专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

31. 发明专利

JPH0566045A CONTROLLING METHOD FOR TEMPERATURE OF CONSTANT-TEMPERATURE AND CONSTANT-HUMIDITY APPARATUS 失效
公开(公告)号：JPH0566045A
公开(公告)日：1993-03-19
申请号：JP12089491
申请日：1991-05-27
申请人： HITACHI LTD , HITACHI SHIMIZU ENG KK
发明人： WATANABE HIROSHI , KAWAGUCHI YUSHI , SHIMIZU MASASHI
IPC分类号： F24F11/02
摘要： PURPOSE:To shorten a period of time until set temperature and humidity are stabilized by eliminating an overshoot or hunting of a wet bulb temperature particularly at the time of a high temperature and a high humidity in a constant-temperature and constant-humidity apparatus. CONSTITUTION:A heater 15 for a humidifier, a heater 17 for a heater, an evaporator and a blower are provided in a space partitioned by a heat insulator. There is provided a temperature regulator 2 for PiD-controlling an SSR 14 for a humidifier and an SSR 16 for a heater according to a deviation between a temperature and a humidity measured by a dry bulb sensor 3 and a wet bulb sensor 4 and temperature and humidity set values set at an apparatus controller 1 side.

32. 发明专利

JPH04322329A SYSTEM AND METHOD FOR INFORMATION PROCESSING COPYING WITH MANY MACHINE TYPES 失效
公开(公告)号：JPH04322329A
公开(公告)日：1992-11-12
申请号：JP9198091
申请日：1991-04-23
申请人： HITACHI LTD
发明人： KOIZUMI SHINOBU , KUSHIMA ICHIRO , WATANABE HIROSHI , JINNO TOSHIAKI , DOUMEN NOBUYOSHI
IPC分类号： G06F9/45 , G06F11/36
摘要： PURPOSE:To offer and object program form, which can realize the same execution performance as an object program peculiar to a machine time and is common to plural machine types or computers, and a machine language program generating system with respect to tj:me system or translation from a source program to a machine language program in an electronic computer. CONSTITUTION:A compiler 1001 translates a source program 1004 to an abstract object program (Arm Code) 1005 including an instruction word string of an abstract computer ARM having plural registers and the assigment instructions of abstract registers. An installer 1015 converts an Arm Code 1009 to a machine language program 1011 of an execution computer 1012 based on specification information 1010 of the execution computer 1012 consisting of register use designation 1019 and machine instruction selection rules 1020. Consequently, a machine language instruction string effectively using the registers of the execution computer is generated by optimization of abstract register use due to the compiler and the actual register assigning function of the installer, and high function instructions provided in the execution computer can be used by the instruction word string pattern substituting function of the installer.

33. 发明专利

JPH04315445A BONDING WIRE AND MANUFACTURE OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE USING SAME 失效
公开(公告)号：JPH04315445A
公开(公告)日：1992-11-06
申请号：JP8223891
申请日：1991-04-15
申请人： HITACHI LTD
发明人： WATANABE HIROSHI , OKIKAWA SUSUMU , MIKINO HIROSHI
IPC分类号： H01L21/60
摘要： PURPOSE:To secure anti-static effect and to enable continuous wire bonding by coating of the surface of a coated bonding wire with an anti-static agent. CONSTITUTION:A coated wire 1 used for a QFP package semiconductor integrated circuit device, which consists of an Au wire 2 that is the core, a polyurethane 3 as the coat insulating resin material for the Au wire 2, and an anti-static agent 4 which coats this polyurethane 3. Outer terminals of a semiconductor chips are wire-bonded to external connection leads by the coated wire 1, thereby manufacturing a semiconductor integrated circuit device.

34. 发明专利

JPH0364034A MANUFACTURE OF SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH0364034A
公开(公告)日：1991-03-19
申请号：JP20006989
申请日：1989-08-01
申请人： HITACHI LTD
发明人： IWATA YUTAKA , ICHITANI MASAHIRO , AKATOKI HITOSHI , WATANABE HIROSHI , MIKINO HIROSHI
IPC分类号： H01L21/56
摘要： PURPOSE:To obtain a semiconductor device having multi-stage outer leads accurately with low cost by arranging a dummy frame between two lead frames in a sandwich shape, molding the whole with resin then punching and cutting the whole with the dummy frame being sandwiched. CONSTITUTION:The dummy frame 13 of same material as upper and lower lead frames 11, 12 is sandwiched between the lead frames 11, 12 in a shape where nothing is formed in sections inner than the dam bars 11c, 12c of these lead frames, and the whole is molded with resin. The outer part of the resin- molded frame 1 is punched and cut, as required, with the dummy frame 13 being sandwiched, and the dummy frame 13 is pulled out. Since the dummy frame 13 supporting outer leads 11a, 12a on the outside of the resin frame 1 is interposed during the cutting operation, there is no possibility of shifted cutting, resulting in accurate punching.

