒各自包括：有机绝缘材料3; 和分散在有机绝缘材料3中的导电颗粒2.当通过施加压力使各向异性导电颗粒从原始颗粒直径50％变平时，电阻变为施加前的各向异性颗粒的电阻的1/100或更小的压力。版权所有（C）2011，JPO＆INPIT

32. 发明专利

JP2010222144A Adhesive material reel 有权
标题翻译：胶粘材料卷
公开(公告)号：JP2010222144A
公开(公告)日：2010-10-07
申请号：JP2010039154
申请日：2010-02-24
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TATEZAWA TAKASHI , SEKI TAKASHI , KOBAYASHI KOJI , FUJINAWA MITSUGI , ARIFUKU MASAHIRO , SEKI KOTARO
IPC分类号： B65H75/28 , C09J7/02
CPC分类号： H01R4/04 , B65H18/28 , B65H2701/377 , C09J7/22 , C09J7/38 , H05K3/323 , H05K3/361 , H05K2203/0191
摘要： PROBLEM TO BE SOLVED: To provide an adhesive material reel capable of sufficiently restricting transference of an adhesive layer to a base material back surface when drawing a circuit connecting tape in a state of being wound and effective to manufacture a circuit connector having excellent reliability on connection.
SOLUTION: This adhesive material reel is provided with a circuit connecting tape having a tape-shaped base material and an adhesive layer formed on one surface of the base, and also with a winding core around which the circuit connecting tape is wound. The circuit connecting tape has: an end tape joined to a trailing end; a region on which an adhesive layer is not formed and which extends from the trailing end toward the leading end of the circuit connecting tape for a length equivalent to at least one winding of the circuit connecting tape around the core; and a cover tape provided so as to cover the region.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够充分地限制在缠绕状态下拉伸电路连接带时的粘合剂层向基材背面的移动的粘合材料卷轴，并且有效地制造具有优异的电路连接器连接可靠性解决方案：该粘合材料卷轴设置有具有带状基材的电路连接带和形成在基座的一个表面上的粘合层，并且还具有卷绕电路连接带的卷绕芯。电路连接带具有连接到尾端的端带; 在其上没有形成粘合剂层的区域，其从电路连接带的后端朝向前端延伸长度等于电路连接带绕芯的至少一个绕组的长度; 以及设置成覆盖该区域的盖带。版权所有（C）2011，JPO＆INPIT

33. 发明专利

JP2010186395A Method and system for analyzing particle deformation for resin material containing particle 审中-公开
标题翻译：用于分析包含颗粒的树脂材料的颗粒变形的方法和系统
公开(公告)号：JP2010186395A
公开(公告)日：2010-08-26
申请号：JP2009031229
申请日：2009-02-13
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： KONO TSUTOMU , KOBAYASHI KOJI , MINO MASAYUKI , KOJIMA KAZUYOSHI
IPC分类号： G06F17/50
摘要： PROBLEM TO BE SOLVED: To establish an analysis technology for predicting the crack of particles in performing connection molding and inter-substrate conductivity by thermal stress analysis under the input conditions of the temperature change and electrode moving speed of resin and particles calculated by the hot fluid analysis of resin materials containing particles. SOLUTION: The deformation quantity of particles is calculated from an inter-electrode interval calculated by a hot fluid analysis, and a load calculated by subtracting a load corresponding to the deformation quantity of particles from a load for moving electrodes is used as a load for moving the electrodes of the next time step. A process that resin materials flow while particles are deformed is predicted by the analysis of fluid, and the experiment result of a temperature and an elasticity rate for the resin materials and particles are input, and a result including the temperature change of the resin materials and particles and the moving speed of the electrodes calculated by the hot fluid analysis is used as the input conditions of the thermal stress analysis. Thus, it is possible to calculate the deformation shape of the particles and electrodes in detail, and to predict the crack of the particles in the case of connection molding and inter-substrate conductivity of the like. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：在温度变化和树脂和颗粒的电极移动速度的输入条件下，通过热应力分析建立用于预测连续成型中的颗粒裂纹和基板间导电性的分析技术，由含有颗粒的树脂材料的热流体分析。解决方案：根据通过热流体分析计算的电极间间隔计算颗粒的变形量，并且通过从用于移动电极的负载减去与颗粒的变形量相对应的负荷计算的负荷被用作用于移动下一个时间步长的电极的负载。通过流体分析预测树脂材料流动而使颗粒变形的过程，并输入树脂材料和颗粒的温度和弹性率的实验结果，结果包括树脂材料的温度变化和使用热流体分析计算出的电极和电极的移动速度作为热应力分析的输入条件。因此，可以详细计算颗粒和电极的变形形状，并且可以预测在连接成型和类似基板间电导率的情况下的颗粒的裂纹。版权所有（C）2010，JPO＆INPIT

