专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

21. 发明专利

JP2002514717A 失效
公开(公告)号：JP2002514717A
公开(公告)日：2002-05-21
申请号：JP2000548627
申请日：1999-05-08
IPC分类号： B81B3/00 , F15C5/00 , F16K31/02 , F16K99/00

22. 发明专利

JP2002039439A CONNECTING STRUCTURE OF COMPONENT AND MICRO TUBE 审中-公开
公开(公告)号：JP2002039439A
公开(公告)日：2002-02-06
申请号：JP2001202577
申请日：2001-07-03
申请人： COMMISSARIAT ENERGIE ATOMIQUE
发明人： CHARLES RAYMOND , FOUILLET YVES
IPC分类号： F16L3/08 , F15C5/00 , F16K99/00 , F16L19/028 , F16L41/08
摘要： PROBLEM TO BE SOLVED: To provide a connecting structure capable of being easily and surely demounted. SOLUTION: A ring or a joint 3 having the toroidal shape or the other shape, and an end of a tube 1 integrated with an external flange 2 are included in a recessed part 12 between a main component part 8 and a collar 9. Here, a thickness of the flange 2 becomes 0 at a position of a crushed swelled part 4 of the sealing ring 3. Whereby the superior seal can be obtained even to high-pressure fluid, and assembled components can be easily disassembled at the position.

23. 发明专利

JP2002503331A 失效
公开(公告)号：JP2002503331A
公开(公告)日：2002-01-29
申请号：JP52148197
申请日：1996-12-05
IPC分类号： G01N37/00 , B01F5/04 , B01F13/00 , B01J19/00 , B01L3/00 , B01L3/02 , B01L7/00 , B29C59/14 , F15C1/00 , F15C5/00 , F16K99/00 , G01N11/10 , G01N15/00 , G01N21/07 , G01N21/27 , G01N21/64 , G01N27/416 , G01N27/447 , G01N30/20 , G01N30/32 , G01N30/60 , G01N31/20 , G01N33/487 , G01N33/49 , G01N35/00

24. 发明专利

JP2000510548A 失效
公开(公告)号：JP2000510548A
公开(公告)日：2000-08-15
申请号：JP54873098
申请日：1998-04-28
IPC分类号： F04B43/02 , F04B43/04 , F15C5/00 , F16K99/00
摘要： A method of producing a pump body having an inlet opening provided with an inlet valve (106) and an outlet opening provided with an outlet valve (108), said method comprising as a first step the step of structuring a respective first main surface of a first and of a second semiconductor disc (200) for defining a valve flap structure (202) of the inlet valve and a valve seat structure (204) of the outlet valve in the first disc and a valve flap structure of the outlet valve and a valve seat structure of the inlet valve in the second disc. Following this, a valve flap well structure (206; 216) and a valve opening well structure (208; 218) are formed in a predetermined relationship with the valve flap structures and the valve seat structures in a respective second main surface of the first and of the second semiconductor disc. The first main surfaces of said first and second semiconductor discs are connected in such a way that the respective valve flap structure is arranged in a predetermined relationship with a respective valve seat structure. Finally, the respective second main surface of said first and of said second semiconductor disc is etched at least in the area of the valve flap well structure and of the valve opening well structure so as to expose the valve flaps and open the valve seats.

25. 发明专利

JP2000507681A 失效
公开(公告)号：JP2000507681A
公开(公告)日：2000-06-20
申请号：JP52421497
申请日：1997-11-13
IPC分类号： F16K31/02 , B81B3/00 , F15C3/04 , F15C5/00 , F16K31/00 , F16K99/00 , H01L41/09

26. 发明专利

JPH11153606A BURET CHIP 失效
公开(公告)号：JPH11153606A
公开(公告)日：1999-06-08
申请号：JP26264698
申请日：1998-09-17
申请人： METROHM AG
发明人： ZAEHNER PAUL
IPC分类号： G01N1/00 , B01L3/02 , F15C5/00 , F16K15/14 , F16K99/00 , G01N35/10
摘要： PROBLEM TO BE SOLVED: To provide the buret chip for liquid titration which is hardly mechanically damaged, simple, and economically manufactured. SOLUTION: The buret chip 1 for measuring a titrant consists essentially of a film 2 and a buret main body 10 having a seat 3 for the film. The buret chip 1 has covers 4 and 5 for protecting the film 2 and seat 3 against mechanical damage and the covers surround and cover the films 2 and seat 3 at least partially. The film 2 is clamped between the buret main body 10 and a cover component 5 and held in the buret main body 10.

27. 发明专利

JP2708395B2 失效
公开(公告)号：JP2708395B2
公开(公告)日：1998-02-04
申请号：JP25803595
申请日：1995-10-04
IPC分类号： B23K26/00 , C23F1/00 , F15C3/04 , F15C5/00 , F16K31/00 , F16K31/02 , F16K31/12 , F16K99/00 , G02B3/00 , G02B3/14 , G02B6/36 , G05D7/01 , G05D16/20 , H01L21/302 , H01L21/306 , H01L29/84 , H01L49/00

28. 发明专利

JP2636965B2 失效
公开(公告)号：JP2636965B2
公开(公告)日：1997-08-06
申请号：JP50519692
申请日：1991-11-22
申请人： INFUYUSETSUDO INC
发明人： ORIIBU PIITAA
IPC分类号： F16K17/28 , A61M5/142 , A61M5/168 , A61M5/175 , F15C5/00 , F16K99/00 , G05D7/01

29. 发明专利

JPH08226563A SEMICONDUCTOR DEVICE AND ITS MANUFACTURE 失效
公开(公告)号：JPH08226563A
公开(公告)日：1996-09-03
申请号：JP25803595
申请日：1995-10-04
申请人： UNIV LELAND STANFORD JUNIOR
发明人： MAAKU ZUDEBURITSUKU
IPC分类号： B23K26/00 , C23F1/00 , F15C3/04 , F15C5/00 , F16K31/00 , F16K31/02 , F16K31/12 , F16K99/00 , G02B3/00 , G02B3/14 , G02B6/36 , G05D7/01 , G05D16/20 , H01L21/302 , H01L21/306 , H01L29/84 , H01L49/00
摘要： PROBLEM TO BE SOLVED: To allow easy manufacture and improve reliability by using a plurality of semiconductor substrates in construction, heating or cooling a material as a heating means for a second semiconductor substrate to control the deflection of a flexible wall, and controlling a hole defined by a space to seal ring faces formed on the second and third semiconductor substrates to control a fluid. SOLUTION: Three first, second and third semiconductor substrates 12, 22, 30 are used in construction and a material is heated or cooled by a heating means provided on the second semiconductor substrate 22 for controlling the deflection of the wall of a flexible thin film 18. A hole defined by a space between the wall of the flexible thin film 18 of the second semiconductor substrate 22 and a seal ring face 28 formed on the third semiconductor substrate 30 is controlled to control a fluid. In this way, a small device can be easily and highly precisely obtained in all photolithographic processes.

30. 发明专利

JPH0826886B2 失效
公开(公告)号：JPH0826886B2
公开(公告)日：1996-03-21
申请号：JP23991787
申请日：1987-09-24
申请人： RIIRANDO SUTANFUOODO JUNIA UNIV
发明人： MAAKU ZUDEBURITSUKU
IPC分类号： B23K26/00 , C23F1/00 , F15C3/04 , F15C5/00 , F16K31/00 , F16K31/02 , F16K31/12 , F16K99/00 , G02B3/00 , G02B3/14 , G02B6/36 , G05D7/01 , G05D16/20 , H01L21/302 , H01L21/306 , H01L29/84 , H01L49/00

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式