35. 发明专利

JPH033308A IGNITION COIL FOR INTERNAL COMBUSTION ENGINE 失效
公开(公告)号：JPH033308A
公开(公告)日：1991-01-09
申请号：JP13606789
申请日：1989-05-31
申请人： HITACHI LTD , HITACHI AUTOMOTIVE ENG
发明人： ONARI TAKAHIDE , WATANABE HIROSHI , KIKUCHI KATSUHIKO
IPC分类号： H01F38/12
摘要： PURPOSE:To avoid the disconnection of a primary coil lead wire by burying the primary coil lead wire in a thermosetting resin such as epoxy resin etc. CONSTITUTION:Within the title ignition coil for internal combustion engine wherein a primary coil 2 and a secondary coil 4 are contained in a coil case 15 previously molded out of a thermoplastic synthetic resin 12 after connecting the terminal of the primary coil 2 to another primary terminal 8, a thermosetting synthetic resin 10 such as epoxy resin etc., is injected into the said coil case 15 to be thermoset and further after assembling component parts such as iron cores 13, 11, etc., into the coil part, the said ignition coil is exterior- molded out of the thermoplastic synthetic resin 12 such as polybutylene tetrapbthalate etc., a lead copper wire 8 of the primary coil 2 is buried in the epoxy resin 10 due to the shape of the primary terminal 8 to be electrically connected so that the copper wire 9 may be structured not to be buried in the exterior-molded resin 12. Through these procedures, the thermosetting synthetic resin 10 such as epoxy, etc., in small linear expansion coefficient can avoid the disconnection of the primary coil lead wire.

36. 发明专利

JPH02277251A METHOD AND APPARATUS FOR WIRE BONDING 失效
公开(公告)号：JPH02277251A
公开(公告)日：1990-11-13
申请号：JP9854989
申请日：1989-04-18
申请人： HITACHI LTD
发明人： WATANABE HIROSHI , OKIKAWA SUSUMU , MIKINO HIROSHI
IPC分类号： H01L21/60
摘要： PURPOSE:To enhance reliability of a bonding operation by a method wherein, when a covered wire is connected, it is held by using a fixation means provided with a contact face of a rough face with respect to an inner lead. CONSTITUTION:When a first part formed on a semiconductor chip 13 is connected to a second part on an inner lead 6 of a lead frame 11 by using a covered wire 21 to which an insulator 24 has been applied at the circumference of a metal wire 22, the covered wire is held by using a fixation means 7 provided with a contact face of a rough face with respect to an inner lead 7 when at least the covered wire 21 is bonded to the second part. As a result, it is possible to prevent a resonance, of the inner lead 6, which is caused by an ultrasonic oscillation from a bonding tool 20; accordingly, the covered film 24 of the covered wire 21 can be removed surely. Thereby, it is possible to sharply enhance bonding reliability at a wire bonding operation using the covered wire.

37. 发明专利

JPH02134838A RESIN-SEALED SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF AND APPARATUS FOR FORMING INTERMEDIATE LAYER USED THEREFOR 失效
公开(公告)号：JPH02134838A
公开(公告)日：1990-05-23
申请号：JP28923788
申请日：1988-11-16
申请人： HITACHI LTD , HITACHI MICROCUMPUTER ENG
发明人： WATANABE HIROSHI , TANIMOTO MICHIO , OKIKAWA SUSUMU , HONMA KIYOSHI , KANEDA TAKESHI , KOIKE SHUNJI , NISHIDA TAKAFUMI
IPC分类号： H01L21/60 , H01L21/56 , H01L21/607 , H01L23/29 , H01L23/31
摘要： PURPOSE:To avoid crackings in boundaries between resin for forming a package and component members such as a semiconductor chip and leads and avoid the breakage of a metal wire caused by the thermal stress of the package by a method wherein an intermediate layer made of insulating resin is provided between the metal wire and the package resin and the thermal expansion coefficient of the package resin is so controlled as not to exceed a specific value. CONSTITUTION:Outer terminals formed on a semiconductor chip 4 are connected to leads 6 drawn outside a package with metal wires 7 and their surrounding is molded from resin composition 5 to form a resin-sealed semiconductor device. It is provided with an intermediate layer made of insulating resin between the metal wire 7 and resin composition 5 of the semiconductor device and the thermal expansion coefficient of the resin composition is so controlled as not to exceed 10X10 / deg.C. For instance, the metal wire 7 is made of gold and the intermediate layer is composed of a first intermediate layer made of insulating resin composed of polyurethane containing component unit derived from terephthalic acid in its molecular frame by the reaction of polyol component and isocyanate and a second intermediate layer which is formed outside the first layer and made of fluorine resin or silicone resin having excellent releasing properties.