34. 发明专利

JP2010157746A Circuit connecting material, connection structure of circuit member and method of connecting the same 有权
标题翻译：电路连接材料，电路构件的连接结构及其连接方法
公开(公告)号：JP2010157746A
公开(公告)日：2010-07-15
申请号：JP2010015598
申请日：2010-01-27
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： ARIFUKU MASAHIRO , MOCHIZUKI AKIOMI , NAKAZAWA TAKASHI , KOBAYASHI KOJI , FUJINAWA MITSUGI , TATEZAWA TAKASHI
IPC分类号： H05K1/14 , H01B1/22 , H01L21/60 , H01R11/01 , H05K3/36
摘要： PROBLEM TO BE SOLVED: To provide a circuit connecting material with which ample adhesive strength can be obtained, when connecting a circuit member having a substrate made of polyester terephthalate, polyimide resin, polyetersulfone, acrylic resin or glass, or a circuit member, wherein a layer made of silicone resin, polyimide resin, acrylic resin, etc., is formed on its surface.
SOLUTION: The circuit connecting material 1 contains an adhesive composition which is cured by light or heat, and an organic compound having an urethane group and an ester group, the organic compound having a glass transition temperature of 50°C or more, and is used to connect circuit members provided with a substrate and a circuit electrode formed on its main surface.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供可以获得充分的粘合强度的电路连接材料，当连接具有由聚酯对苯二甲酸酯，聚酰亚胺树脂，聚醚砜，丙烯酸树脂或玻璃制成的基板的电路部件或电路部件其中在其表面上形成由硅树脂，聚酰亚胺树脂，丙烯酸树脂等制成的层。电路连接材料1含有通过光或热固化的粘合剂组合物和具有氨基甲酸酯基和酯基的有机化合物，该有机化合物的玻璃化转变温度为50℃以上，并且用于连接设置有基板的电路构件和形成在其主表面上的电路电极。版权所有（C）2010，JPO＆INPIT

35. 发明专利

JP2009135447A Circuit connection method 审中-公开
标题翻译：电路连接方法
公开(公告)号：JP2009135447A
公开(公告)日：2009-06-18
申请号：JP2008270020
申请日：2008-10-20
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： MOCHIZUKI AKIOMI , KOBAYASHI KOJI , ARIFUKU MASAHIRO
IPC分类号： H01L21/60 , H05K3/32 , H05K3/36
摘要： PROBLEM TO BE SOLVED: To provide a circuit connection method materializing securement of stable electrical bonding of circuit electrodes inexpensively even when the connection area and pitch of the circuit electrode are reduced. SOLUTION: The circuit connection method includes: a step of preparing a semiconductor chip 10 in which a bump 16 is formed on the main surface S of a chip body 12; a step of preparing a circuit member in which an electrode corresponding to the bump 16 is provided on the main surface of a substrate; a step of arranging the semiconductor chip 10 and the circuit member so that the main surface S of the chip body 10 and the main surface of the substrate face each other; and a step of bonding the bump 16 and the electrode by clamping an anisotropic conductive material while pressurizing it by the semiconductor chip 10 and the circuit member. The plurality of bumps 16 are provided near the peripheral edge of the main surface S and each of the bumps 16 has an inclined surface 16a whose height from the main surface S increases from the side near the center of the main surface S to the side near the peripheral edge of the main surface S. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供即使当电路电极的连接面积和间距减小时，也能廉价地实现电路电极的稳定电接合的固定的电路连接方法。电路连接方法包括：准备在芯片体12的主面S上形成有凸块16的半导体芯片10的工序; 准备电路部件的步骤，其中与凸块16对应的电极设置在基板的主表面上; 将半导体芯片10和电路部件配置成芯片主体10的主面S与基板的主面相对的工序; 以及通过夹持各向异性导电材料，同时通过半导体芯片10和电路部件对凸块16和电极进行加压而接合凸块16和电极的步骤。多个凸块16设置在主表面S的周边附近，并且每个凸块16具有倾斜表面16a，其从主表面S的高度从靠近主表面S的中心侧增加到靠近主表面S的一侧主表面的外围边缘。版权所有（C）2009，JPO＆INPIT

