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    • 32. 发明专利
    • MANUFACTURE OF INK JET PRINT HEAD
    • JPH1128821A
    • 1999-02-02
    • JP18552397
    • 1997-07-10
    • HITACHI KOKI KK
    • WATANABE KEIJITAMAHASHI KUNIHIRO
    • B41J2/16B41J2/015
    • PROBLEM TO BE SOLVED: To join at low temperature, and control readily the extrusion of joint layers in an ink passage by employing any one of Ag or Au, Pt, Pd in a sheet plate forming an ink passage, and taking the sheet plate itself as joint layers. SOLUTION: An orifice plate and a restrictor plate are manufactured with ink passage forming patterns formed by press punching an Ag plate 5 being rolled preliminarily into a predetermined thickness. Also, a diaphragm plate and filter plate are made into ink passage forming plates by forming in advance ink passage forming patterns on the readily separable substrate and forming Ag thereon by a plating method to subsequently be separated from the substrate. Next, the joint surfaces 9, 9 are faced to be positioned, and each plate is tentatively fastened by a spot welding method in order of the orifice plate, restrictor plate, diaphragm plate, and filter plate. Then, these plats are set in a furnace to be cooled before being subjected to heat-compression in the atmosphere.
    • 39. 发明专利
    • BONDING METHOD FOR INK JET PRINTING HEAD
    • JPH06286148A
    • 1994-10-11
    • JP7691793
    • 1993-04-02
    • HITACHI KOKI KK
    • HORINO MASAYAKONO AKIOMIWATANABE KEIJITAMAHASHI KUNIHIROFURUYA YUJIHISAGAI KENICHI
    • B41J2/16
    • PURPOSE:To obtain a bonding part superior in corrosion resistance without giving a large thermal damage to an object to be bonded by a method wherein three-ply metallized layers of Au, Sn, and Au are disposed on the surfaces of two alloy members forming a head, both the alloy members are made to adhere to each other with the metallized layers in between, and the metallized layers are melted. CONSTITUTION:A plurality of alloy members 101, 111 form an ink jet printing head. When the first surface of the first alloy member 101 is bonded to the second surface of the second alloy member 111, three-ply metallized layers of Au as first metallized plies 103, 107, Sn as second metallized plies 104, 108, and Au as third metallized plies 105, 109 are provided in this order from the matrixes on at least one of the first and second surfaces. The first surface is disposed opposedly to the second surface. After the relative position of the first surface and the second surface is adjusted, the both are made to adhere to each other. The three-ply metallized layers are heated to a temperature of 553 deg.K or higher to be melted without melting both the members 101, 111 to bond both the alloy members.