38. 发明专利

JPH01306958A INFORMATION EXPRESSING METHOD AND DOCUMENT PROCESSING SYSTEM 失效
公开(公告)号：JPH01306958A
公开(公告)日：1989-12-11
申请号：JP13752688
申请日：1988-06-06
申请人： HITACHI LTD
发明人： WATANABE TOSHINORI , HAYASHI SHINICHI , INO KOICHIRO , MORI FUMIHIKO , WATANABE HIROSHI
IPC分类号： G06F17/21
摘要： PURPOSE:To make duplex management of information in which documents are prepared by using paper for humans and floppy disks are used and mechanical codes of the documents are kept for machines unnecessary by preparing documents containing texts and graphics by using information which is visible to humans and information which is hardly visible to humans, but readable by machines. CONSTITUTION:A text 200 and graphic 210 which are visible by humans are described on a document 160 and, at the same time, information described with magnetized ink which is transparent or has the same color as the surface color of the paper 160 so that a machine can read the information is also recorded on the paper 160. Therefore, when, for example, the code 2-7 for machine is implicitly displayed on the display of the English word 'HOUSE' which is the visible information for humans by a concealing method, numerous codes for machine are repeatedly displayed in the area where the word 'HOUSE' is displayed. Even when, for example, the part 'HO' of the 'HOUSE' becomes stained, the word 'HOUSE' can be restored easily on a computer if even one of the codes for machine is left in a readable state in the remaining part. Therefore, duplex information management becomes unnecessary.

39. 发明专利

JPH01298422A METHOD AND DEVICE FOR CONTROLLING STOP OF POWER SOURCE OF PROCESSOR 失效
公开(公告)号：JPH01298422A
公开(公告)日：1989-12-01
申请号：JP12849288
申请日：1988-05-27
申请人： HITACHI LTD , HITACHI INF & CONTROL SYST , HESCO
发明人： TANJI MASAYUKI , MIYAZAKI YOSHIHIRO , TAKAHASHI YOSHIAKI , MORIOKA TAKAYUKI , WATANABE HIROSHI , NOUCHI TAKAO , ONO HARUMICHI , NAKAMURA TOMOAKI , MIYAMOTO KAZUYA
IPC分类号： G06F1/26 , G06F1/00
摘要： PURPOSE:To prevent the trouble generation from occurring even when a power source is interrupted by mistake by providing a first timer activated by a power source interruption request to a power source control device and a second timer to count a set time longer than this. CONSTITUTION:When the interruption of a power source is instructed by a switch 13, a power source control device 12 outputs an interrupting request signal 6 to a processor 10, starts the counting of timers 1 and 2, the system program of the processor 10 turns on a power source interrupting suppressing request signal 8 and the shut-down processing is started. A control circuit 4, when a suppressing signal 8 is turned off, or a timer 1 times up while the suppressing signal 8 is not inputted or a timer 2 times up regardless of the suppressing signal 8, executes the power source interruption. Thus, an operating system, while the processing necessary for the power source interruption is completed, can suppress the power source interruption and the destruction of the file does not occur.

40. 发明专利

JPH01265147A METHOD AND DEVICE FOR CONTROLLING FEED WATER OF THERMO-HYGROSTAT 失效
公开(公告)号：JPH01265147A
公开(公告)日：1989-10-23
申请号：JP9353988
申请日：1988-04-18
申请人： HITACHI LTD
发明人： WATANABE HIROSHI , KATSUMATA NAOTO , HAYASHIDA TATSUO
IPC分类号： G01N25/62 , B01L7/04 , G01N25/64 , G05D9/12
摘要： PURPOSE:To prevent the disturbance of water temp. by intermittently operating a motor-operated pump when the water level in a sensor tray lowers down to a prescribed water level or below, thereby preventing the inflow of makeup water at one time. CONSTITUTION:Since the sensor tray 6 is filled with water at the point of the time t0, a float switch 42 is opened and a relay contact is held open. The switch 42 is closed when the water level in the sensor tray 6 lowers. The relay contact is intermittently closed at each time t1 in a period t2 while the switch 42 is held closed. The energization pattern of the motor-operated pump 32 is determined like C. The inflow of a large volume of the water at one time into the sensor tray 6 is obviated if the pump is energized in such a manner. Since the water is poured for several seconds, the abrupt change of the water temp. in the sensor tray 6 does not arise.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式