36. 发明专利

JP2009135093A Anisotropic conductive film, reel for anisotropic conductive film, anisotropic conductive film roll, and connection structure of circuit member 审中-公开
标题翻译：用于各向异性导电膜，各向异性导电膜和电路构件的连接结构的各向异性导电膜
公开(公告)号：JP2009135093A
公开(公告)日：2009-06-18
申请号：JP2008276945
申请日：2008-10-28
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： KOBAYASHI TAKANOBU , KOBAYASHI KOJI
IPC分类号： H01R11/01 , H01R43/00
摘要： PROBLEM TO BE SOLVED: To provide an anisotropic conductive film in which static electricity of the anisotropic conductive film is easily removed, a reel for the anisotropic conductive film, an anisotropic conductive film roll, and a connection structure of a circuit member in which reduction of failure caused by static electricity is possible.
SOLUTION: The anisotropic conductive film 5 is used by winding on a reel 3 which has a winding core part 3a having a cylindrical shape and in which an anisotropic conductive film is wound around concentrically on the outer circumferential face and a pair of reel side plates 3b which are provided at both ends of the winding core part 3a and extend along a face orthogonal to the cylinder axis of the winding core part 3a. Then, the winding core part 3a and the reel side plates 3b have conductivity.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供容易除去各向异性导电膜的静电的各向异性导电膜，用于各向异性导电膜的卷轴，各向异性导电膜辊和电路构件的连接结构静电导致的故障减少是可能的。解决方案：各向异性导电膜5通过卷绕在具有圆筒形状的卷绕芯部3a的卷轴3上并且各向异性导电膜同心地缠绕在外周面上并且一对卷轴侧板3b设置在卷芯部3a的两端，并且沿着与卷绕芯部3a的筒轴正交的面延伸。然后，卷绕芯部3a和卷线器侧板3b具有导电性。版权所有（C）2009，JPO＆INPIT

37. 发明专利

JP2007158367A Method of mounting multi chips, chip string with adhesives, and method of manufacturing chip with adhesives 有权
标题翻译：安装多芯片的方法，带粘合剂的芯片，以及用粘合剂制造芯片的方法
公开(公告)号：JP2007158367A
公开(公告)日：2007-06-21
申请号：JP2007012617
申请日：2007-01-23
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TSUKAGOSHI ISAO , KOBAYASHI KOJI , MATSUDA KAZUYA , FUKUSHIMA NAOKI , KOIDE NOBUKAZU
IPC分类号： H01L21/60 , H01L23/52 , H01L25/00
CPC分类号： H01L24/27 , H01L24/83 , H01L2224/7511 , H01L2224/83191 , H01L2224/83209
摘要： PROBLEM TO BE SOLVED: To provide a method of mounting multi chips, which arranges chips having different sizes on a surface of an electrode of a substrate and being capable of manufacturing an efficient MCM (multi chip module), which can mount chips at a time, chip string with adhesives, and method of manufacturing a chip with adhesives. SOLUTION: A Method of mounting multi chips having different chip sizes is composed of process as follows; (1) a process, in which an adhesives layer composed of hardening material, which is formed on a separator and larger than the chip size, is made to contact with the surface of the electrode of the chip, being heated from the back of the chip at an active temperature of a curing agent or lower to form a cohesive force fall line of the adhesives layer along the chip size, and the adhesives layer having almost the same size with the chip is exfoliated from the separator to be transferred to the chip, and multiple chips with adhesives are obtained, (2) a process to make electrodes of multiple chips with adhesives to be connected and the electrode of a substrate face each other and perform alignment, and (3) a process, in which electrodes of multiple chips and electrode of the substrate that complete alignment of the electrodes are thermocompression-bonded between electrodes to be connected at the active temperature of the curing agent or higher and electrical connections of multiple chips on the same substrate are obtained. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种安装多芯片的方法，该芯片在基板的电极的表面上布置具有不同尺寸的芯片，并且能够制造高效的MCM（多芯片模块），其可以安装芯片同时，具有粘合剂的芯片串，以及用粘合剂制造芯片的方法。解决方案：安装具有不同芯片尺寸的多芯片的方法由以下过程组成：（1）一种方法，其中形成在隔膜上并且大于芯片尺寸的由硬化材料组成的粘合剂层与芯片的电极的表面接触，从该芯片的背面被加热芯片处于固化剂的活性温度或更低，以形成沿着芯片尺寸的粘合剂层的内聚力下降线，并且具有与芯片几乎相同尺寸的粘合剂层从分离器剥离以转移到芯片，并且获得具有粘合剂的多个芯片，（2）使用要连接的粘合剂制造多个芯片的电极并且基板的电极彼此面对并进行对准的工艺，以及（3）其中多个完成电极对准的基板的芯片和电极在固化剂的活性温度以上的电极之间热连接，在多个芯片的电连接得到相同的基材。版权所有（C）2007，JPO＆INPIT

38. 发明专利

JP2007049179A Multi-chip mounting method and curing film-like adhesive used for the same 有权
标题翻译：多芯片安装方法和固化胶片
公开(公告)号：JP2007049179A
公开(公告)日：2007-02-22
申请号：JP2006262347
申请日：2006-09-27
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TSUKAGOSHI ISAO , KOBAYASHI KOJI , MATSUDA KAZUYA , FUKUSHIMA NAOKI
IPC分类号： H01L25/04 , H01L21/60 , H01L25/18 , H05K3/32
摘要： PROBLEM TO BE SOLVED: To provide a multi-chip mounting method that can be adapted to many kinds of chip sizes, has a small influence of heat in connection, and removes remaining adhesives easily, and to provide a curing film-like adhesive used for the multi-chip mounting method.
SOLUTION: The multi-chip mounting method includes a process 1 for preparing a plurality of rows of curing film-like adhesives having maximum tape widths in a plurality of groups of chips connected in the same direction on a substrate; a process 2 for tentatively connecting the plurality of rows of film-like adhesives to a row where groups of chips are mounted on the substrate at an active temperature or lower for formation by separating by the maximum tape widths of the plurality of groups of chips connected in the same direction on the substrate; a process 3 for aligning the electrode of the chip connected to an electrode of the substrate having the adhesive in the process 2; and a process 4 for heating and pressurizing the electrode of the chip where the alignment of the electrode is completed, and the electrode on the substrate between the electrodes connected at the active temperature or higher to obtain the electric connection of the plurality of rows of chips on the same substrate.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供可以适应于许多种类的芯片尺寸的多芯片安装方法，对连接的热量的影响小，并且容易地去除剩余的粘合剂，并且提供固化膜状用于多芯片安装方法的粘合剂。解决方案：多芯片安装方法包括一种制备多行固化膜状粘合剂的方法1，所述固化膜状粘合剂在基板上以相同方向连接的多组芯片中具有最大带宽; 暂时将多行薄膜状粘合剂连接到基板上的基板上的活性温度以下的行，以便通过分离连接的多组芯片的最大带宽而形成的行在基板上相同的方向; 在工序2中对准与具有粘合剂的基板的电极连接的芯片的电极的工序3; 以及用于对完成电极对准的芯片的电极进行加热和加压的工艺4以及连接在有源温度以上的电极之间的基板上的电极，以获得多行芯片的电连接在同一基板上。版权所有（C）2007，JPO＆INPIT

39. 发明专利

JP2006287269A Multi-chip mounting method 有权
标题翻译：多芯片安装方法
公开(公告)号：JP2006287269A
公开(公告)日：2006-10-19
申请号：JP2006203115
申请日：2006-07-26
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TSUKAGOSHI ISAO , KOBAYASHI KOJI , MATSUDA KAZUYA , FUKUSHIMA NAOKI , KOIDE NOBUKAZU
IPC分类号： H01L21/60
CPC分类号： H01L24/27 , H01L24/83 , H01L2224/32225 , H01L2224/83191
摘要： PROBLEM TO BE SOLVED: To provide a multi-chip mounting method for efficiently manufacturing an MCM (multi-chip module) by arranging and mounting chips whose sizes are different at once on the electrode surface of a substrate.
SOLUTION: This multi-chip mounting method comprises following processes, that is, a process (1) for obtaining a plurality of adhesive-coated chips by forming film-shaped adhesive layer having an area which is almost the same as the size of the electrode formation face of the chip on the electrode surface of the chip by using a film-shaped adhesive layer made of hardening materials, a process (2) for making the electrodes of the plurality of adhesive-coated chips to be connected and the electrodes of a substrate face to each other, and for positioning them, and a process (3) for simultaneously applying heat and pressure to the electrodes of the plurality of chips and the electrodes of the substrate after those electrodes are positioned between the electrodes to be connected, and for obtaining the electric connection of the plurality of chips on the same substrate.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：通过在基板的电极表面上布置和安装尺寸不同的芯片来提供用于有效地制造MCM（多芯片模块）的多芯片安装方法。解决方案：该多芯片安装方法包括以下过程，即，通过形成具有与尺寸几乎相同的区域的膜状粘合剂层来获得多个粘合剂涂覆的芯片的方法（1）通过使用由硬化材料制成的膜状粘合剂层的芯片的电极表面上的芯片的电极形成面的制造方法，用于使多个粘合剂涂覆芯片的电极连接的工艺（2）和基板的电极彼此面对并且用于定位它们;以及工艺（3），其在这些电极位于电极之间同时对多个芯片的电极和基板的电极施加热和压力，以使其成为并且用于获得在相同基板上的多个芯片的电连接。版权所有（C）2007，JPO＆INPIT

40. 发明专利

JP2006077258A Filmy adhesive and adhesive member comprising the adhesive 审中-公开
标题翻译：胶粘剂和粘合剂包括粘合剂
公开(公告)号：JP2006077258A
公开(公告)日：2006-03-23
申请号：JP2005309928
申请日：2005-10-25
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TSUKAGOSHI ISAO , MATSUDA KAZUYA , KOBAYASHI KOJI , FUJINAWA MITSUGI
IPC分类号： C09J7/02 , C09J9/02 , C09J163/00 , C09J201/00 , C09J201/02
摘要： PROBLEM TO BE SOLVED: To provide a filmy adhesive having both of preservability and low-temperature rapid curability: and to provide an adhesive member using the adhesive.
SOLUTION: The filmy adhesive is obtained by encapsulating in microcapsules each of a curing agent and the first adhesive component most reactive with the curing agent in the reactive adhesive comprising two kinds or more adhesive components having reactivity with the curing agent. Preferably, the microcapsules are included in another adhesive component having reactivity with the curing agent less than that of the first adhesive. More preferably, the filmy adhesive has a bilayer structure obtained by forming a microcapsule-encapsulated curing agent-containing layer on one surface, and forming a layer containing the curing agent and the most reactive first adhesive component encapsulated in the microcapsules.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供具有保存性和低温快速固化性两者的胶粘剂，并提供使用该粘合剂的粘合剂构件。解决方案：胶粘剂通过将包含固化剂和在反应性粘合剂中与固化剂最具反应性的第一粘合剂组分包封在具有与固化剂的反应性的两种或更多种粘合剂组分的微胶囊中而获得。优选地，微胶囊包含在与固化剂的反应性小于第一粘合剂的粘合剂组分的另一粘合剂组分中。更优选地，膜状粘合剂具有通过在一个表面上形成含微胶囊包封的固化剂层而形成的双层结构，并且形成包含固化剂的层和包封在微胶囊中的最具反应性的第一粘合剂成分。版权所有（C）2006，JPO＆NCIPI

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